B23K35/268 - CPC Classification Index

ClassID:

43386 ⎘

B23K35/268 - CPC Classification

Classification description:

Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material; Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C Pb as the principal constituent

Recent Application in this class:

20230256532

2023-08-17

JOINING OF LEAD AND LEAD ALLOYS

20230146164

2023-05-11

PASSIVE QUENCH PROTECTION TECHNIQUES FOR NON-INSULATED SUPERCONDUCTING MAGNETS

20220203482

2022-06-30

Solder and method for producing high purity lead

20220064760

2022-03-03

Co-production of lead and tin products

20210172039

2021-06-10

Copper production process

20210118843

2021-04-22

Soldering a conductor to an aluminum metallization

20200392604

2020-12-17

Pyrorefining process

20200346293

2020-11-05

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALS

20200243480

2020-07-30

Soldering a conductor to an aluminum metallization

#10

20200219841

2020-07-09

Soldering a conductor to an aluminum metallization

#11

20200023473

2020-01-23

Solder and method for producing high purity lead

#12

20190035764

2019-01-31

Soldering a conductor to an aluminum metallization

#13

20180318969

2018-11-08

Solder for Limiting Substrate Damage Due to Discrete Failure

#14

20180318968

2018-11-08

Solder for Limiting Substrate Damage Due to Discrete Failure

#15

20180117674

2018-05-03

Eutectic Alloy Bonding for Foreign Parts or Items During the Additive Manufacturing Process

#16

20170348807

2017-12-07

COATED SOLDER WIRE AND METHOD FOR MANUFACTURING SAME

#17

20170320172

2017-11-09

High quality, void and inclusion free alloy wire

#18

20170239756

2017-08-24

LASER MANUFACTURING OF SOLDER PREFORMS

#19

20170202539

2017-07-20

ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME

#20

20170100802

2017-04-13

Coated solder material and method for producing same

#21

20170094782

2017-03-30

Printed circuit board with flux reservoir

#22

20170079147

2017-03-16

Lead solder joint structure and manufacturing method thereof

#23

20170036307

2017-02-09

Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal

#24

20170006705

2017-01-05

Adaptive interposer and electronic apparatus

#25

20160368103

2016-12-22

Alternative compositions for high temperature soldering applications

#26

20150360325

2015-12-17

Stick electrode

#27

20150314396

2015-11-05

Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component

#28

20150243808

2015-08-27

Glass comprising molybdenum and lead in a solar cell paste

#29

20150196978

2015-07-16

SOLDER ALLOY

#30

20150099316

2015-04-09

Method of forming metal bonding layer and method of manufacturing semiconductor light emitting device using the same

#31

20150083217

2015-03-26

Conductive paste composition and semiconductor devices made therefrom

#32

20140158255

2014-06-12

Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same

#33

20140042212

2014-02-13

Electrically conductive compositions comprising non-eutectic solder alloys

#34

20130068290

2013-03-21

Conductive paste composition and semiconductor devices made therefrom

#35

20130042912

2013-02-21

SOLDER BONDED BODY, METHOD OF PRODUCING SOLDER BONDED BODY, ELEMENT, PHOTOVOLTAIC CELL, METHOD OF PRODUCING ELEMENT AND METHOD OF PRODUCING PHOTOVOLTAIC CELL

#36

20120266461

2012-10-25

Method for conductively connecting a component on a transparent substrate

#37

20110265913

2011-11-03

Thermally decomposable polymer coated metal powders

#38

20110227228

2011-09-22

FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

#39

20110115084

2011-05-19

Lead-free solder connection structure and solder ball

#40

20110094679

2011-04-28

Electrode assembly for the removal of surface oxides by electron attachment

#41

20110067911

2011-03-24

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

#42

20100273022

2010-10-28

Dual additive soldering

#43

20100206133

2010-08-19

Method of refining solder materials

#44

20100127047

2010-05-27

METHOD OF INHIBITING A FORMATION OF PALLADIUM-NICKEL-TIN INTERMETALLIC IN SOLDER JOINTS

#45

20090310318

2009-12-17

ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LEAD-BASED ASSEMBLY CONDITIONS

#46

20090236236

2009-09-24

Removal of surface oxides by electron attachment

#47

20090233119

2009-09-17

Electrical connector

#48

20090223831

2009-09-10

Removal of surface oxides by electron attachment

#49

20090200522

2009-08-13

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

#50

20090170380

2009-07-02

Electrical connector

#51

20080295966

2008-12-04

Electrode assembly for the removal of surface oxides by electron attachment

#52

20080149690

2008-06-26

Removal of surface oxides by electron attachment for wafer bumping applications

#53

20070284722

2007-12-13

Semiconductor device package utilizing proud interconnect material

#54

20070257091

2007-11-08

Chip Module Having Solder Balls Coated with a Thin Cast Polymer Barrier Layer for Corrosion Protection and Reworkability, and Method for Producing Same

#55

20070216023

2007-09-20

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

#56