43352 ⎘
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting Interlayers, transition pieces for metallurgical bonding of workpieces
Sub-classes:BONDING ELEMENT FOR DIFFUSION BONDING, COMPRISING A HEATING ELEMENT AND A BONDING STRUCTURE WITH AN OUTER METAL SURFACE
#2Method for Joining Components, and Component Connection
#3ADDITIVELY MANUFACTURED JOINED PARTS
#4METHOD FOR MANUFACTURING WELDED STRUCTURE, AND WELDED STRUCTURE MANUFACTURED THEREBY
#5Method for joining heat transfer plates of a plate heat exchanger
#6Package on package structure and method for forming the same
#7Laminate including weldable regions
#8Tempered vacuum glass
#9Package on package structure and method for forming the same
#10Methods for manufacturing components having spatially graded properties
#11Method for joining heat transfer plates of a plate heat exchanger
#12BRAZE COMPOSITIONS, AND RELATED DEVICES
#13Method for joining dissimilar metals and articles comprising the same
#14BRAZING PROCESSES AND BRAZED PRODUCTS
#15Method for forming a bonded joint
#16Method and device for reversibly attaching a phase changing metal to an object
#17Diffusion-bonded metallic materials
#18Package on package structure and method for forming the same
#19Thermal interface material and method
#20Method for manufacturing sheet metal blanks, in particular hybrid sheet metal blanks
#21Plate heat exchanger
#22Method for joining metal parts
#23Soldering structure and process of making the same
#24Flux-cored brazing preform
#25Package on package structure and method for forming the same
#26Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder
#27FILLER CLOTH FOR LASER CLADDING
#28Braze alloy layered product
#29Brazing concept
#30Plate heat exchanger
#31Coating concept
#32Method for joining metal parts
#33Plate heat exchanger
#34Brazing concept
#35High temperature electrochemical cell structures, and methods for making
#36Mounting structure and manufacturing method for same
#37Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder
#38Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
#39Electronic part mounting substrate and method for producing same
#40Glazing with a soldered connector
#41BRAZE COMPOSITIONS, AND RELATED DEVICES
#42Braze compositions, and related devices
#43METALLIC COMPOSITIONS USEFUL FOR BRAZING, AND RELATED PROCESSES AND DEVICES
#44Methods of fabricating fuel injectors using laser additive deposition
#45Package on package structures and methods for forming the same
#46Joined product
#47Wafer-level chip scale package
#48Method for applying soft solder to a mounting surface of a component
#49Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material
#50Conductive paste and electronic device and solar cell including an electrode formed using the same
#51Method for the thermal joining of two components, and a thermal joining strip
#52Submount
#53Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder
#54PROCESS FOR FLUXLESS BRAZING OF ALUMINIUM AND BRAZING FILLER ALLOY FOR USE THEREIN
#55Method for the permanent connection of two components by means of glass or metal solder
#56X-ray tube target, X-ray tube using the same, X-ray inspection device and method of producing X-ray tube target
#57METHODS OF JOINING AND MATERIAL DEPOSITION FOR A WORKPIECE WITH A WORKPIECE AREA MADE FROM A TITANIUM-ALUMINIDE ALLOY
#58Method for the permanent connection of two components by means of glass or metal solder
#59Compositions and methods for dissimilar material welding
#60Methods and designs for forming joints between metallic members
#61Methods of treating metal articles and articles made therefrom
#62Joint structure, joining method, wiring board and method for producing the same
#63Submount and method of manufacturing the same
#64Solder ball attachment ring and method of use
#65Methods and device for controlling pressure in reactive multilayer joining and resulting product
#66MULTILAYER PREFORM FOR FAST TRANSIENT LIQUID PHASE BONDING
#67LOW LEAD SOLDERABLE PLUMBING COMPONENTS
#68Solder preform and a process for its manufacture
#69Light emitting device and method of fabricating light emitting device
#70Diffusion soldered semiconductor device
#71Process for producing a composite body
#72Method of joining components using amorphous brazes and reactive multilayer foil
#73Workpiece structure modification
#74Joining of advanced materials by superplastic deformation
#75Brazing product and method of its manufacture
#76Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction
#77Joining method by Au-Sn brazing material
#78Method of controlling thermal waves in reactive multilayer joining and resulting product
#79[METHOD OF FORMING BOND MICROSTRUCTURE]
#80Methods and device for controlling pressure in reactive multilayer joining and resulting product
#81Apparatus and method for accommodating part mismatch during joining
#82Transient eutectic phase process for ceramic-metal bonding metallization and compositing
#83Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction
#84Braze-based protective coating for silicon nitride
#85SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same
#86Wafer-level chip scale package
#87Process and apparatus for producing a turbine component, turbine component and use of the apparatus