TIN-BASED SOLDER PASTE, SOLDERING METHOD AND ELECTRONIC COMPONENT USING SAME

MEDICAL DEVICE INCLUDING A SOLDERABLE LINEAR ELASTIC NICKEL-TITANIUM DISTAL END SECTION AND METHODS OF PREPARATION THEREFOR

JOINING TWO COMPONENTS OF A FIELD DEVICE FOR PROCESSING AND AUTOMATION TECHNOLOGY

BONDED SUBSTRATE

Method for producing at least one defined connecting layer between two components of different metals

Bimetallic joining with powdered metal fillers

Ceramic circuit substrate and method for producing ceramic circuit substrate

Repair method and repair material

Bonding material, and bonding method and bonded structure each using same

Medical device including a solderable linear elastic nickel-titanium distal end section and methods of preparation therefor

Method of welding a nickel strength lug with a bronze connecting pin and a brass contact ring in an accelerometer sensor

DIRECTLY INTEGRATED FEEDTHROUGH FOR AN IMPLANTABLE MEDICAL DEVICE HOUSING USING A GOLD ALLOY

REPAIR METHOD AND REPAIR MATERIAL

Semiconductor device having connection terminal of solder

Solder alloy and joint thereof

Coating structure material

Direct integration of feedthrough to implantable medical device housing using a gold alloy

Solder joint material and method of manufacturing the same

Braze alloy layered product

Brazing concept

Plate heat exchanger

Coating concept

Method for joining metal parts

Plate heat exchanger

Brazing concept

Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part

Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate

Method for manufacturing semiconductor device, and semiconductor device

Nuclear fusion reactor first wall component and production process thereof

Method for treating Cu thin sheet

Flange for pressure measurement cells or pressure transfer means and method for manufacture of such flanges

Advanced pass progression for build-up welding

Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same

SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF

METHOD FOR MANUFACTURING SEALING DISKS

Guide wire device including a solderable linear elastic nickel-titanium distal end section and methods of preparation therefor

Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device

Method of joining copper conductors

SINGLE CRYSTAL WELDING OF DIRECTIONALLY SOLIDIFIED MATERIALS

Method for welding workpieces made of highly heat-resistant superalloys, including a particular mass feed rate of the welding filler material

METHOD AND DEVICE FOR PRODUCING A COMPONENT OF A TURBOMACHINE

Method and device for producing a component of a turbomachine

Plating of ceramic matrix composite parts as joining method in gas turbine hardware

Method for producing a rotor or stator blade and such a blade

LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART

Phenylnaphthylimidazole compound and usage of the same

Extending useful life of a cobalt-based gas turbine component

Dual brazing alloy element, process for producing it and uses thereof

Junction body, semiconductor module, and manufacturing method for junction body

Stable Gold Bump Solder Connections

PLATINUM WELD STRUCTURES AND METHODS

METHOD OF MANUFACTURING HIGH-HEAT-LOAD EQUIPMENT BY METALLURGICALLY JOINING CARBON MATERIAL WITH COPPER-ALLOY MATERIAL

Stable gold bump solder connections

Method and apparatus for welding workpieces of high-temperature superalloys

Method and device for welding workpieces made of high-temperature resistant super alloys

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

Double transition joint for the joining of ceramics to metals

Blaze cladding for direct metal laser sintered materials

Pb-free solder-connected structure and electronic device

PREHEATING TEMPERATURE DURING REMELTING

EROSION PREVENTION METHOD AND MEMBER WITH EROSION PREVENTIVE SECTION

Solder ball attachment ring and method of use

Stable gold bump solder connections

Method of retouching metal parts

Methods and device for controlling pressure in reactive multilayer joining and resulting product

LOW LEAD SOLDERABLE PLUMBING COMPONENTS

Method of manufacturing a cold plate heat exchanger assembly having a metallic compliant gasket

Novelty in the Method for the Combination of Gold and the Other Minerals

Phenylnaphthylimidazole compound and usage of the same

Solder layer and electronic device bonding substrate and submount using the same

Flux for soldering, soldering method, and printed circuit board

A-TIG welding of copper alloys for generator components

Braze cladding for direct metal laser sintered materials

Semiconductor device

Target and manufacturing method thereof

Pb-free solder-connected structure and electronic device

Method and structure to reduce risk of gold embrittlement in solder joints

Joining method and apparatus

Flux for soldering, soldering method, and printed circuit board

Metal bonding method

Lead-free bonding systems

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Method and structure to reduce risk of gold embrittlement in solder joints

Methods and device for controlling pressure in reactive multilayer joining and resulting product

Ceramic to noble metal braze and method of manufacture

Solder pads and method of making a solder pad

Transient liquid phase bonding of golf club components