ClassID:

42755

B23K1/018 - CPC Classification

Classification description:

Soldering, e.g. brazing, or unsoldering Unsoldering; Removal of melted solder or other residues

Recent Application in this class:
#1
20260026387
2026-01-22

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS

#2
20250269449
2025-08-28

STIRRING AND SEPARATING DEVICE FOR HIGH-VALUE COMPONENTS OF WASTE PCB AND CONTROL METHOD THEREOF

#3
20250218830
2025-07-03

COMPONENT PROCESSING APPARATUS

#4
20250022838
2025-01-16

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS

#5
20240408701
2024-12-12

WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD

#6
20240321816
2024-09-26

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS

#7
20240297144
2024-09-05

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS

#8
20240286229
2024-08-29

REMOVABLE STOP-OFF MATERIAL FOR BRAZING

#9
20240213214
2024-06-27

Substrate debonding from bonded part

#10
20240189932
2024-06-13

SMART DESOLDERING DEVICE AND METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK DRIVEN BY ARTIFICIAL INTELLIGENCE

#11
20240165726
2024-05-23

Composite Soldering, De-Soldering Station and System

#12
20230371221
2023-11-16

Liquid metal infiltration rework of electronic assembly

#13
20230249273
2023-08-10

CONTROL ASSEMBLY FABRICATION VIA BRAZING

#14
20230017361
2023-01-19

SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, PART MOUNTING DEVICE, AND PRODUCTION SYSTEM

#15
20220354034
2022-11-03

ROTATIONAL REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PRINTED WIRE BOARDS USING LIQUID HEAT MEDIA

#16
20220347779
2022-11-03

HEATING DEVICE

#17
20220310551
2022-09-29

Semiconductor manufacturing apparatus

#18
20220232746
2022-07-21

Liquid metal infiltration rework of electronic assembly

#19
20220203471
2022-06-30

PRODUCT REMOVING METHOD, FLUX REMOVING METHOD, AND PRODUCT REMOVING APPARATUS

#20
20220189908
2022-06-16

Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications

#21
20220167536
2022-05-26

Systems and methods for removing an adhesively-attached component from a circuit board assembly

#22
20220105582
2022-04-07

Control assembly fabrication via brazing

#23
20210291287
2021-09-23

Personalized copper block for selective solder removal

#24
20210252621
2021-08-19

Solder removal from semiconductor devices

#25
20210144863
2021-05-13

Method for discharging fluid

#26
20210120713
2021-04-22

Liquid metal infiltration rework of electronic assembly

#27
20210120712
2021-04-22

Localized rework using liquid media soldering

#28
20210114126
2021-04-22

Liquid metal infiltration rework of electronic assembly

#29
20200198039
2020-06-25

Cleaning pad assembly

#30
20200156168
2020-05-21

Soldering Device, Soldering System And Method

#31
20200147709
2020-05-14

Apparatus for automatically clearing residual solder paste with a gas channel in the working platform bearing a solder paste tub

#32
20200061730
2020-02-27

HEATING DEVICE

#33
20200037479
2020-01-30

Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

#34
20190247943
2019-08-15

Solder removal from semiconductor devices

#35
20190140365
2019-05-09

Electrical connector and manufacturing method thereof

#36
20190061034
2019-02-28

Solder removal from semiconductor devices

#37
20190047066
2019-02-14

Composite soldering, de-soldering station and system

#38
20180233483
2018-08-16

Gallium liquid metal embrittlement for device rework

#39
20180233482
2018-08-16

Gallium liquid metal embrittlement for device rework

#40
20180193937
2018-07-12

Controller and a control method for a hot air blower

#41
20180190609
2018-07-05

Ball grid array rework

#42
20180185945
2018-07-05

Solder paste misprint cleaning

#43
20180185944
2018-07-05

Solder paste misprint cleaning

#44
20180161903
2018-06-14

Vacuum pick-up confirmation system

#45
20180126497
2018-05-10

Self-heating solder flux material

#46
20180104758
2018-04-19

PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN

#47
20180056459
2018-03-01

Method of tight crack braze repair using acoustics

#48
20180036819
2018-02-08

Cleaning Pad Assembly

#49
20170352640
2017-12-07

Removal apparatuses for semiconductor chips

#50
20170348785
2017-12-07

Solder paste misprint cleaning

#51
20170348784
2017-12-07

Solder paste misprint cleaning

#52
20170239742
2017-08-24

Device and method for recovering tin-lead solder from scrap

#53
20170223882
2017-08-03

Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

#54
20170209903
2017-07-27

Solder cleaning system

#55
20170148762
2017-05-25

Method for semiconductor die removal rework

#56
20170135258
2017-05-11

Recovery of Components from Electronic Waste

#57
20170135257
2017-05-11

APPARATUS, METHODS, AND SYSTEMS FOR REMOVING COMPONENTS FROM A CIRCUIT BOARD

#58
20170135254
2017-05-11

Shielding cover mounting and dismounting apparatus

#59
20170125374
2017-05-04

Rework process and tool design for semiconductor package

#60
20170056996
2017-03-02

Desoldering apparatus and method

#61
20170044903
2017-02-16

ROTATING COMPONENT FOR A TURBOMACHINE AND METHOD FOR PROVIDING COOLING OF A ROTATING COMPONENT

#62
20160250704
2016-09-01

Device for the separate application of connecting material deposits

#63
20160225735
2016-08-04

Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods

#64
20160197053
2016-07-07

Ball grid array rework

#65
20160175959
2016-06-23

Desoldering tool and control system

#66
20160175958
2016-06-23

Desoldering tool nozzle and method of manufacturing the nozzle

#67
20160088780
2016-03-24

Sensor-based removal of a soldered device

#68
20160082536
2016-03-24

Solder recovery unit

#69
20160044795
2016-02-11

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

#70
20160007515
2016-01-07

Ball grid array rework

#71
20160007457
2016-01-07

Ball grid array rework

#72
20150322545
2015-11-12

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

#73
20150322540
2015-11-12

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

#74
20150321279
2015-11-12

APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT

#75
20150264847
2015-09-17

System and method for extracting electronic components

#76
20150237774
2015-08-20

System and method for extracting components

#77
20150208515
2015-07-23

Flux management system and method for a wave solder machine

#78
20150179601
2015-06-25

Removal apparatuses for semiconductor chips

#79
20150089802
2015-04-02

System for removing an electronic component from a substrate

#80
20150068363
2015-03-12

Solder recovery unit

#81
20140355162
2014-12-04

Control device for a vehicle

#82
20140217157
2014-08-07

REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PRINTED WIRE BOARDS USING LIQUID HEAT MEDIA

#83
20140191019
2014-07-10

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

#84
20140034716
2014-02-06

Hot bar soldering

#85
20140034715
2014-02-06

Vacuum reflow voiding rework system

#86
20140034708
2014-02-06

Solar cell pad dressing

#87
20140001291
2014-01-02

Component rework nozzle

#88
20130284707
2013-10-31

Apparatus of mounting and removing component, method of mounting component and method of removing component

#89
20130233832
2013-09-12

Implementing selective rework for chip stacks and silicon carrier assemblies

#90
20130162280
2013-06-27

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

#91
20130008020
2013-01-10

Removal apparatuses for semiconductor chips

#92
20120266459
2012-10-25

Method for removing an electronic component from a substrate

#93
20120241116
2012-09-27

Removing material from defective opening in glass mold

#94
20120186771
2012-07-26

Removing material from defective opening in glass mold and related glass mold for injection molded solder

#95
20120118940
2012-05-17

Universal radio frequency shield removal

#96
20120031566
2012-02-09

Removing and segregating components from printed circuit boards

#97
20120008284
2012-01-12

Repair apparatus and method for circuit board assembly

#98
20120006803
2012-01-12

Implementing selective rework for chip stacks and silicon carrier assemblies

#99
20110296677
2011-12-08

Rework soldering jig

#100
20110277268
2011-11-17

Device for removing adhered substances

#101
20110272451
2011-11-10

Method and apparatus for removing contaminants from a reflow apparatus

#102
20110240720
2011-10-06

REPAIR APPARATUS AND METHOD FOR ELECTRONIC COMPONENT AND HEAT-TRANSFER CAP

#103
20110240718
2011-10-06

Universal radio frequency shield removal

#104
20110240716
2011-10-06

Methods for rework of a solder

#105
20110168761
2011-07-14

APPARATUS FOR REPAIRING SEMICONDUCTOR MODULE

#106
20110079635
2011-04-07

REMOVAL OF BRAZED METAL SHEETS

#107
20100307292
2010-12-09

Method of regulating nickel concentration in lead-free solder containing nickel

#108
20100252613
2010-10-07

DESOLDERING DEVICE AND ATTACHMENT THEREOF

#109
20100181295
2010-07-22

Method and device for removing solder material deposits from a substrate

#110
20100127050
2010-05-27

Methods and apparatus for efficiently generating profiles for circuit board work/rework

#111
20100044417
2010-02-25

Deconstructable assembly and method

#112
20100031499
2010-02-11

Apparatus for the reworking of a microwave module

#113
20090289100
2009-11-26

Method and apparatus for rework soldering

#114
20090179020
2009-07-16

Removing material from defective opening in glass mold

#115
20090179019
2009-07-16

REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD

#116
20090166397
2009-07-02

BGA PACKAGE MODULE DESOLDERING APPARATUS AND METHOD

#117
20090065557
2009-03-12

Selective rework apparatus for surface mount components

#118
20090045245
2009-02-19

Solder repairing apparatus and method of repairing solder

#119
20090014873
2009-01-15

Electronic device and manufacturing method

#120
20080295686
2008-12-04

Method and apparatus for removing contaminants from a reflow apparatus

#121
20080169337
2008-07-17

De-soldering tool

#122
20080156789
2008-07-03

PLATEN FOR USE WITH A THERMAL ATTACH AND DETACH SYSTEM WHICH HOLDS COMPONENTS BY VACUUM SUCTION

#123
20080029580
2008-02-07

Methods and apparatus for efficiently generating profiles for circuit board work/rework

#124
20070251981
2007-11-01

Selective rework process and apparatus for surface mount components

#125
20070223148
2007-09-27

Device with ESD protection utilizing a shorting material between electrical pads or leads which are shorted then unshorted by severing the shorting material and then recreating the short by reapplying the shorting material

#126
20070057024
2007-03-15

Method and apparatus for removing known good die

#127
20060273141
2006-12-07

Heating apparatus

#128
20060200965
2006-09-14

Method for separating electronic component from organic board

#129
20060196912
2006-09-07

METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT

#130
20060191977
2006-08-31

Desoldering sheath

#131
20060186172
2006-08-24

Lead free desoldering braid

#132
20060131360
2006-06-22

Thermal attach and detach methods and system for surface-mounted components

#133
20060091182
2006-05-04

Repair of braze joint and article repaired

#134
20060081680
2006-04-20

Desoldering wick for lead-free solder

#135
20060076388
2006-04-13

Method and apparatus for mounting and removing an electronic component

#136
20060054657
2006-03-16

Method and apparatus for de-soldering integrated circuit devices

#137
20060044702
2006-03-02

Repeatable ESD protection utilizing a process for unshorting a first shorting material between electrical pads and reshorting by recreating the short

#138
20060037188
2006-02-23

Method for removing a magnetic head slider

#139
20060012918
2006-01-19

Method of removing lead-free solder from slider pad and magnetic disk drive

#140
20050262687
2005-12-01

Solder extraction tool and method

#141
20050247762
2005-11-10

Crevice corrosion-resistant liquid-cooled armature bar clip-to-strand connection and related method

#142
20050218197
2005-10-06

Solder heating system

#143
20050205643
2005-09-22

Desoldering sheath

#144
20050171802
2005-08-04

Method for reworking a microwave module

#145
20050112284
2005-05-26

Desoldering systems and processes

#146
20050087588
2005-04-28

Vertical removal of excess solder from a circuit substrate

#147
20050082352
2005-04-21

Die removal method and apparatus

#148
14609139
2018-02-13

SMT DIMM connector auto safe remove nozzle

#149
14218557
2015-11-10

Method of and system for dressing RF shield pads

#150
13946722
2015-11-10

Hot bar soldering

#151
13912982
2016-03-01

Vacuum reflow voiding rework system