Patents-Review.com
ClassID:

43424 ⎘

B23K35/3615 - CPC Classification

Classification description:

Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material; Selection of non-metallic compositions, e.g. coatings, fluxes ; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents N-compounds

Recent Application in this class:
#1
20250269473
2025-08-28

CONDUCTIVE PASTE FOR BONDING

 #2
20250058413
2025-02-20

Solder Paste for Connection Pin

 #3
20230256547
2023-08-17

Flux and solder paste

 #4
20220355422
2022-11-10

LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOLDER MATERIAL, AND METHOD OF FORMING A LAYER STRUCTURE

 #5
20220226940
2022-07-21

Non-aqueous solder flux composition

 #6
20220097181
2022-03-31

Solder composition and electronic substrate

 #7
20210078113
2021-03-18

Flux and solder paste

 #8
20200398383
2020-12-24

Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package

 #9
20200376609
2020-12-03

Flux, resin flux cored solder, and flux coated pellet

 #10
20190366487
2019-12-05

Flux and solder paste

 #11
20190232439
2019-08-01

Self-heating solder flux material

 #12
20190210167
2019-07-11

Flux

 #13
20190182966
2019-06-13

Solder paste using a solder paste flux and solder powder

 #14
20190009375
2019-01-10

Solder paste for reduction gas, and method for producing soldered product

 #15
20180339375
2018-11-29

Flux composition for solder applications

 #16
20180318969
2018-11-08

Solder for Limiting Substrate Damage Due to Discrete Failure

 #17
20180318968
2018-11-08

Solder for Limiting Substrate Damage Due to Discrete Failure

 #18
20180147675
2018-05-31

Solder paste containing solder powder and flux

 #19
20180126497
2018-05-10

Self-heating solder flux material

 #20
20170287862
2017-10-05

Cu column, Cu core column, solder joint, and through-silicon via

 #21
20170141074
2017-05-18

METAL PREPARATION FOR CONNECTING COMPONENTS

 #22
20170120396
2017-05-04

SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME

 #23
20170106479
2017-04-20

Flux formulations

 #24
20160316572
2016-10-27

METHOD FOR MOUNTING A COMPONENT ON A SUBSTRATE

 #25
20160250722
2016-09-01

HIGH-CONCENTRATION FLUX FOR BEING SPRAYED ON PREFORM

 #26
20150337081
2015-11-26

Thermally decomposable polymer compositions incorporating thermally activated base generators

 #27
20140131080
2014-05-15

Surface treating composition for copper and copper alloy and utilization thereof

 #28
20130276937
2013-10-24

Lead-free solder flux and lead-free solder paste

 #29
20120318854
2012-12-20

Thermally decomposable polymer compositions incorporating thermally activated base generators

 #30
20070113930
2007-05-24

Imidazole compound and use thereof

 #31
20050241731
2005-11-03

Flux composition and techniques for use thereof

 #32
20050218195
2005-10-06

Underfill fluxing curative