44761 ⎘
Lapping machines or devices; Accessories; Control means for lapping machines or devices Temperature control
DOUBLE-SIDE POLISHING APPARATUS FOR WORKPIECE AND DOUBLE-SIDE POLISHING METHOD FOR WORKPIECE
#2POLISHING APPARATUS
#3THERMALLY CONDUCTIVE CHEMICAL MECHANICAL POLISHING (CMP) PAD
#4POLISHING APPARATUS
#5SLURRY-BASED TEMPERATURE CONTROL FOR CMP
#6HEAT CLEANING SYSTEM AND METHOD FOR CMP PAD BY-PRODUCT CONTROL
#7POLISHING PAD WITH HEAT DISSIPATION PATTERN
#8INFORMATION PROCESSING DEVICE, SUBSTRATE POLISHING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
#9CHEMICAL MECHANICAL POLISHING APPARATUS
#10APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
#11POLISHING PROCESS APPARATUS
#12SUBSTRATE LAPPING APPARATUS AND SUBSTRATE LAPPING METHOD USING THE SAME
#13COOLING CONTROL IN CHEMICAL MECHANICAL POLISHING
#14METHOD FOR CMP TEMPERATURE CONTROL
#15SUBSTRATE HOT SPOT CORRECTION FOR A CHEMICAL MECHANICAL POLISHING PROCESSS
#16SUBSTRATE TREATING APPARATUS
#17POLISHING HEAD AND POLISHING CARRIER APPARATUS HAVING THE SAME
#18SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
#19COLD LIQUID POLISHING CONTROL
#20TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
#21POLISHING DEVICE, SUBSTRATE TREATING APPARATUS, AND POLISHING METHOD
#22SUBSTRATE TREATING APPARATUS
#23STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING
#24CHEMICAL MECHANICAL POLISHING METHOD
#25SUBSTRATE POLISHING APPARATUS
#26Wafer Temperature Control System and Control Method, Computer Device, and Storage Medium
#27SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE
#28APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY
#29METHOD OF CREATING CORRELATION RELATIONAL FORMULA FOR DETERMINING POLISHING CONDITION, METHOD OF DETERMINING POLISHING CONDITION, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
#30SUBSTRATE POLISHING APPARATUS
#31CHEMICAL MECHANICAL POLISHING APPARATUS
#32SUBSTRATE PROCESSING DEVICE AND METHOD FOR OPERATING THE SAME
#33LIGHT INTENSITY ADJUSTMENT METHOD FOR OPTICAL FILM THICKNESS MEASURING DEVICE AND POLISHING APPARATUS
#34POLISHING METHOD, AND POLISHING APPARATUS
#35APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
#36POLISHING APPARATUS
#37Temperature control in chemical mechanical polish
#38METHOD FOR CMP TEMPERATURE CONTROL
#39SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
#40LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND IMPROVING PAD ASPERITY
#41PROCESSING APPARATUS
#42CLEANING OF CMP TEMPERATURE CONTROL SYSTEM
#43POLISHING APPARATUS
#44TEMPERATURE AND SLURRY FLOW RATE CONTROL IN CMP
#45CONTROL OF STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING
#46Apparatus and method for CMP temperature control
#47APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
#48POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#49Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen
#50CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL
#51SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL
#52SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
#53EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SYSTEM
#54Chemical-mechanical polishing apparatus
#55Polishing method and polishing apparatus
#56GAS ENTRAINMENT DURING JETTING OF FLUID FOR TEMPERATURE CONTROL IN CHEMICAL MECHANICAL POLISHING
#57CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMAGE RECOVERY
#58WET CHEMICAL HEATING SYSTEM AND A METHOD OF CHEMICAL MECHANICAL POLISHING
#59APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
#60TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
#61Pad-temperature regulating apparatus, and polishing apparatus
#62SUBSTRATE POLISHING SYSTEM AND SUBSTRATE POLISHING METHOD
#63Polishing solution, polishing apparatus, and polishing method
#64TEMPERATURE CONTROL WITH INTRA-LAYER TRANSITION DURING CMP
#65SUBSTRATE POLISHING APPARATUS
#66Double-side or one-side machine tool
#67Method of calibrating radiation thermometer and system thereof
#68Temperature regulating apparatus and polishing apparatus
#69Chemical mechanical planarization membrane
#70SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#71Polishing pad, method for producing the same and method of fabricating semiconductor device using the same
#72Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor device
#73Substrate polish edge uniformity control with secondary fluid dispense
#74Pad-temperature regulating apparatus, method of regulating pad-temperature, polishing apparatus, and polishing system
#75POLISHING APPARATUS
#76NOVEL AUTOMATED POLISHING SYSTEMS AND METHODS RELATING THERETO
#77Methods of detecting non-conforming substrate processing events during chemical mechanical polishing
#78Apparatus and method for CMP temperature control
#79Control of steam generation for chemical mechanical polishing
#80Temperature and slurry flow rate control in CMP
#81Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
#82Substrate processing apparatus
#83SEMICONDUCTOR SUBSTRATE POLISHING WITH POLISHING PAD TEMPERATURE CONTROL
#84Chemical-mechanical polishing apparatus
#85Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatus
#86Grinding/polishing devices with recall
#87Polishing method, polishing agent and cleaning agent for polishing
#88Polishing apparatus and polishing method
#89SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, AND APPARATUS FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD USED IN POLISHING APPARATUS
#90Chemical mechanical polishing apparatus including a multi-zone platen
#91Semiconductor wafer thermal removal control
#92System for adjusting pad surface temperature and polishing apparatus
#93SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
#94Polishing apparatus
#95Polishing head, substrate processing apparatus including the same and processing method of substrate using the same
#96External heating system for use in chemical mechanical polishing system
#97CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND POLISHING PAD AND CHEMICAL MECHANICAL POLISHING DEVICE
#98Apparatus and method for CMP temperature control
#99SLURRY TEMPERATURE CONTROL BY MIXING AT DISPENSING
#100Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
#101CHEMICAL MECHANICAL POLISHING METHOD AND CHEMICAL MECHANICAL POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#102Efficient ultra-precise shear thickening and chemical synergy polishing method
#103Polishing method and polishing apparatus
#104Channel cut polishing machine
#105Temperature-based assymetry correction during CMP and nozzle for media dispensing
#106Temperature-based in-situ edge assymetry correction during CMP
#107Chemical mechanical polishing temperature scanning apparatus for temperature control
#108Method of polishing silicon wafer
#109Apparatus and method for CMP temperature control
#110Chemical mechanical polishing system with platen temperature control
#111CMP APPARATUS AND METHOD OF PERFORMING CERIA-BASED CMP PROCESS
#112Temperature adjusting device and polishing device
#113Polishing apparatus of substrate
#114Apparatus and method for adjusting installation location of temperature sensor configured to measure surface temperature of wafer in semiconductor wafer cleaning apparatus
#115Method for polishing silicon wafer
#116Wet chemical heating system and a method of chemical mechanical polishing
#117Chemical mechanical polishing method
#118Temperature control of chemical mechanical polishing
#119Temperature Control of Chemical Mechanical Polishing
#120Chemical mechanical polishing apparatus and method
#121Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine
#122Lapping system that includes a lapping plate temperature control system, and related methods
#123Temperature control in chemical mechanical polish
#124METHOD OF REGULATING A SURFACE TEMPERATURE OF POLISHING PAD, AND POLISHING APPARATUS
#125Chemical mechanical polishing apparatus containing hydraulic multi-chamber bladder and method of using thereof
#126Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
#127Polishing device
#128PAD TEMPERATURE ADJUSTMENT APPARATUS FOR ADJUSTING TEMPERATURE OF POLISHING PAD, AND POLISHING APPARATUS
#129SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, AND APPARATUS FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD USED IN POLISHING APPARATUS
#130Temperature control of chemical mechanical polishing
#131Planarization apparatus and planarization method thereof
#132HEAT EXCHANGER FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD, POLISHING APPARATUS HAVING SUCH HEAT EXCHANGER, POLISHING METHOD FOR SUBSTRATE USING SUCH HEAT EXCHANGER, AND COMPUTER-READABLE STORAGE MEDIUM STORING A PROGRAM FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD
#133Polishing method and polishing apparatus
#134Chemical mechanical planarization membrane
#135Method of controlling a temperature of a chemical mechanical polishing process, temperature control, and CMP apparatus including the temperature control
#136METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#137Chemical-mechanical planarization system
#138Temperature control in chemical mechanical polish
#139Wafer polishing method and apparatus
#140Polishing method
#141Methods and systems for polishing pad control
#142Methods and systems for polishing pad control
#143Polishing apparatus and polishing method
#144Heat exchanger for regulating surface temperature of a polishing pad, polishing apparatus, polishing method, and medium storing computer program
#145Polishing method and polishing apparatus
#146Method and apparatus for polishing a substrate
#147Lapping pads and systems and methods of making and using the same
#148Surface planarization system and method
#149Polishing method and polishing apparatus
#150Polishing method and polishing apparatus
#151System and method of delivering slurry for chemical mechanical polishing
#152Apparatus and method for regulating surface temperature of polishing pad
#153In-situ temperature control during chemical mechanical polishing with a condensed gas
#154Chemical mechanical polishing method
#155Polishing apparatus including pad contact member with baffle in liquid flow path therein
#156Methods and systems for polishing pad control
#157Methods and apparatus for forming a resist array using chemical mechanical planarization
#158Surface planarization system and method
#159Monitoring device, monitoring method, and device for cutting and grinding display substrate
#160POLISHING APPARATUS AND POLISHING METHOD
#161CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS
#162Polishing apparatus
#163Chemical mechanical polishing (CMP) platform for local profile control
#164Thermographic characterization for surface finishing process development
#165Polishing device and polishing method
#166POLISHING METHOD AND METHOD FOR PRODUCING ALLOY MATERIAL
#167Method and apparatus for conditioning polishing pad
#168Method and apparatus for polishing a substrate
#169POLISH APPARATUS AND POLISH METHOD
#170Polishing apparatus having substrate holding apparatus
#171Polishing apparatus having thermal energy measuring means
#172Exhaust flow rate control apparatus and substrate processing apparatus provided therewith
#173Polishing method and polishing apparatus
#174Temperature modification for chemical mechanical polishing
#175Manufacturing method of semiconductor device
#176SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, AND APPARATUS FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD USED IN POLISHING APPARATUS
#177Sensors in Carrier Head of a CMP System
#178METHOD TO IMPROVE WITHIN WAFER UNIFORMITY OF CMP PROCESS
#179Temperature control of chemical mechanical polishing
#180Method and apparatus for polishing workpiece
#181Multiple Zone Temperature Control for CMP
#182Polishing method and polishing apparatus
#183Polishing apparatus, polishing pad, and polishing information management system
#184Method and apparatus for polishing a substrate
#185Polishing method
#186CHEMICAL-MECHANICAL POLISHING TOOL AND METHOD FOR PREHEATING THE SAME
#187Polishing apparatus having temperature regulator for polishing pad
#188CMP APPARATUS, POLISHING PAD AND CMP METHOD
#189POLISHING METHOD AND POLISHING APPARATUS
#190Polishing apparatus having thermal energy measuring means
#191Apparatus and method for temperature control during polishing
#192Semiconductor device manufacturing method
#193SLURRY MANUFACTURING METHOD, SLURRY AND POLISHING METHOD AND APPARATUS USING SLURRY
#194Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus
#195Optical disk restoration method and apparatus
#196TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
#197Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same
#198METHOD FOR CMP UNIFORMITY CONTROL
#199SEMICONDUCTOR MANUFACTURING APPARATUS
#200POLISHING APPARATUS AND POLISHING METHOD
#201Polishing apparatus
#202Use of pad conditioning in temperature controlled CMP
#203Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
#204Chemical mechanical polisher with heater and method
#205CMP by controlling polish temperature
#206CMP system and method using individually controlled temperature zones
#207TEMPERATURE CONTROL FOR ECMP PROCESS
#208Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
#209Apparatus for heating or cooling a polishing surface of a polishing apparatus
#210Machining machine with means for acquiring machining parameters
#211Polishing apparatus and polishing method
#212Double face polishing apparatus
#213Temperature control for ECMP process
#214Polishing apparatus and polishing method
#215Polishing method of Cu film and method for manufacturing semiconductor device
#216Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process
#217Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
#218Method for polishing substrate
#219Double sided polishing machine
#220Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
#221Method and system for material removal and planarization
#222Chemical mechanical polish process control method using thermal imaging of polishing pad
#223Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring
#224Polishing apparatus and method
#225Chemical mechanical polishing stopper film, process for producing the same, and method of chemical mechanical polishing
#226System and method for dissipating heat from a rotary power tool