44767 ⎘
Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
Aerosol method and apparatus, particulate products, and electronic devices made therefrom
#602Barrier polishing liquid and chemical mechanical polishing method
#603Method for improving mechanical properties of polymer particles and its applications
#604Metal- polishing liquid and chemical-mechanical polishing method using the same
#605POLISHING COMPOSITION
#606Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
#607Slurry compositions, methods of polishing polysilicon layers using the slurry compositions and methods of manufacturing semiconductor devices using the slurry compositions
#608Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same
#609Security features incorporating photoluminescent phosphor powders and methods for making security features
#610Texturing slurry and texturing method by using same
#611Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom
#612Polishing apparatus and method of polishing work
#613Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom
#614Method for fabricating semiconductor device and polishing method
#615Polishing method for semiconductor wafer
#616Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices
#617CMP wafer contamination reduced by insitu clean
#618Aqueous slurry containing metallate-modified silica particles
#619Use of CMP for aluminum mirror and solar cell fabrication
#620Polishing composition and polishing method
#621Polishing composition and polishing method
#622Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor
#623Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
#624Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
#625Cerium oxide abrasives for chemical mechanical polishing
#626Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same
#627Polishing technique to minimize abrasive removal of material and composition therefor
#628Polishing slurry composition and method of using the same
#629Composition and method for polishing a sapphire surface
#630Free radical-forming activator attached to solid and used to enhance CMP formulations
#631Method and composition for polishing a substrate
#632Abrasive partilcle for chemical mechanical polishing
#633Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
#634Chemical mechanical polishing compositions for metal and associated materials and method of using same
#635Dual reduced agents for barrier removal in chemical mechanical polishing
#636Cellulose-containing polishing compositions and methods relating thereto
#637Simultaneous planarization of pole piece and coil materials for write head applications
#638Polishing composition and polishing method using the same
#639Monitoring and control of a fabrication process
#640Polishing composition and polishing method using the same
#641Polishing composition
#642Compositions and methods for tantalum CMP
#643CMP formulations
#644Nickel powders, methods for producing powders and devices fabricated from same
#645Polishing method to reduce dishing of tungsten on a dielectric
#646Polishing composition
#647Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method
#648Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers
#649Multi-function slurry delivery system
#650Polishing slurry, method of producing same, and method of polishing substrate
#651Alumina abrasive for chemical mechanical polishing
#652Cathodoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
#653Polishing fluid and polishing method
#654Method of manufacturing semiconductor device
#655Polishig fluid for metallic films and method for producing semiconductor substrate using the same
#656Method of chemically mechanically polishing substrates
#657Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
#658Polishing composition and polishing method
#659Glass powders, methods for producing glass powders and devices fabricated from same
#660Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
#661CMP for corrosion-free CoFe elements for magnetic heads
#662Aerosol method and apparatus, particulate products, and electronic devices made therefrom
#663Aerosol method and apparatus, coated particulate products, and electronic devices made therefrom
#664Electroluminescent phosphor powders, methods for making phosphor powders, and devices incorporating same
#665Coated nickel-containing powders, methods and apparatus for producing such powders and devices fabricated from same
#666Abrasives for copper CMP and methods for making
#667Chemical-mechanical planarization slurries and powders and methods for using same
#668Aerosol method and apparatus, particulate products, and electronic devices made therefrom
#669Particulate or particle-bound chelating agents
#670Method and system for planarizing integrated circuit material
#671COMPOSITIONS COMPRISING GLASS PARTICLES AND METHODS OF DEPOSITING THE SAME
#672Methods and compositions for chemical mechanical planarization of ruthenium
#673Slurry for CMP, polishing method and method of manufacturing semiconductor device
#674Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom
#675Method for manufacturing SiC substrate
#676Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
#677CMP formulations
#678Slurry for CMP, polishing method and method of manufacturing semiconductor device
#679Method and device for determining parameters of near-surface dielectric layer in wafer grinding scene
#680Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment
#681Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds
#682Aqueous compositions of low abrasive silica particles
#683Aqueous compositions of stabilized aminosilane group containing silica particles
#684Chemical mechanical polishing pad with composite polishing layer