Patents-Review.com
ClassID:

44778 ⎘

B24B37/14 - CPC Classification

Classification description:

Lapping machines or devices; Accessories; Lapping tools; Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials

Recent Application in this class:
#1
20260145296
2026-05-28

SUBSTRATE POLISHING APPARATUS

 #2
20240316720
2024-09-26

SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL METHOD, AND PROGRAM

 #3
20240100646
2024-03-28

POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL

 #4
20240091900
2024-03-21

POLISHING APPARATUS AND POLISHING METHOD

 #5
20240042572
2024-02-08

GRINDING DISC AND SUBSTRATE CLEANING DEVICE

 #6
20230094483
2023-03-30

PAD CONDITIONER WITH POLYMER BACKING PLATE

 #7
20230082181
2023-03-16

FLUORINATED POLYUREA COPOLYMER PAD

 #8
20220362903
2022-11-17

MULTIPLE POLISHING HEADS WITH CROSS-ZONE PRESSURE ELEMENT DISTRIBUTIONS FOR CMP

 #9
20220250974
2022-08-11

Process for making anti-reflective optical glass and product thereof

 #10
20220063052
2022-03-03

SURFACE PLATE FOR POLISHING DEVICE, AND POLISHING DEVICE AND POLISHING METHOD

 #11
20220005716
2022-01-06

Substrate transporter and substrate processing apparatus including substrate transporter

 #12
20210379613
2021-12-09

APPARATUS FOR COATING A LAPPING PLATE PLATEN, AND RELATED METHODS OF USING

 #13
20210263418
2021-08-26

TOOL FOR MODIFYING A SUPPORT SURFACE

 #14
20200391343
2020-12-17

Planarization methods for packaging substrates

 #15
20200206866
2020-07-02

Polishing system with platen for substrate edge control

 #16
20200061644
2020-02-27

Apparatus for coating a lapping plate platen, and related methods of using

 #17
20190240799
2019-08-08

Substrate processing control system, substrate processing control method, and program

 #18
20190224806
2019-07-25

One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making

 #19
20190111541
2019-04-18

Polishing of electrostatic substrate support geometries

 #20
20190047111
2019-02-14

SURFACE PLATE FOR FINISH POLISHING, FINISH POLISHING DEVICE, AND POLISHING METHOD

 #21
20180182657
2018-06-28

Wafer pin chuck fabrication and repair

 #22
20180122684
2018-05-03

Wafer chuck featuring reduced friction support surface

 #23
20180104794
2018-04-19

Grinding wheel

 #24
20180001441
2018-01-04

Abrasive Articles with Removable Abrasive Member and Methods of Separating and Replacing Thereof

 #25
20170304989
2017-10-26

Lapping plate and method of making

 #26
20170304988
2017-10-26

Lapping plate and method of making

 #27
20170129071
2017-05-11

Disc containing copper for sapphire polishing, and method for preparing discs containing copper facing each other

 #28
20170087688
2017-03-30

Polyurethane CMP pads having a high modulus ratio

 #29
20160276203
2016-09-22

Wafer pin chuck fabrication and repair

 #30
20160122590
2016-05-05

Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use Therefor

 #31
20150165586
2015-06-18

Resin lapping plate and lapping method using the same

 #32
20140295740
2014-10-02

ULTRA FINE LAPPING SUBSTRATE THROUGH USE OF HARD COATED MATERIAL ON LAPPING KINEMATICS

 #33
20130149945
2013-06-13

Polishing systems

 #34
20110287698
2011-11-24

SYSTEM, METHOD AND APPARATUS FOR ELASTOMER PAD FOR FABRICATING MAGNETIC RECORDING DISKS

 #35
20110159784
2011-06-30

ABRASIVE ARTICLE WITH ARRAY OF GIMBALLED ABRASIVE MEMBERS AND METHOD OF USE

 #36
20110104989
2011-05-05

DRESSING BAR FOR EMBEDDING ABRASIVE PARTICLES INTO SUBSTRATES

 #37
20100003904
2010-01-07

High speed flat lapping platen

 #38
20090318063
2009-12-24

Polishing systems

 #39
20090298395
2009-12-03

Apparatus and method for reducing removal forces for CMP pads

 #40
20090117835
2009-05-07

Expandable polishing platen device

 #41
20080108288
2008-05-08

Conductive Polishing Article for Electrochemical Mechanical Polishing

 #42
20080076336
2008-03-27

Surface plate protecting device in CMP apparatus

 #43
20060118525
2006-06-08

Apparatus and method for reducing removal forces for CMP pads

 #44
20050260938
2005-11-24

Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer

 #45
20050133363
2005-06-23

Conductive polishing article for electrochemical mechanical polishing

 #46
20050070208
2005-03-31

System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders

 #47
20050048882
2005-03-03

Polishing apparatus and method

 #48
20050000941
2005-01-06

Method for reducing removal forces for CMP pads