ClassID:

42756

B23K1/06 - CPC Classification

Classification description:

Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations

Recent Application in this class:
#1
20260070139
2026-03-12

Brazing Apparatus and Assembly-Brazing Method

#2
20250353092
2025-11-20

BONDING OF STRUCTURES USING HIGH INTENSITY FOCUSED ULTRASOUND (HIFU)

#3
20250144750
2025-05-08

BRAZE PRODUCT INCLUDING ADDITIVE PARTICLES AND METHODS OF BRAZING

#4
20240139847
2024-05-02

BRAZING JOINT, BRAZING METHOD AND DEVICE, FOR PROMOTING SOLDER RHEOLOGY AND GAS OVERFLOW

#5
20230278126
2023-09-07

Method and device for liquid spray soldering and the application method thereof

#6
20230211118
2023-07-06

Soldering Leads to Pads in Producing Basket Catheter

#7
20220329029
2022-10-13

METHOD FOR BONDING FLEXIBLE ELECTRONIC CIRCUIT ELEMENTS

#8
20220234073
2022-07-28

METHOD FOR SUPPLYING OR REMOVING SLIDING PROCESS MATERIAL TO/FROM SURFACE OF OBJECT TO BE SLID

#9
20220219254
2022-07-14

METHOD OF CONNECTION TO A CONDUCTIVE MATERIAL

#10
20210257330
2021-08-19

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

#11
20210229203
2021-07-29

Ultrasonic-assisted solder transfer

#12
20210082868
2021-03-18

METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOLDER THAT HAS BEEN TEMPORARILY SECURED

#13
20210060676
2021-03-04

SOLDERING ASSEMBLY, METHOD AND USE

#14
20200388590
2020-12-10

Method of vertically vibrating a bonding arm

#15
20200164452
2020-05-28

METHOD OF JOINING A NIOBIUM TITANIUM ALLOY BY USING AN ACTIVE SOLDER

#16
20200136277
2020-04-30

Electric wire connection structure

#17
20200086586
2020-03-19

Ultrasonic processing system, booster and method

#18
20190319005
2019-10-17

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

#19
20190143446
2019-05-16

Exothermic welding apparatus and exothermic welding method

#20
20190071920
2019-03-07

Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit

#21
20190025874
2019-01-24

Techniques for joining one or more structures of an electronic device

#22
20180305972
2018-10-25

VACUUM INSULATED GLASS UNIT WITH GLASS-TO-METAL SEAL AND METHODS OF ASSEMBLING SAME

#23
20180240774
2018-08-23

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

#24
20180151532
2018-05-31

WIRE BONDING APPARATUS

#25
20180090464
2018-03-29

Wire bonding apparatus and wire bonding method

#26
20180082975
2018-03-22

Method of joining a surface-mount component to a substrate with solder that has been temporarily secured

#27
20180056459
2018-03-01

Method of tight crack braze repair using acoustics

#28
20170274464
2017-09-28

Method for producing a disk with an electrically conductive coating and a metal strip which is soldered onto the disk; and corresponding disk

#29
20170194278
2017-07-06

Multi-strike process for bonding packages and the packages thereof

#30
20170072491
2017-03-16

Soldering Device Minimizing Voids When Soldering Printed Circuit Boards

#31
20170056994
2017-03-02

LIQUID PHASE BONDING OF A SILICON OR SILICON CARBIDE COMPONENT TO ANOTHER SILICON OR SILICON CARBIDE COMPONENT

#32
20170002602
2017-01-05

Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit

#33
20160342179
2016-11-24

Techniques for joining one or more structures of an electronic device

#34
20160284662
2016-09-29

Bonding apparatus

#35
20160256948
2016-09-08

FLUX-LESS DIRECT SOLDERING BY ULTRASONIC SURFACE ACTIVATION

#36
20160193678
2016-07-07

Method for ultrasonic welding with particles trapping

#37
20160161818
2016-06-09

Contacting of electrochromic devices

#38
20160059339
2016-03-03

Hermetically sealed electronic device using solder bonding

#39
20160010179
2016-01-14

Electroconductive bonding material

#40
20150375334
2015-12-31

Elimination of tool adhesion in an ultrasonic welding process

#41
20150129648
2015-05-14

Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method

#42
20150008252
2015-01-08

MANUFACTURING METHOD FOR A SHIELD CONDUCTOR

#43
20150008250
2015-01-08

Device for torsionally welding metal parts by means of ultrasound

#44
20150008249
2015-01-08

Device for dispensing and distributing flux-free solder on a substrate

#45
20140299652
2014-10-09

Welding horn for secondary battery

#46
20140254124
2014-09-11

Stud bump bonding in implantable medical devices

#47
20140252607
2014-09-11

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

#48
20140170913
2014-06-19

Pane comprising an electrical connection element

#49
20140008421
2014-01-09

Method and apparatus for dispensing flux-free solder on a substrate

#50
20130320071
2013-12-05

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

#51
20130221067
2013-08-29

Device for bonding flexible PCB to camera module

#52
20130043066
2013-02-21

Disc comprising an electrical connection element

#53
20120279170
2012-11-08

Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit

#54
20120205424
2012-08-16

Methods and systems involving soldering

#55
20120000964
2012-01-05

BATTERY TAB JOINTS AND METHODS OF MAKING

#56
20110272453
2011-11-10

METHOD AND DEVICE FOR INTRODUCING SOLDER ONTO A WORKPIECE

#57
20110204126
2011-08-25

Method and apparatus for applying solder to a work piece

#58
20100213243
2010-08-26

Transfer device for receiving and transferring a solder ball arrangement

#59
20100050423
2010-03-04

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

#60
20100006624
2010-01-14

Soldering method and soldering apparatus

#61
20090031558
2009-02-05

Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration

#62
20090020589
2009-01-22

Ultrasonic brazing of aluminum alloy and aluminum matrix composite

#63
20080206587
2008-08-28

Method of manufacturing an electronic component and an electronic device

#64
20080203138
2008-08-28

Method of mounting an electronic component and mounting apparatus

#65
20080073407
2008-03-27

Deep access large ribbon bond head

#66
20080048004
2008-02-28

Resonator, ultrasonic head, and ultrasonic bonder using the same

#67
20080048003
2008-02-28

Resonator, ultrasonic head, and ultrasonic bonder using the same

#68
20060231592
2006-10-19

Ultrasonic tool and ultrasonic bonder

#69
20060113350
2006-06-01

Resonator, ultrasonic head, and ultrasonic bonder using the same

#70
20060091184
2006-05-04

METHOD OF MITIGATING VOIDS DURING SOLDER REFLOW

#71
20060065696
2006-03-30

System and method for forming solder joints

#72
20050205641
2005-09-22

Ultrasonic tool and ultrasonic bonder

#73
20050133570
2005-06-23

Method and apparatus for conductive ball bonding of components

#74
20050001014
2005-01-06

Method of mounting electronic part and flux-fill

#75
14997727
2017-02-21

Multi-strike process for bonding