Patents-Review.com
ClassID:

42770 ⎘

B23K3/00 - CPC Classification

Classification description:

Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods

Sub-classes:
Recent Application in this class:
#1
20240344771
2024-10-17

REFLOW FURNACE

 #2
20240250488
2024-07-25

Method for automated monitoring of a soldering process, soldering device with monitoring device

 #3
20230254981
2023-08-10

Bonding apparatus

 #4
20230238352
2023-07-27

Thermal compression bonder nozzle with vacuum relief features

 #5
20230073723
2023-03-09

DEVICE AND METHOD FOR OPTIMIZING CONTROL PARAMETER OF SOLDER PRINTING APPARATUS

 #6
20220254751
2022-08-11

Semiconductor device manufacturing device and manufacturing method

 #7
20220157768
2022-05-19

Laser reflow apparatus and method for electronic components with micron-class thickness

 #8
20210288021
2021-09-16

Thermal compression bonder nozzle with vacuum relief features

 #9
20210180867
2021-06-17

Reflow furnace

 #10
20200388507
2020-12-10

Bonding apparatus and bonding method

 #11
20200273742
2020-08-27

Apparatus for manufacturing semiconductor device

 #12
20200091108
2020-03-19

Laser reflow apparatus and method for electronic components with micron-class thickness

 #13
20190389013
2019-12-26

Device for manufacturing plate solder and method for manufacturing plate solder

 #14
20190280132
2019-09-12

Flux coating device and method for solar cell panel, and apparatus for attaching interconnector of solar cell panel

 #15
20190126375
2019-05-02

Soldering system

 #16
20190063847
2019-02-28

Plate laminate type heat exchanger

 #17
20190030632
2019-01-31

Viscous fluid supply device

 #18
20180266769
2018-09-20

Heat exchanger and method of manufacturing same

 #19
20180211932
2018-07-26

Method and system for automatic bond arm alignment

 #20
20180141168
2018-05-24

Soldering apparatus and flux-applying device

 #21
20180015558
2018-01-18

SOLDERING APPARATUS

 #22
20170209967
2017-07-27

Attaching device

 #23
20170117168
2017-04-27

Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same

 #24
20160343626
2016-11-24

Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding

 #25
20160254245
2016-09-01

Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same

 #26
20160143156
2016-05-19

Reflow treating unit and substrate treating apparatus

 #27
20160143155
2016-05-19

Reflow treating unit and substrate treating apparatus

 #28
20160099164
2016-04-07

Structure for joining ceramic plate to metal cylindrical member

 #29
20160081243
2016-03-17

Electronic component mounting system, electronic component mounting method, and electronic component mounting machine

 #30
20160043053
2016-02-11

Flip chip bonder and method of correcting flatness and deformation amount of bonding stage

 #31
20160005709
2016-01-07

Methods of operating bonding machines for bonding semiconductor elements, and bonding machines

 #32
20150216058
2015-07-30

Screen printing apparatus, electronic component mounting system and screen printing method

 #33
20150069110
2015-03-12

SEMICONDUCTOR MANUFACTURING APPARATUS

 #34
20150034700
2015-02-05

Reflow treating unit and substrate treating apparatus

 #35
20140182128
2014-07-03

Induction bonding

 #36
20140042126
2014-02-13

Method for detecting butt position of weld joint, device for detecting butt position of weld joint, and method for manufacturing weld joint

 #37
20140034708
2014-02-06

Solar cell pad dressing

 #38
20130306713
2013-11-21

Method of forming a solder joint

 #39
20130214032
2013-08-22

Method of manufacturing LED light bar

 #40
20130119112
2013-05-16

Reflow soldering system

 #41
20120298726
2012-11-29

Plumber's heat shield

 #42
20120205880
2012-08-16

Machine tool having a rotary transmitter for data

 #43
20120175404
2012-07-12

Method of manufacturing LED light bar and manufacturing equipment thereof

 #44
20120008284
2012-01-12

Repair apparatus and method for circuit board assembly

 #45
20100308103
2010-12-09

SYSTEM AND METHOD FOR VAPOR PHASE REFLOW OF A CONDUCTIVE COATING

 #46
20060081680
2006-04-20

Desoldering wick for lead-free solder

 #47
17167955
2022-12-27

System and method for bonding a cable to a substrate using a die bonder