42756 ⎘
Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
Brazing Apparatus and Assembly-Brazing Method
#2BONDING OF STRUCTURES USING HIGH INTENSITY FOCUSED ULTRASOUND (HIFU)
#3BRAZE PRODUCT INCLUDING ADDITIVE PARTICLES AND METHODS OF BRAZING
#4BRAZING JOINT, BRAZING METHOD AND DEVICE, FOR PROMOTING SOLDER RHEOLOGY AND GAS OVERFLOW
#5Method and device for liquid spray soldering and the application method thereof
#6Soldering Leads to Pads in Producing Basket Catheter
#7METHOD FOR BONDING FLEXIBLE ELECTRONIC CIRCUIT ELEMENTS
#8METHOD FOR SUPPLYING OR REMOVING SLIDING PROCESS MATERIAL TO/FROM SURFACE OF OBJECT TO BE SLID
#9METHOD OF CONNECTION TO A CONDUCTIVE MATERIAL
#10Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
#11Ultrasonic-assisted solder transfer
#12METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOLDER THAT HAS BEEN TEMPORARILY SECURED
#13SOLDERING ASSEMBLY, METHOD AND USE
#14Method of vertically vibrating a bonding arm
#15METHOD OF JOINING A NIOBIUM TITANIUM ALLOY BY USING AN ACTIVE SOLDER
#16Electric wire connection structure
#17Ultrasonic processing system, booster and method
#18Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
#19Exothermic welding apparatus and exothermic welding method
#20Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit
#21Techniques for joining one or more structures of an electronic device
#22VACUUM INSULATED GLASS UNIT WITH GLASS-TO-METAL SEAL AND METHODS OF ASSEMBLING SAME
#23Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
#24WIRE BONDING APPARATUS
#25Wire bonding apparatus and wire bonding method
#26Method of joining a surface-mount component to a substrate with solder that has been temporarily secured
#27Method of tight crack braze repair using acoustics
#28Method for producing a disk with an electrically conductive coating and a metal strip which is soldered onto the disk; and corresponding disk
#29Multi-strike process for bonding packages and the packages thereof
#30Soldering Device Minimizing Voids When Soldering Printed Circuit Boards
#31LIQUID PHASE BONDING OF A SILICON OR SILICON CARBIDE COMPONENT TO ANOTHER SILICON OR SILICON CARBIDE COMPONENT
#32Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit
#33Techniques for joining one or more structures of an electronic device
#34Bonding apparatus
#35FLUX-LESS DIRECT SOLDERING BY ULTRASONIC SURFACE ACTIVATION
#36Method for ultrasonic welding with particles trapping
#37Contacting of electrochromic devices
#38Hermetically sealed electronic device using solder bonding
#39Electroconductive bonding material
#40Elimination of tool adhesion in an ultrasonic welding process
#41Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method
#42MANUFACTURING METHOD FOR A SHIELD CONDUCTOR
#43Device for torsionally welding metal parts by means of ultrasound
#44Device for dispensing and distributing flux-free solder on a substrate
#45Welding horn for secondary battery
#46Stud bump bonding in implantable medical devices
#47Reflow film, solder bump formation method, solder joint formation method, and semiconductor device
#48Pane comprising an electrical connection element
#49Method and apparatus for dispensing flux-free solder on a substrate
#50Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects
#51Device for bonding flexible PCB to camera module
#52Disc comprising an electrical connection element
#53Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit
#54Methods and systems involving soldering
#55BATTERY TAB JOINTS AND METHODS OF MAKING
#56METHOD AND DEVICE FOR INTRODUCING SOLDER ONTO A WORKPIECE
#57Method and apparatus for applying solder to a work piece
#58Transfer device for receiving and transferring a solder ball arrangement
#59Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects
#60Soldering method and soldering apparatus
#61Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration
#62Ultrasonic brazing of aluminum alloy and aluminum matrix composite
#63Method of manufacturing an electronic component and an electronic device
#64Method of mounting an electronic component and mounting apparatus
#65Deep access large ribbon bond head
#66Resonator, ultrasonic head, and ultrasonic bonder using the same
#67Resonator, ultrasonic head, and ultrasonic bonder using the same
#68Ultrasonic tool and ultrasonic bonder
#69Resonator, ultrasonic head, and ultrasonic bonder using the same
#70METHOD OF MITIGATING VOIDS DURING SOLDER REFLOW
#71System and method for forming solder joints
#72Ultrasonic tool and ultrasonic bonder
#73Method and apparatus for conductive ball bonding of components
#74Method of mounting electronic part and flux-fill
#75Multi-strike process for bonding