44773 ⎘
Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE USING THE SAME
#2CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMAGE RECOVERY
#3Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer
#4Polishing and loading/unloading component module
#5Offset head-spindle for chemical mechanical polishing
#6Metallographic grinder and components thereof
#7Polishing head in chemical mechanical polishing apparatus and chemical mechanical polishing apparatus including the same
#8Polishing apparatus and polishing method
#9Equipment and method for polishing both sides of a rectangular substrate