43185 ⎘
DIE SINGULATION SYSTEMS AND METHODS
#2Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
#3LASER CUTTING STRENGTHENED GLASS
#4Wafer producing apparatus
#5Substrate dividing method
#6SiC wafer producing method
#7Method for laser-assisted separation of a portion from a sheet-like glass or glass ceramic element
#8Laser processing method
#9Splitting of a solid using conversion of material
#10Laser processing method, and laser processing device
#11SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
#12Femtosecond laser-induced formation of single crystal patterned semiconductor surface
#13Laser processing method, and laser processing device
#14METHOD FOR MANUFACTURING OPTICAL LENS WITH FROSTED INTERFACE
#15Laser processing apparatus
#16CONTROLLED SEPARATION OF LASER PROCESSED BRITTLE MATERIAL
#17Method for the material-saving production of wafers and processing of wafers
#18Wafer producing method
#19Laser machining device and laser machining method
#20Machining object cutting method and machining object cutting device
#21SiC wafer producing method using ultrasonic wave
#22Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
#23Laser processing apparatus
#24Method of processing workpiece
#25Combined machining method and computer readable medium
#26Method for cutting a thin glass layer
#27Method for guiding a crack in the peripheral region of a donor substrate
#28Method and apparatus for performing laser curved filamentation within transparent materials
#29Wafer processing method
#30Method and device for laser-assisted separation of a portion from a sheet glass element
#31Method and device for separation of glass portions or glass ceramic portions
#32SPLITTING OF A SOLID USING CONVERSION OF MATERIAL
#33Splitting of a solid using conversion of material
#34METHOD FOR THE LOW-LOSS PRODUCTION OF MULTI-COMPONENT WAFERS
#35Method for dividing a composite into semiconductor chips, and semiconductor chip
#36Laser lift-off method of wafer
#37WAFER PROCESSING METHOD
#38Forming white metal oxide films by oxide structure modification or subsurface cracking
#39METHOD AND SYSTEM FOR PERFORMING AN IMPROVED SUPPORT FOR 3D DISPLAYING AND CORRESPONDING SUPPORT PERFORMED
#40Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
#41SiC wafer producing method
#42Method of manufacturing light emitting element
#43Wafer perforating device
#44Laser processing method and laser processing apparatus
#45Laminate structure for resealable package
#46Laser cutting of materials with intensity mapping optical system
#47Method of producing SiC wafer
#48EDGE CHAMFERING METHODS
#49SiC wafer producing method
#50Processing 3D shaped transparent brittle substrate
#51Apparatuses and methods for laser processing
#52CHIP AND METHOD OF MANUFACTURING CHIPS
#53Nonplanar wafer and method for producing a nonplanar wafer
#54Adhesive sheet for laser dicing and method for manufacturing semiconductor device
#55Process of forming an identification marking, and an identification marking formed by way of such a process
#56METHOD FOR PROCESSING SiC MATERIAL
#57Leakage laser beam detecting method
#58Wafer producing method
#59Processing apparatus and processing method
#60Method and device for separating a substrate
#61Anti-counterfeiting measures for glass articles
#62Position detecting device and laser processing device
#63METHOD AND APPARATUS FOR LASER-CUTTING OF TRANSPARENT MATERIALS
#64Laser processing of sapphire substrate and related applications
#65Wafer producing method and processing feed direction detecting method
#66Wafer producing method
#67Compact optical fiber cleaving apparatus and methods using a microchip laser system
#68LOW LOSS OPTICAL WAVEGUIDES INSCRIBED IN MEDIA GLASS SUBSTRATES, ASSOCIATED OPTICAL DEVICES AND FEMTOSECOND LASER-BASED SYSTEMS AND METHODS FOR INSCRIBING THE WAVEGUIDES
#69Substrate dividing method
#70TRANSPARENT MATERIAL CUTTING WITH ULTRAFAST LASER AND BEAM OPTICS
#71Laser processing apparatus
#72System for asymmetric optical beam shaping
#73Method of laser processing for substrate cleaving or dicing through forming “spike-like” shaped damage structures
#74Combined method for producing solids, involving laser treatment and temperature-induced stresses to generate three-dimensional solids
#75Laser cut composite glass article and method of cutting
#76Method and apparatus for realizing tubular optical waveguides in glass by femtosecond laser direct writing
#77DIE BONDING/DICING SHEET
#78OPTICAL ELEMENT MANUFACTURING METHOD
#79Wafer production method
#80Laser Processing of Electronic Device Structures
#81SiC wafer producing method
#82TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER
#83Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
#84Method and device for the laser-based working of two-dimensional, crystalline substrates, in particular semiconductor substrates
#85Wafer producing method
#86Optical plate, light irradiation device, light measurement device, light irradiation method, and light measurement method
#87SiC substrate separating method
#88Processing of material using non-circular laser beams
#89Laser machining device and laser machining method
#90GLASS-BASED SUBSTRATE WITH VIAS AND PROCESS OF FORMING THE SAME
#91Method for manufacturing semiconductor element
#92Optical device wafer processing method
#93Semiconductor device manufacturing method and semiconductor device
#94Wafer processing method
#95Portable defect mitigator for electrochromic windows
#96METHODS OF CUTTING GLASS USING A LASER
#97OPTICAL GLASS AND METHOD OF CUTTING GLASS SUBSTRATE
#98Aberration-correction method, laser processing method using said aberration-correcting method, laser irradiation method using said aberration-correcting method, aberration-correcting device and aberration-correcting program
#99Method of material processing by laser filamentation
#100Method for producing a bird protection device and bird protection device
#101Method for the fabrication of optical waveguide devices in photonic crystal fibers and in waveguides with hollow structures
#102Method for producing a decorative composite having at least one local weakening and a weakened spacer fabric
#103Polycrystalline SiC wafer producing method
#104SYSTEM AND METHOD FOR PROCESSING RADIATION DETECTORS USING LASER BEAMS
#105Wafer processing method
#106Tempered glass article with sub-surface laser engraving and production method
#107SAW DEVICE MANUFACTURING METHOD
#108Laser dicing device and dicing method
#109Laser processing of slots and holes
#110Method for rapid laser drilling of holes in glass and products made therefrom
#111Laser processing method and device
#112Wafer producing method
#113Wafer producing method
#114Systems and methods for laser splitting and device layer transfer
#115Laser working method, laser working apparatus, and its manufacturing method
#116Thin plate separating method
#117LOW LOSS OPTICAL WAVEGUIDES INSCRIBED IN MEDIA GLASS SUBSTRATES, ASSOCIATED OPTICAL DEVICES AND FEMTOSECOND LASER-BASED SYSTEMS AND METHODS FOR INSCRIBING THE WAVEGUIDES
#118Wafer producing method
#119Wafer producing method
#120Wafer producing method
#121Device and method for cutting out contours from planar substrates by means of laser
#122Window system with indicia
#123Processing method of single-crystal substrate
#124Combined production method for separating a number of thin layers of solid material from a thick solid body
#125Wafer producing method
#126Wafer producing method
#127Wafer producing method
#128Method for separating substrates and semiconductor chip
#129Method for dividing a composite into semiconductor chips, and semiconductor chip
#130Wafer producing method
#131Wafer producing method
#132Wafer producing method
#133Wafer producing method
#134Wafer producing method
#135Wafer producing method
#136Method and device for separating a flat workpiece into a plurality of sections
#137Methods of fabricating glass articles by laser damage and etching
#138Substrate dividing method
#139Method of separating chips from a wafer
#140SiC ingot slicing method
#141Laser processing apparatus
#142Methods and systems for processing materials, including shape memory materials
#143TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER
#144Method and apparatus for thinning wafer
#145Method and device for separating a substrate
#146Laser processing method and laser processing program creation device
#147Alignment mark for semiconductor device
#148Method for realizing an optical waveguide in a substrate by means of a femtosecond laser
#149Laser machining device and laser machining method
#150Laser machining device and laser machining method
#151Laser machining device and laser machining method
#152Laser machining device and laser machining method
#153Laser machining device and laser machining method
#154Laser processing method
#155Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip
#156Method and apparatus for performing laser curved filamentation within transparent materials
#157Method for manufacturing semiconductor device
#158Method and apparatus for laser cutting transparent and semitransparent substrates
#159Method for producing a pattern in relief in a thin plastic card
#160CUTTING METHOD FOR GLASS SUBSTRATE, GLASS SUBSTRATE, NEAR-INFRARED CUT FILTER GLASS, MANUFACTURING METHOD FOR GLASS SUBSTRATE
#161High speed laser processing of transparent materials
#162LASER MACHINING METHOD AND LASER MACHINING DEVICE
#163Plate-shaped object processing method
#164Plate-like object processing method
#165Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
#166Device with a single crystal diamond substrate with a buried electrically conducting layer
#167Workpiece cutting method
#168METHOD FOR CUTTING OBJECT TO BE PROCESSED
#169WORKPIECE CUTTING METHOD
#170METHOD AND DICING DEVICE OF PROCESSING TRANSPARENT SPECIMEN USING ULTRAFAST PULSE LASER
#171Method for manufacturing an acoustic wave device
#172Optoelectronic device and method for manufacturing the same
#173WORKPIECE CUTTING METHOD
#174Transparent material cutting with ultrafast laser and beam optics
#175Method for rapid laser drilling of holes in glass and products made therefrom
#176Processing 3D shaped transparent brittle substrate
#177Laser processing of sapphire substrate and related applications
#178SYSTEM AND METHOD FOR OBTAINING LAMINAE MADE OF A MATERIAL HAVING KNOWN OPTICAL TRANSPARENCY CHARACTERISTICS
#179Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
#180Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
#181METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES
#182Forming white metal oxide films by oxide structure modification or subsurface cracking
#183Laser processing system using broad band pulsed lasers
#184Laser processing method and laser processing apparatus
#185Laser processing method and laser processing apparatus
#186Maskless hybrid laser scribing and plasma etching wafer dicing process
#187Wafer processing method
#188Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element
#189METHOD FOR CUTTING TOUGHENED GLASS PLATE
#190Substrate dividing method
#191Method and apparatus for performing laser filamentation within transparent materials
#192Method for creating a resonator
#193Laser processing apparatus
#194LASER DICING METHOD
#195Sub-surface marking of product housings
#196Compensation of fiber lensing effect during grating fabrication in multicore fiber
#197Wafer processing method
#198Laser machining method and chip
#199Semiconductor chip with modified regions for dividing the chip
#200Laser machining method and laser machining device
#201CONTINUOUS METHOD FOR THE PRODUCTION OF LIGHT GUIDE PLATES
#202Semiconductor element
#203Method and device for the laser-based machining of sheet-like substrates
#204Methods of fabricating glass articles by laser damage and etching
#205Laser processing method for workpiece
#206Laser processing method and device
#207Systems and methods for laser splitting and device layer transfer
#208Laser dicing method
#209Laser dicing method
#210Transparent material processing with an ultrashort pulse laser
#211Laser processing method
#212Method of cutting object to be processed
#213Laser reinforced direct bonding of optical components
#214Subsurface glass reticles
#215Aberration-correcting method, laser processing method using said aberration-correcting method, laser irradiation method using said aberration-correction method, aberration-correction device and aberration-correcting program
#216Laser marking process and articles
#217Methods of cutting glass using a laser
#218Substrate dividing method
#219Optoelectronic device and method for manufacturing the same
#220Modified layer forming method
#221Apparatus and method for generating separating fissures in a substrate
#222Method of cutting semiconductor substrate
#223Laser ablation technique for electrical contact to buried electrically conducting layers in diamond
#224Methods for scribing of semiconductor devices with improved sidewall passivation
#225Methods and systems for laser processing of coated substrates
#226Process and device for producing at least one photonic component
#227Transparent material processing with an ultrashort pulse laser
#228Method of material processing by laser filamentation
#229Laser processing method
#230Laser processing method
#231Semiconductor light emitting chip and method for processing substrate
#232Laser dicing method
#233Laser processing apparatus
#234Method for processing an embedded metal film
#235Method of manufacturing a semiconductor device formed using a substrate cutting method
#236Laser processing method and laser processing apparatus
#237Laser working method, laser working apparatus, and its manufacturing method
#238Laser processing method and laser processing apparatus
#239Laser processing method and laser processing apparatus
#240Substrate processing method
#241Laser processing method
#242Method for cutting object to be processed
#243Target object processing method and target object processing apparatus
#244Method for cutting processing target
#245Laser machining method
#246Laser irradiation device and laser processing method
#247Dicing methods
#248Method of cutting object to be processed, method of cutting strengthened glass sheet and method of manufacturing strengthened glass member
#249Laser beam working machine
#250Laser machining device
#251Laser processing method
#252Method of cutting a wafer-like object and semiconductor chip
#253Method of cutting a substrate and method of manufacturing a semiconductor device
#254Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
#255Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
#256Working object cutting method
#257Laser processing method for cutting planar object
#258Laser working method
#259Laser beam machining apparatus with detection laser beam oscillator
#260Laser processing method and laser processing system
#261Laser processing method for cutting substrate and laminate part bonded to the substrate
#262Brittle non-metallic workpiece with through hole and method for making same
#263Cleaving wafers from silicon crystals
#264Laser processing method
#265Laser processing method and device
#266Laser processing method and device
#267Laser processing method
#268Hybrid dicing process using a blade and laser
#269Integrated inductor