ClassID:

42780

B23K3/029 - CPC Classification

Classification description:

Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods; Soldering irons; Bits Solder or residue removing devices

Recent Application in this class:
#1
20240189932
2024-06-13

SMART DESOLDERING DEVICE AND METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK DRIVEN BY ARTIFICIAL INTELLIGENCE

#2
20220339726
2022-10-27

IRON TIP CLEANER DEVICE FOR SOLDERING IRON

#3
20210252621
2021-08-19

Solder removal from semiconductor devices

#4
20200198039
2020-06-25

Cleaning pad assembly

#5
20190247943
2019-08-15

Solder removal from semiconductor devices

#6
20180281105
2018-10-04

Electric iron and soldering device

#7
20180161903
2018-06-14

Vacuum pick-up confirmation system

#8
20180036819
2018-02-08

Cleaning Pad Assembly

#9
20170209903
2017-07-27

Solder cleaning system

#10
20170179066
2017-06-22

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

#11
20170165771
2017-06-15

Support Stand for Heating Tools

#12
20170148762
2017-05-25

Method for semiconductor die removal rework

#13
20170135257
2017-05-11

APPARATUS, METHODS, AND SYSTEMS FOR REMOVING COMPONENTS FROM A CIRCUIT BOARD

#14
20170125374
2017-05-04

Rework process and tool design for semiconductor package

#15
20170056996
2017-03-02

Desoldering apparatus and method

#16
20160175959
2016-06-23

Desoldering tool and control system

#17
20160175958
2016-06-23

Desoldering tool nozzle and method of manufacturing the nozzle

#18
20150187617
2015-07-02

Die bonder and a method of cleaning a bond collet

#19
20140034708
2014-02-06

Solar cell pad dressing

#20
20120292376
2012-11-22

Method for the quantitative determination of soldering agent residues

#21
20110240716
2011-10-06

Methods for rework of a solder

#22
20100181295
2010-07-22

Method and device for removing solder material deposits from a substrate

#23
20090045245
2009-02-19

Solder repairing apparatus and method of repairing solder