B24B27/0633 - CPC Classification Index

#1

20260138306

2026-05-21

CONTINUOUS CUTTING HORIZONTAL MULTI-WIRE STONE CUTTING MACHINE

#2

20260077446

2026-03-19

CUTTING-OFF AND GRINDING INTEGRATED MACHINE AND CONTROL METHOD THEREFOR

#3

20240246260

2024-07-25

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SAW, AND SEMICONDUCTOR WAFERS MADE OF MONOCRYSTALLINE SILICON

#4

20220410434

2022-12-29

Wire saw having dust collecting apparatus

#5

20220379426

2022-12-01

Method for simultaneously cutting a plurality of disks from a workpiece

#6

20220040882

2022-02-10

Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon

#7

20210362373

2021-11-25

Wire saw apparatus and method for manufacturing wafer

#8

20210308871

2021-10-07

Wire saw device, and processing method and processing device for workpiece

#9

20210146575

2021-05-20

Method for manufacturing hexagonal semiconductor plate crystal

#10

20210114257

2021-04-22

Method for slicing ingot and wire saw

#11

20210016413

2021-01-21

Method for slicing workpiece and wire saw

#12

20200307009

2020-10-01

Method and device for cutting a mat or a panel of mineral wool or a board or a panel of porous construction material

#13

20200016719

2020-01-16

Method for slicing ingot

#14

20190232404

2019-08-01

Metal wire, saw wire, cutting apparatus, and method of manufacturing metal wire

#15

20190105750

2019-04-11

Method for manufacturing wire saw apparatus and wire saw apparatus

#16

20190091782

2019-03-28

Abrasive article and method of forming

#17

20190084220

2019-03-21

Three-dimensional object manufacturing method, three-dimensional object, and shaping device

#18

20180326590

2018-11-15

WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WORKPIECE

#19

20180281147

2018-10-04

Method for slicing workpiece and wire saw

#20

20180215074

2018-08-02

ABRASIVE DIAMOND GRAIN FOR WIRE TOOL AND WIRE TOOL

#21

20180206371

2018-07-19

Electronic component removal device

#22

20180079109

2018-03-22

METHOD FOR MANUFACTURING HEXAGONAL SEMICONDUCTOR PLATE CRYSTAL

#23

20180079108

2018-03-22

Wire saw apparatus

#24

20170252897

2017-09-07

Abrasive article and method of forming

#25

20170072594

2017-03-16

Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece

#26

20170015019

2017-01-19

Method for slicing workpiece and processing liquid

#27

20160368069

2016-12-22

MULTI-WIRE SAW

#28

20160303765

2016-10-20

Method for slicing workpiece and workpiece holder

#29

20160263726

2016-09-15

ABRASIVE ARTICLE AND METHOD OF FORMING

#30

20160250776

2016-09-01

Method for slicing workpiece

#31

20160236375

2016-08-18

Silicon carbide ingot and method for manufacturing silicon carbide substrate

#32

20160176069

2016-06-23

Method for slicing ingot and wire saw

#33

20160175953

2016-06-23

Wire saw

#34

20160144481

2016-05-26

Abrasive article and method of forming

#35

20160121424

2016-05-05

Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus

#36

20160102265

2016-04-14

Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries

#37

20150328800

2015-11-19

Method of resuming operation of wire saw

#38

20150314484

2015-11-05

Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece

#39

20150303049

2015-10-22

Method for processing semiconductor wafer

#40

20150290728

2015-10-15

Wire saw apparatus and cut-machining method

#41

20150283666

2015-10-08

ABRASIVE-GRAIN WIRE TOOL

#42

20150273599

2015-10-01

Abrasive articles including abrasive particles bonded to an elongated body

#43

20150266117

2015-09-24

Work cutting method and single-wire type wire saw

#44

20150202797

2015-07-23

Wire saw and workpiece machining method employing same

#45

20150083104

2015-03-26

Method for simultaneously cutting a multiplicity of wafers from a workpiece

#46

20150068131

2015-03-12

Process and apparatus for manufacturing an abrasive wire

#47

20150040884

2015-02-12

FIXED ABRASIVE GRAIN WIRE SAW, ITS MANUFACTURING METHOD, AND METHOD OF CUTTING WORKPIECE BY USING IT

#48

20150000590

2015-01-01

Methods, wires, and apparatus for slicing hard materials

#49

20140339682

2014-11-20

Semiconductor device and method for manufacturing semiconductor device

#50

20140234568

2014-08-21

Sapphire substrate

#51

20140216222

2014-08-07

Method for slicing workpiece and wire saw

#52

20140013675

2014-01-16

Abrasive article and method of forming

#53

20140007513

2014-01-09

Abrasive article for abrading and sawing through workpieces and method of forming

#54

20130237402

2013-09-12

SAPPHIRE MATERIAL AND PRODUCTION METHOD THEREOF

#55

20130219801

2013-08-29

Abrasive articles including abrasive particles bonded to an elongated body

#56

20130205676

2013-08-15

Abrasive article and method of forming

#57

20130084786

2013-04-04

Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof

#58

20130081606

2013-04-04

Sawing apparatus of single crystal ingot

#59

20130069209

2013-03-21

Semiconductor device and method for manufacturing semiconductor device

#60

20130068209

2013-03-21

Methods, wires, and apparatus for slicing hard materials

#61

20130061841

2013-03-14

SAW WIRE AND METHOD OF MANUFACTURING GROUP III NITRIDE CRYSTAL SUBSTRATE USING THE SAME

#62

20130061535

2013-03-14

Abrasive article and method of forming

#63

20130032129

2013-02-07

SUPER-ABRASIVE GRAIN FIXED TYPE WIRE SAW, AND METHOD OF MANUFACTURING SUPER-ABRASIVE GRAIN FIXED TYPE WIRE SAW

#64

20120315739

2012-12-13

MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER

#65

20120298091

2012-11-29

Wire saw with tension detecting means and guide roller speed control

#66

20120298090

2012-11-29

Method of cutting workpiece with wire saw, and wire saw

#67

20120289126

2012-11-15

Sapphire substrates and methods of making same

#68

20120216787

2012-08-30

Saw wire

#69

20120214385

2012-08-23

Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries

#70

20120192848

2012-08-02

METHOD OF SLICING SILICON INGOT USING WIRE SAW AND WIRE SAW

#71

20120167482

2012-07-05

Abrasive article and method of forming

#72

20120125520

2012-05-24

ULTRASONIC BONDING TOOL, METHOD FOR MANUFACTURING ULTRASONIC BONDING TOOL, ULTRASONIC BONDING METHOD, AND ULTRASONIC BONDING APPARATUS

#73

20120017741

2012-01-26

Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder

#74

20110263187

2011-10-27

WIRE SAW AND METHOD FOR FABRICATING THE SAME

#75

20110126813

2011-06-02

MULTI-WIRE WAFER CUTTING APPARATUS AND METHOD

#76

20110100347

2011-05-05

Wire and methodology for cutting materials with wire

#77

20110100346

2011-05-05

Abrasive grain powder

#78

20110059679

2011-03-10

Method for slicing workpiece

#79

20110039070

2011-02-17

Abrasive articles including abrasive particles bonded to an elongated body

#80

20110009039

2011-01-13

METHOD AND APPARATUS FOR MANUFACTURING AN ABRASIVE WIRE

#81

20100258103

2010-10-14

Method for slicing workpiece by using wire saw and wire saw

#82

20100252017

2010-10-07

Method for slicing workpiece by using wire saw and wire saw

#83

20100206285

2010-08-19

Wire saw apparatus

#84

20100197202

2010-08-05

Method and product for cutting materials

#85

20100180880

2010-07-22

Method of improving nanotopography of surface of wafer and wire saw apparatus

#86

20100163010

2010-07-01

Slicing method and a wire saw apparatus

#87

20100163009

2010-07-01

Multi-wire saw and method for cutting ingot

#88

20100126488

2010-05-27

METHOD AND APPARATUS FOR CUTTING WAFERS BY WIRE SAWING

#89

20090293369

2009-12-03

Wire saw slurry recycling process

#90

20090288530

2009-11-26

Slicing method and method for manufacturing epitaxial wafer

#91

20090120422

2009-05-14

Electrodeposited wire tool

#92

20090084373

2009-04-02

Method of manufacturing (110) silicon wafer

#93

20090064983

2009-03-12

Methods, wires, and apparatus for slicing hard materials

#94

20080264228

2008-10-30

Wire guide roll for wire saw and method

#95

20080261499

2008-10-23

Fixed abrasive wire

#96

20070190912

2007-08-16

Apparatus and method for slicing an ingot

#97

20070190897

2007-08-16

Apparatus and method for slicing an ingot

#98

20070186917

2007-08-16

Apparatus and method for slicing an ingot

#99

20070023027

2007-02-01

Super abrasive grain wire saw winding structure, super abrasive grain wire saw cutting device, and super abrasive grain wire saw winding method

#100

20060249134

2006-11-09

Multi-wire saw

#101

20060107940

2006-05-25

Apparatus and method for slicing an ingot