B24B27/06 - CPC Classification Index

ClassID:

44684 ⎘

B24B27/06 - CPC Classification

Classification description:

Other grinding machines or devices Grinders for cutting-off

Sub-classes:

B24B27/0608 » {using a saw movable on slideways} 6
B24B27/0616 » {using a tool turning around the workpiece} 8
B24B27/0625 » {whereby the workpieces are radially fed by means of a turning drum} 0
B24B27/0633 » {using a cutting wire} 98
B24B27/0641 » {for grinding holes} 2
B24B27/065 » {the saw being mounted on a pivoting arm} 13
B24B27/0658 » {for cutting workpieces while they are turning about their longitudinal axis} 6
B24B27/0666 » {the saw blade being arranged underneath a work-table} 2
B24B27/0675 » {methods therefor} 19
B24B27/0683 » {Accessories therefor} 12
B24B27/08 » being portable 75

Recent Application in this class:

20260001186

2026-01-01

CYLINDRICAL GRINDING DEVICE, CYLINDRICAL GRINDING METHOD, AND WAFER MANUFACTURING METHOD

20240416478

2024-12-19

MATERIAL CUTTING AND GRINDING DEVICE

20240300039

2024-09-12

STATIC DISCHARGE MITIGATION OF POWER TOOLS

20240217138

2024-07-04

TILE SAW WITH ADJUSTABLE FENCE AND METHODS

20230364730

2023-11-16

Device for cutting connection of multi-piece module electrode

20230249310

2023-08-10

PARTING MACHINE, WORKPIECE POSITIONING DEVICE

20230103899

2023-04-06

MACHINING APPARATUS

20220305608

2022-09-29

Cutting apparatus

20220143776

2022-05-12

Grinding wheel cutting apparatus and cutting method

#10

20220016802

2022-01-20

METHOD FOR SLICING WORKPIECE AND WIRE SAW

#11

20210308905

2021-10-07

CUTTING METHOD AND CUTTING DEVICE

#12

20210308871

2021-10-07

Wire saw device, and processing method and processing device for workpiece

#13

20210252617

2021-08-19

Static discharge mitigation of power tools

#14

20210213549

2021-07-15

DUST COLLECTING BOX FOR METALWORKING STATIONARY CUTTING MACHINE, AND METALWORKING STATIONARY CUTTING MACHINE

#15

20200180185

2020-06-11

Tile saw with adjustable fence and methods

#16

20200072324

2020-03-05

Belt tensioning apparatus for material removal machines

#17

20190308291

2019-10-10

Method and apparatus for leveling and grinding surfaces

#18

20190295850

2019-09-26

Cutting apparatus

#19

20190184591

2019-06-20

Methods and apparatus for cutting cushioned divider material for use in creating sub-compartments in a container

#20

20190105750

2019-04-11

Method for manufacturing wire saw apparatus and wire saw apparatus

#21

20190084124

2019-03-21

Cutting blade mounting mechanism

#22

20190062670

2019-02-28

CUTTING FLUID, CUTTING METHOD, AND SMOOTHNESS IMPROVER FOR CUT SURFACE

#23

20190039201

2019-02-07

Parting machine, workpiece positioning device

#24

20180297168

2018-10-18

SEMICONDUCTOR WAFER PROCESSING METHOD

#25

20180178410

2018-06-28

Rare earth sintered magnet fastening jig

#26

20180166282

2018-06-14

Wafer processing method for reforming protective film

#27

20180154494

2018-06-07

Fishing pole grip modification system and method of using same

#28

20180079108

2018-03-22

Wire saw apparatus

#29

20170343528

2017-11-30

Method for evaluating abrasive grains, and method for manufacturing silicon wafer

#30

20170341170

2017-11-30

Methods and devices for dicing components from a sheet of copper alloy

#31

20170072594

2017-03-16

Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece

#32

20170014967

2017-01-19

Intelligent grinding device for short pulse electrical melt chip removal cooling

#33

20170005001

2017-01-05

Semiconductor wafer, semiconductor device diced from semiconductor wafer, and method for manufacturing semiconductor device

#34

20160236317

2016-08-18

Rotary gear transmission for tools

#35

20150273647

2015-10-01

Fishing pole grip modification system and method of using same

#36

20150202652

2015-07-23

Use of hardeners/densifiers in cutting or otherwise removing material from inorganic substrates

#37

20150107572

2015-04-23

Dicing blade

#38

20150038064

2015-02-05

Hand-guided power tool

#39

20150020667

2015-01-22

Cutting apparatus

#40

20150020666

2015-01-22

Cutting apparatus

#41

20130217310

2013-08-22

Wafer Processing Equipment

#42

20130074670

2013-03-28

WELD TAB MACHINING APPARATUS

#43

20120326371

2012-12-27

Magnet holding jig

#44

20120027660

2012-02-02

Methods to recover and purify silicon particles from saw kerf

#45

20120024761

2012-02-02

Methods to slice a silicon ingot

#46

20110272509

2011-11-10

Chopper for commingled fibers

#47

20110165822

2011-07-07

Rare earth magnet holding jig, cutting machine, and cutting method

#48

20110162504

2011-07-07

Rare earth magnet holding jig and cutting machine

#49

20110159319

2011-06-30

DISK-SHAPED GLASS SUBSTRATE AND METHOD OF MANUFACTURING DISK-SHAPED GLASS SUBSTRATE

#50

20110126814

2011-06-02

Band saw cutting apparatus and ingot cutting method

#51

20110097852

2011-04-28

Wafer processing method without occurrence of damage to device area

#52

20110070807

2011-03-24

MACHINING APPARATUS USING ROTARY GRINDER

#53

20100163462

2010-07-01

Methods to recover and purify silicon particles from saw kerf

#54

20070087661

2007-04-19

Dicing apparatus and dicing method

#55

20070066188

2007-03-22

Cutting method and cutting apparatus

#56

20060292968

2006-12-28

Apparatus for manufacturing magnetic head slider

#57

20060178098

2006-08-10

Machining apparatus

#58

20050166729

2005-08-04

Method of manufacturing honeycomb structural body