43422 ⎘
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material; Selection of non-metallic compositions, e.g. coatings, fluxes ; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Sub-classes:PLATELET NANOPARTICLES, COMPOSITIONS THEREOF, AND FORMATION THEREOF
#2FLUX AND SOLDER PASTE
#3THERMAL BONDING SHEET, AND DICING TAPE-EQUIPPED THERMAL BONDING SHEET
#4LOW-SLAG WIRE WITH EXCELLENT WELDABILITY
#5FLUX AND SOLDER PASTE COMPRISING SAID FLUX
#6FLUX, SOLDER PASTE, AND METHOD OF PRODUCING JOINED BODY
#7Flux and method for producing assembly
#8TRANSIENT LIQUID PHASE BONDING OF SURFACE COATINGS AND METAL-COVERED MATERIALS
#9POLYMERIC COMPONENT AND METHOD OF MAKING THE SAME
#10BRAZING PASTE
#11Flux and solder paste
#12FLUX
#13Flux and solder paste
#14Flux, solder paste and method for producing soldered product
#15Flux and solder material
#16FLUX AND SOLDER PASTE
#17FLUX AND SOLDER PASTE
#18Flux and Solder Paste Using the Same
#19Transient liquid phase bonding of surface coatings and metal-covered materials
#20Flux and Solder Material
#21METAL-CORED ELECTRODE FOR PRODUCING LOWER SLAG VOLUME WELDS
#22Flux
#23Composite welding wire and method of manufacturing
#24LOW MANGANESE EMITTING WELDING FLUX
#25Systems and methods for welding mill scaled workpieces
#26Braze for ceramic and ceramic matrix composite components
#27Flux
#28SOLDER FLUX CONTAINING FLUORESCENT MICROCAPSULES AND METHOD TO VISUALIZE UNACTIVATED SOLDER FLUX
#29Method for bonding electronic component and method for manufacturing bonded body
#30Systems and methods for corrosion-resistant welding electrodes
#31Joint manufacturing method
#32Flux composition for solder applications
#33FLUX AND SOLDER PASTE
#34Method for producing soldered product
#35Conductive nodes
#36COMPOSITION OF SOLID-CONTAINING PASTE
#37Mounting Method of a semiconductor device using a colored auxiliary joining agent
#38Flux
#39Carbon-coated metal-powder, conductive paste containing carbon-coated metal powder and multilayer electronic component using same, and method for manufacturing carbon-coated metal powder
#40Laser cladding using flexible cord of hardfacing material with diamond
#41Noble metal paste for bonding of semiconductor element
#42No clean flux composition and methods for use thereof
#43Carbon-coated metal powder, conductive paste containing carbon-coated metal powder and multilayer electronic component using same, and method for manufacturing carbon-coated metal powder
#44Process for making a boric acid free flux
#45Boric acid free flux
#46Control of intermetallic compound growth in aluminum to steel resistance welding
#47Flux-Coated Ball and Method of Manufacturing the Same
#48NO CLEAN FLUX COMPOSITION AND METHODS FOR USE THEREOF
#49Method of printing solder paste
#50Methods of forming solar cells with fired multilayer film stacks
#51Fired multilayer stacks for use in integrated circuits and solar cells
#52Print-on pastes for modifying material properties of metal particle layers
#53Nickel particle composition, bonding material, and bonding method in which said material is used
#54Conductive paste
#55SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME
#56Bonding material and bonding method using same
#57Flux formulations
#58Coated solder material and method for producing same
#59Systems and methods for welding wires for welding zinc-coated workpieces
#60Paste and process for forming a solderable polyimide-based polymer thick film conductor
#61Thermally decomposable polymer compositions for forming microelectronic assemblies
#62Alternative compositions for high temperature soldering applications
#63Braze for ceramic and ceramic matrix composite components
#64Method for mounting a decorative element on a support and said support
#65Rosin-free thermosetting flux formulations
#66Solder alloy, solder paste, and electronic circuit board
#67Solder alloy, solder composition, solder paste, and electronic circuit board
#68Method for joining at least two metal workpiece parts to each other by means of explosion welding
#69Conductive compositions and methods of using them
#70HIGH-CONCENTRATION FLUX FOR BEING SPRAYED ON PREFORM
#71Cleaning flux, cleaning solder paste, and solder joint
#72Plate heat exchanger
#73Method for joining metal parts
#74Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder and flux coated solder
#75Flux, solder paste and solder joint
#76Joining to aluminum
#77Transient liquid phase bonding of surface coatings metal-covered materials
#78Systems and methods for welding mill scaled workpieces
#79Tin-based solder composition with low void characteristic
#80SINTER PASTE WITH PARTIALLY OXIDIZED METAL PARTICLES
#81Aqueous aluminum brazing composition
#82Flux and solder paste
#83Welding electrode
#84METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WITH RADIATION CURABLE OR THERMAL CURABLE SOLDER FLUX
#85Photocurable compositions
#86Flux, solder composition, and method for manufacturing electronic circuit mounted substrate
#87Systems and methods for corrosion-resistant welding electrodes
#88AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
#89Flux for soldering and solder paste composition
#90Composite nanometal paste containing copper filler and joining method
#91Resin composition for solder bump formation, solder bump formation method, and member having solder bumps
#92Solder Paste
#93Conductive particles, method for producing conductive particles, conductive material and connection structure
#94Packaging methods and packaged semiconductor devices
#95Solder paste
#96Boric acid free flux
#97Packaging methods and packaged semiconductor devices
#98Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same
#99Conductive compositions and methods of using them
#100Composition of solid-containing paste
#101Multi-solder techniques and configurations for integrated circuit package assembly
#102Flux materials for heated solder placement and associated techniques and configurations
#103Paste for joining components of electronic modules, system and method for applying the paste
#104Systems and methods for welding electrodes
#105Flux formulations
#106Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method
#107Packaging Methods and Packaged Semiconductor Devices
#108Method for making a solder joint
#109Lead-free solder paste
#110Liquid concentrate for cleaning composition, cleaning composition and cleaning method
#111Dispersion, method for producing same, and use thereof
#112FLUX COMPOSITION, PROCESS FOR PRODUCING ELECTRICALLY CONNECTED STRUCTURES, ELECTRICALLY CONNECTED STRUCTURE, AND SEMICONDUCTOR DEVICE
#113Flux composition and techniques for use thereof
#114Permanent conversion adapter for lighting fixtures
#115Thermally decomposable polymer coated metal powders
#116SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
#117GREASE COMPOSITION AND PROCESS FOR PRODUCTION THEREOF
#118Solder bonding structure and soldering flux
#119Dual additive soldering
#120METAL PASTES AND USE THEREOF IN THE PRODUCTION OF POSITIVE ELECTRODES ON P-TYPE SILICON SURFACES
#121SOLDERING FLUX, SOLDER PASTE COMPOSITION AND SOLDERING METHOD
#122Solder flux
#123Mono-acid hybrid conductive composition and method
#124Solder pastes comprising nonresinous fluxes
#125Solder preform and a process for its manufacture
#126Organic solderability preservative comprising high boiling temperature alcohol
#127Bonding method and bonding material using metal particle
#128Hydrofluoroether compounds and processes for their preparation and use
#129Flux for Lead-Free Solder and Solder Paste
#130Flux composition for solder, solder paste, and method of soldering
#131Heat-resistant water-soluble flux composition for soldering
#132METHOD OF FLUXING USING A FLUXING COMPOSITION CONTAINING COMPOUNDS WITH AN AROMATIC RING AND NO IMINO GROUP
#133Carbon to weld metal
#134No-clean low-residue solder paste for semiconductor device applications
#135Thermosetting flux and solder paste
#136Solder paste
#137Fluxing compositions
#138Lead-free solder paste
#139Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof
#140Copper-plated wires for gas-shielded arc welding
#141Method of forming a flux layer on an aluminum plate member
#142Solder for fabricating solder bumps and pumping process
#143Aqueous aluminum brazing composition, aluminum material coated with the brazing composition, brazing method using the aluminum material, and automotive heat exchanger manufactured by using the brazing method
#144Dual additive soldering
#145Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
#146Preflux, flux, solder paste and method of manufacturing lead-free soldered body
#147Solder pastes for providing high elasticity, low rigidity solder joints
#148Surface reactive preservative for use with solder preforms
#149Thermosetting flux and solder paste
#150Multi-functional solder and articles made therewith, such as microelectronic components
#151Multi-functional solder and articles made therewith, such as microelectronic components
#152Multi-functional solder and articles made therewith, such as microelectronic components
#153Method of controlling solder deposition utilizing two fluxes and preform