42794 ⎘
Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods Heating appliances
Sub-classes:SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
#2TEMPERATURE CONTROL PLATE AND METHOD FOR PRODUCING A TEMPERATURE CONTROL PLATE
#3APPARATUS FOR REPAIRING SOLDER-BALL
#4LASER BONDING DEVICE AND LASER BONDING METHOD
#5Welding System
#6OVEN WITH ADJUSTABLE VOLUME PROCESSING CHAMBER
#7HEAT TREATMENT FURNACE APPARATUS
#8SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
#9REFLOW OVEN
#10METHOD FOR DETERMINING TEMPERATURE OF REFLOW OVEN, ELECTRONIC DEVICE AND STORAGE MEDIUM
#11SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
#12SELF CORRECTING OVEN TECHNOLOGY
#13SYSTEM AND METHOD FOR DETERMINING WHETHER TO CLEAN A REFLOW OVEN
#14BRAZING METHOD AND BRAZING APPARATUS FOR BRAZING METAL PLATES
#15Soldering Apparatus And Method Of Detecting Failures Of Gasket
#16SOLDERING DEVICE
#17Device for shifting at least one sub-assembly between a provisioning zone and working zone
#18BRAZE JOINTS FOR A COMPONENT AND METHODS OF FORMING THE SAME
#19Method and hot-forming die for producing a heat transfer plate
#20CONTROL DEVICE FOR PERFORMING BRAZING, BRAZING SYSTEM, AND BRAZING METHOD
#21DEVICE AND METHOD FOR CONTROLLED HEAT TRANSFER, IN PARTICULAR TO WORKPIECES OF LARGE DIMENSIONS AND MASSES BY MEANS OF A CONDENSING LIQUID
#22Laser soldering system and light shaping method thereof
#23Heat assisted flip chip bonding apparatus
#24LASER SOLDERING METHOD AND DEVICE
#25Soldering apparatus
#26Soldering apparatus and method of detecting failures of gasket
#27Method and laser arrangement for fusing a solder material deposit by means of laser energy
#28Reflow soldering system for combined convection soldering and condensation soldering
#29Apparatus and method for hard facing a substrate
#30Soldering device
#31Reliable transportation mechanism for micro solder balls
#32Semiconductor device manufacturing method
#33Cleaning pad assembly
#34Heat transfer device for producing a soldered connection of electrical components
#35Welding system
#36Reflow device and method for manufacturing substrate using the reflow device
#37Apparatus and method for attaching interconnector of solar cell panel
#38Component joining apparatus, component joining method and mounted structure
#39Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
#40Solder paste for reduction gas, and method for producing soldered product
#41HEATING APPARATUS AND METHOD FOR PRODUCING PLATE-LIKE OBJECT
#42Reflow soldering oven with at least one gas purification system comprising a catalyst unit
#43METHOD AND APPARATUS FOR BONDING FLEXIBLE WIRES
#44Reflow soldering apparatus, system and method
#45Solder paste misprint cleaning
#46Solder paste misprint cleaning
#47Vacuum pick-up confirmation system
#48Atomization mechanism for cooling a bond head
#49Cleaning Pad Assembly
#50Electrical connection tape
#51Solder paste misprint cleaning
#52Solder fill into high aspect through holes
#53Heat transfer device for producing a soldered connection of electrical components
#54Metal wiring bonding structure and production method therefor
#55Solder fill into high aspect through holes
#56APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL PARTS
#57Reliable transportation mechanism for micro solder balls
#58Device for the separate application of bonding material deposits
#59Recovery of Components from Electronic Waste
#60Generation of a Splice Between Superconductor Materials
#61Wire splicing device, wire splicing method, and method for manufacturing splice structure
#62Wire splicing device, wire splicing method, and method for manufacturing splice structure
#63Apparatus and method for attaching interconnector of solar cell panel
#64Soldering Device Minimizing Voids When Soldering Printed Circuit Boards
#65BRAZING ASSEMBLY FOR ROOF LASER-BRAZING SYSTEM
#66Bonding apparatus
#67Soldering apparatus with automatic aligning function
#68COOLING SYSTEM TO REDUCE LIQUID METAL EMBRITTLEMENT IN METAL TUBE AND PIPE
#69Apparatus For Dispensing Flux-Free Solder On A Substrate
#70Device for the separate application of connecting material deposits
#71Thermal compression bonding process cooling manifold
#72Oven-style nozzle for reworking operations involving bottom-side terminated components or other components
#73Reflow treating unit and substrate treating apparatus
#74Reflow treating unit and substrate treating apparatus
#75REEL-TO-REEL MANUFACTURING PLANT FOR INTERLINKED CONTINUOUS AND DISCONTINUOUS PROCESSING STEPS
#76Method and arrangement for producing a three-dimensional material composite using an expansion body
#77Wire splicing device, wire splicing method, and method for manufacturing splice structure
#78GAS COOLING DEVICE AND REFLOW OVEN USING THEREOF
#79Apparatus and method for manufacturing semiconductor device
#80Apparatus for bonding semiconductor chips
#81Soldering system
#82Joining method and joining system
#83Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
#84Gas-blowing-hole array structure and soldering apparatus
#85Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
#86Heat-bonding apparatus and method of manufacturing heat-bonded products
#87Metastable gas heating
#88Gas-intake-port array structure and soldering apparatus
#89Method of manufacturing semiconductor device, substrate processing apparatus and recording medium
#90Heat-bonding apparatus and method of manufacturing heat-bonded products
#91BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM THEREFOR
#92Reflow process and tool
#93Thermal processing apparatus
#94Thermal compression bonding process cooling manifold
#953D TSV assembly method for mass reflow
#96SOLDERING A SEMICONDUCTOR DEVICE AND A SUBSTRATE BASED ON OSCILLATING FREQUENCIES
#97Through type furnace for substrates comprising a longitudinal slit
#98Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method
#99Reflow oven and methods of treating surfaces of the reflow oven
#100Soldering apparatus and manufacturing method of soldered product
#101VACUUM MOLDING APPARATUS, SUBSTRATE PROCESSING SYSTEM HAVING THE SAME AND SUBSTRATE PROCESSING METHOD USING THE SAME
#102CONTROLLING THE MELT FRONT OF THIN FILM APPLICATIONS
#103Controlling the melt front of thin film applications
#104Apparatus for thermal melting process and method of thermal melting process
#105Heat processing device
#106Preheat module, preheat zone and preheat section using the same
#107Hot bar soldering
#108Vacuum reflow voiding rework system
#109Reflow soldering system
#110Apparatus for and method of brazing aluminium products with closed loop conveyor within the furnace
#111Brazing system
#112Methods and systems involving soldering
#113Apparatus for thermal melting process and method of thermal melting process
#114HEATING DEVICE FOR SOLDERING SYSTEM
#115Production method of leading edge reinforcement of fan blade
#116Reflow bonding method and method of manufacturing head suspension
#117Reflow Air Management System and Method
#118Process for welding electrical connectors and welding device thereof
#119Repair apparatus and repair method
#120Method and apparatus for rework soldering
#121Through-Via Laser Reflow Systems And Methods For Surface Mount Components
#122METHOD OF DETECTING AN OBJECT TO BE DETECTED IN A JOINING DEVICE, JOINING DEVICE, AND JOINING METHOD
#123Heating apparatus
#124Induction coil design for portable induction heating tool
#125Reflow soldering apparatus
#126Thermal carrier
#127Hot bar soldering
#128Vacuum reflow voiding rework system
#129Vacuum reflow voiding rework system