43427 ⎘
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material; Selection of non-metallic compositions, e.g. coatings, fluxes ; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents Carboxylic acids or salts
COMPOSITION CONTAINING METAL PARTICLES, BONDING PASTE, AND BONDING BODY
#2FLUX AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
#3FLUX AND SOLDER PASTE
#4FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED BODY
#5BONDING MATERIAL AND BONDING STRUCTURE
#6SOLDER MATERIAL, LAYER STRUCTURE, AND METHOD OF FORMING A LAYER STRUCTURE
#7FLUX AND SOLDER PASTE COMPRISING SAID FLUX
#8LOW PRESSURE SINTERING POWDER
#9WATER-SOLUBLE FLUX AND SOLDER PASTE
#10METAL PASTE FOR BONDING, AND METHOD FOR MANUFACTURING BONDED BODY
#11STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID
#12Flux and solder paste
#13FLUX-COATED BALL AND METHOD FOR MANUFACTURING SAME
#14PRINTABLE SURFACE TREATMENT FOR ALUMINUM BONDING
#15Processing method of formic acid soldering
#16Flux and solder paste
#17SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
#18FLUX AND SOLDER PASTE
#19INDIUM SOLDER PASTE COMPOSITIONS
#20Solder paste
#21LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOLDER MATERIAL, AND METHOD OF FORMING A LAYER STRUCTURE
#22METAL COMPOSITION, BONDING MATERIAL
#23METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECTION PARTNER
#24Stable undercooled metallic particles for filling a void
#25BONDING AND SEALING MATERIAL, AND LID FOR OPTICAL DEVICE PACKAGE
#26Stable undercooled metallic particles for engineering at ambient conditions
#27Solder composition and electronic substrate
#28Solder paste
#29Flux and solder paste
#30Low pressure sintering powder
#31Solder paste and mounting structure
#32SOLDER PASTE AND JOINING STRUCTURE
#33Flux, resin flux cored solder, and flux coated pellet
#34Flux and solder material
#35Metal paste and thermoelectric module
#36Flux, solder paste, and method for producing electric circuit board
#37Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
#38Flux and Solder Paste
#39Stable undercooled metallic particles for engineering at ambient conditions
#40Solder paste using a solder paste flux and solder powder
#41Systems and methods for corrosion-resistant welding electrodes
#42Joint manufacturing method
#43Flux composition for solder applications
#44Solder for Limiting Substrate Damage Due to Discrete Failure
#45Solder for Limiting Substrate Damage Due to Discrete Failure
#46Metal paste and thermoelectric module
#47CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
#48Flux
#49Metal paste and use thereof for joining components
#50Flux composition containing carbon component, solder paste containing the same, and soldering method
#51Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device
#52Enhanced cleaning for water-soluble flux soldering
#53METAL COMPOSITION, BONDING MATERIAL
#54Solder flux
#55SOLDER PASTE AND SOLDERING FLUX, AND MOUNTED STRUCTURE USING SAME
#56Flux formulations
#57Bonding material and bonding method using same
#58Systems and methods for welding wires for welding zinc-coated workpieces
#59Thermally decomposable polymer compositions for forming microelectronic assemblies
#60Low pressure sintering powder
#61Stable undercooled metallic particles for engineering at ambient conditions
#62FLUX FOR SOLDERING AND SOLDER COMPOSITION
#63METHOD FOR MOUNTING A COMPONENT ON A SUBSTRATE
#64Soldering process
#65Solder paste with oxalic acid and amine component
#66Solder alloy, solder paste, and electronic circuit board
#67Solder alloy, solder composition, solder paste, and electronic circuit board
#68HIGH-CONCENTRATION FLUX FOR BEING SPRAYED ON PREFORM
#69CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
#70Flux, solder paste and solder joint
#71Bonding method using bonding material
#72Bonding material and bonding method using the same
#73Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#74SN-AG-CU-BASED SOLDER POWDER AND SOLDER PASTE USING SAID POWDER
#75Thermally decomposable polymer compositions incorporating thermally activated base generators
#76Flux composition
#77Flux Composition and Techniques for Use Thereof
#78Flux, solder composition, and method for manufacturing electronic circuit mounted substrate
#79Systems and methods for corrosion-resistant welding electrodes
#80Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
#81Oxygen source-containing composite nanometal paste and joining method
#82Cream solder composition
#83Conductive particles, method for producing conductive particles, conductive material and connection structure
#84Biomaterial, joint prosthesis using the biomaterial and method of producing the same
#85Lead-free solder alloy
#86Systems and methods for welding electrodes
#87Flux method for tin and tin alloys
#88Soldering paste and flux
#89Lead-free solder paste
#90Polyamine, carboxylic acid flux composition and method of soldering
#91Amine, carboxylic acid flux composition and method of soldering
#92Curable amine, carboxylic acid flux composition and method of soldering
#93PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
#94Solder paste composition, a solder paste and a soldering flux
#95Bonding material, bonded portion and circuit board
#96Process for manufacturing a device comprising brazes produced from metal oxalate
#97Thermally decomposable polymer compositions incorporating thermally activated base generators
#98Bonding material and bonding method using the same
#99Flux composition and techniques for use thereof
#100Metal paste with co-precursors
#101Metal paste with oxidizing agents
#102Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes
#103Flux and solder material and method of making same
#104Soldering process
#105Flux and solder material and method of making same
#106SOLDER MATERIAL COMPRISING A METAL STEARATE AND USE OF METAL STEARATES IN SOLDER MATERIALS
#107SOLDERING PROCESS
#108Biomaterial, joint prosthesis using the biomaterial and method of producing the same
#109SOLDERING FLUX, SOLDER PASTE COMPOSITION AND SOLDERING METHOD
#110Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#111Bonding material, bonded portion and circuit board
#112Solder flux
#113Lead-free solder composition including microcapsules
#114Flux for lead-free solder and soldering method
#115Joint structure, joining method, wiring board and method for producing the same
#116Flux for soldering and method for manufacturing an electronic device using the same
#117Solder pastes comprising nonresinous fluxes
#118SOLDER AND METHODS OF MAKING SOLDER
#119Solder preform and a process for its manufacture
#120SOLDER FLUX COMPOSITION AND PROCESS OF USING SAME
#121Flux composition for solder, solder paste, and method of soldering
#122Solder flux composition
#123Thermosetting flux and solder paste
#124Flux for soldering, soldering method, and printed circuit board
#125Soldering method
#126SOLID WIRE FOR GAS SHIELDED ARC WELDING
#127Microelectronic devices having underfill materials with improved fluxing agents
#128Flux for soldering, soldering method, and printed circuit board
#129Solder paste and process
#130Flux composition and techniques for use thereof
#131Soldering process
#132Semiconductor flip-chip package and method for the fabrication thereof
#133Underfill fluxing curative
#134Soldering method and solder joint member
#135Thermosetting flux and solder paste
#136Solder composition
#137Multi-functional solder and articles made therewith, such as microelectronic components
#138Multi-functional solder and articles made therewith, such as microelectronic components
#139Multi-functional solder and articles made therewith, such as microelectronic components