Lead-Free Solder Ball

SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME

Solder material

SOLDER ALLOY COMPOSITION, ITS PREPARATION METHOD AND USES IN ROOM-TEMPERATURE RAPID SOLID-STATE SOLDERING

COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS

Joined body, holding device, and electrostatic chuck

BUMPING FOR LIQUID METAL SOCKET INTERCONNECTS

INDIUM SOLDER PASTE COMPOSITIONS

Magnetic-field melting solder, and joining method in which same is used

Lead-free solder

METAL COMPOSITION, BONDING MATERIAL

Method of making amalgamation preform

Amalgamation preform

Method of using amalgamation preform

Cost-effective lead-free solder alloy for electronic applications

Solder coated rivet electrical connector

Solder joint part and method for manufacturing the same

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

Car window glass assembly

Solder joint

VEHICLE WINDOW GLASS ASSEMBLY

Light emitting diode for low temperature applications

Car window glass assembly

Solder alloy, solder ball, solder preform, solder paste and solder joint

Solder material for semiconductor device

LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING

LEAD FREE SOLDER COMPOSITION WITH HIGH DUCTILITY

SOLDER PASTE CONTAINING LEAD FREE SOLDER COMPOSITION WITH HIGH DUCTILITY AND SOLDERING FLUX

Display device having an electronic device disposed on a first pad and a second pad

Solder bonding method and solder joint

Solder material

Solder alloy and resin flux cored solder

Solder paste using a solder paste flux and solder powder

Ceramic circuit substrate and method for producing ceramic circuit substrate

SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD

Cost-effective lead-free solder alloy for electronic applications

Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component

"Lead-Free Solder Ball"

Lead-Free Solder Alloy

Lead-free solder alloy, electronic circuit substrate, and electronic device

Solder alloy, solder ball, chip solder, solder paste, and solder joint

Orthopedic implant and method of producing the implant

Solder paste for reduction gas, and method for producing soldered product

Joining material and method for manufacturing joined body

METHOD OF MANUFACTURING JOINED BODY, AND JOINING MATERIAL

Sintering pastes with high metal loading for semiconductor die attach applications

Multi-tier conductive circuits free of supporting substrate with intermediary devices on a plurality of tiers, detachable production platform for additive manufacturing, solder-dispensers and device-dispensers

Flux composition for solder applications

SOLDER ALLOY AND SOLDER COMPOSITION

FLUX AND SOLDER PASTE

Lead-free solder compositions

Solder alloy, solder paste, and electronic circuit board

Metal particle and electroconductive paste formed therefrom

Metal particle and articles formed therefrom

Sputtering target-backing plate assembly and production method thereof

Solder joining

Solder alloy and module

Electronic assembly using bismuth-rich solder

Composition for bonding

Preform for semiconductor encapsulation

Solder alloy, solder paste, and electronic circuit board

Method of forming a lead-free solder composition

Low-temperature bonding with spaced nanorods and eutectic alloys

Core material, semiconductor package, and forming method of bump electrode

Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer

Selective solder plating

Bonding member, method for manufacturing bonding member, and bonding method

Solder alloy

Interconnections Formed with Conductive Traces Applied onto Substrates Having Low Softening Temperatures

Fluorescence light source apparatus

Brazing method for assembling two elements via an intermetallic compound

Bonding member and bonding method

Solder material for semiconductor device

Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device

Method and device for reversibly attaching a phase changing metal to an object

Solder Preforms and Solder Alloy Assembly Methods

Flux activator, flux, and solder

Lead-Free Solder Ball

Lead-free solder alloy

Preparation and application of Pb-free nanosolder

Indium-tin-silver based lead free solder

Interconnect alloy material and methods

Conductive particle, and connection material, connection structure, and connecting method of circuit member

Connecting method of circuit member

Cu column, Cu core column, solder joint, and through-silicon via

Metal particles having intermetallic compound nano-composite structure crystal

Non-eutectic bonding

Solder alloy, solder paste, and electronic circuit board

LEAD FREE SOLDER COMPOSITION WITH HIGH DUCTILITY

Solder material, solder joint, and method of manufacturing the solder material

Method of manufacturing cu core ball

Lead-free solder alloy composition and method for preparing lead-free solder alloy

Solder alloy, solder ball, chip solder, solder paste and solder joint

SOLDER BALL AND ELECTRONIC MEMBER

Low temperature high reliability alloy for solder hierarchy

LEAD-FREE SOLDER COMPOSITION

SELECTIVE SOLDER PLATING

Method for producing intermetallic compound

Method for manufacturing radiation window and a radiation window

Generation of a Splice Between Superconductor Materials

Coated solder material and method for producing same

Method for manufacturing thermal interface sheet

Process for producing bonded body and process for producing power module substrate

Solder alloy, and LED module

Lead-free soldering method and soldered article

Cu core ball, solder paste, formed solder, Cu core column, and solder joint

Lead-free solder alloy, solder material and joined structure

Alternative compositions for high temperature soldering applications

Lead-free solder alloy

Solder material and connected structure

Device comprising a connecting component and method for producing a connecting component

Lead-free solder ball

Core-shell multi-layer particles

Connection structure of circuit member, connection method, and connection material

Tin-antimony-based high temperature solder for downhole components

In-vehicle electronic module

Solder alloy, solder paste, and electronic circuit board

Power module

Solder alloy, solder composition, solder paste, and electronic circuit board

Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof

Electronic apparatus and method for manufacturing the same

Solder paste

Solder paste

Cu core ball

Electrical apparatus

Lead-free solder alloy and in-vehicle electronic circuit

Joined body and method for producing the same

Solder material and bonded structure

Mechanical processing of reactive laminates

Semiconductor device and manufacturing method of semiconductor device

Apparatus and method for printing circuitry

Electroconductive bonding material

Joined body and method for producing the same

Light emitting device and method of producing the light emitting device

Flux and solder paste

Pb-free solder alloy

Heat-bonding apparatus and method of manufacturing heat-bonded products

Power module

Power module

Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component

Method for bonding bare chip dies

Composition of a solder, and method of manufacturing a solder connection

Soldering method using a low-temperature solder paste

Solder alloy for die bonding

Method for the production of a heat exchanger, particularly a sorption heat exchanger

Mixed alloy solder paste

Insert casting or tack welding of machinable metal in bulk amorphous alloy part and post machining the machinable metal insert

Mixed alloy solder paste

Lead-free solder ball

High-temperature lead-free solder alloy

Solder alloy, solder paste, and electronic circuit board

Solder joint material and method of manufacturing the same, soldering member and solar cell module

Solder ball and electronic member

Solder material and bonded structure

Solder alloy, solder paste, and electronic circuit board

Electric contact and socket for electric parts

Solder piece, chip solder and method of fabricating solder piece

Solder preforms and solder alloy assembly methods

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

Flux and Solder Paste

Turbine rotor for supercharger and manufacturing method thereof

Lead-free solder alloy

Cream solder composition

Bonded body and semiconductor module

Joining method, joint structure and method for producing the same

Solder joint for an electrical conductor and a window pane including same

Joining method, method for producing electronic device and electronic part

Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part

Lead-free solder composition

Interconnect alloy material and methods

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

Solder powder, and solder paste using solder powder

Method for producing a pane having an electrical connection element

Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder

Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same

Lead-free solder alloy

Glazing with a soldered connector

Multi-solder techniques and configurations for integrated circuit package assembly

Paste for joining components of electronic modules, system and method for applying the paste

Lead-free solder ball

Photonic sintering of polymer thick film conductor compositions

Electrically conductive compositions comprising non-eutectic solder alloys

Lead-free solder alloy

Method for bonding aluminum-based metals

Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method

Insert casting or tack welding of machinable metal in bulk amorphous alloy part and post machining the machinable metal insert

Lead-free solder alloy for vehicle glass

ACTIVE SOLDER

Lead-free solder flux and lead-free solder paste

Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body

Laminated structure and method for producing the same

Sn—Sb—Ni ternary compound and method for forming the same

Bi—Sn based high-temperature solder alloy

Flux composition and method of soldering

Solder piece, chip solder and method of fabricating solder piece

BRAZING MATERIAL FOR BONDING IN ATMOSPHERE, BONDED ARTICLE, AND CURRENT COLLECTING MATERIAL

Bonding material, bonded portion and circuit board

ACTIVE SOLDER

Composition of a solder, and method of manufacturing a solder connection

Metal tape material and interconnector for solar module current collection

Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column

Method for applying soft solder to a mounting surface of a component

Elastomer Bonded Item and Method for Debonding

SOLDERING PROCESS USING ELECTRODEPOSITED INDIUM AND/OR GALLIUM, AND ARTICLE COMPRISING AN INTERMEDIATE LAYER WITH INDIUM AND/OR GALLIUM

Mechanical processing of reactive laminates

Lead-free solder composition

Low silver, low nickel brazing material

LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART

Wiring board and method for manufacturing the same

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

Variable melting point solders

Polymer composition for microelectronic assembly

Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers

Mixed alloy solder paste

Composite solder alloy preform

Nanotube modified solder thermal intermediate structure, systems, and methods

Indium-containing lead-free solder for vehicle-mounted electronic circuits

Material and method of manufacturing of a solder joint with high thermal conductivity and high electrical conductivity

Method of refining solder materials

SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT USING SAME

Sputter target and backing plate assembly

Bonding material, bonded portion and circuit board

ELECTRODES HAVING LITHIUM ALUMINUM ALLOY AND METHODS

Optoelectronic device having a multi-layer solder and manufacturing method thereof

Method of positioning conveyance section, and conveyance device

Lead-free jointing material and method of producing the same

Lead-free low-temperature solder

Lead-free solder composition including microcapsules

Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member

Solder paste and solder joint

Solder Paste and Method for Forming Solder Bumps Using the Same

Solder paste

Composition of a solder, and method of manufacturing a solder connection

METHOD FOR SOLDERING MAGNESIUM ALLOY WORKPIECE

INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CONNECTING THE SAME

Sputter target and backing plate assembly

MODIFIED SOLDER ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRODUCTION AND USES THEREOF

Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity

Interface materials and methods of production and use thereof

Copper-Containing Tin Powder, Method for Producing the Copper-Containing Tin Powder and Electro-Conductive Paste Using the Copper-Containing Tin Powder

Solder Composition and Solder Layer Forming Method Using the Same

Solder composition having dispersoid particles for increased creep resistance

WAVE SOLDER APPARATUS

Soldering method

Solder compositions; method of soldering, and a laminated transparency having bus bars

Lead-containing solder bumps

Lead-containing solder paste

Lead-containing anodes

Multilayer solder article

Electronic component package including joint material having higher heat conductivity

Austenitic stainless steel welding wire and welding structure

Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder

Methods of refining lead-containing materials

Solder interconnect structure and method using injection molded solder

Target and manufacturing method thereof

Method and structure to reduce risk of gold embrittlement in solder joints

Solder metal, soldering flux and solder paste

Doped contact formations

In-situ alloyed solders, articles made thereby, and processes of making same

Soldering method and solder joints formed therein

Method and structure to reduce risk of gold embrittlement in solder joints

Electronic devices and methods of forming electronic devices

Nanotube modified solder thermal intermediate structure, systems, and methods

Solder pastes for providing high elasticity, low rigidity solder joints

Surface reactive preservative for use with solder preforms

Method for centering a sputter target onto a backing plate and the assembly thereof

Diffusion solder position, and process for producing it

Method of soldering and solder compositions

Electronic assembly with solder-bonded heat sink

Solder composition

[SOLDER COMPOSITION]

Method of controlling solder deposition utilizing two fluxes and preform

Indium-niobium superconducting solder columns for cryogenic and quantum computer applications and methods for making same

Liquid metal flip chip devices

Methods to form electrical-mechanical connections between two surfaces, and systems and compositions suitable for such methods