ClassID:

44781

B24B37/205 - page 2 - CPC Classification

Classification description:

Lapping machines or devices; Accessories; Lapping tools; Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Recent Application in this class:
#301
20060037699
2006-02-23

Polishing pad and method of producing semiconductor device

#302
20060025052
2006-02-02

Method and apparatus of eddy current monitoring for chemical mechanical polishing

#303
20060014476
2006-01-19

Polishing pad with window and method of fabricating a window in a polishing pad

#304
20060009128
2006-01-12

Eddy current sensing of metal removal for chemical mechanical polishing

#305
20050281983
2005-12-22

Polishing pad having a pressure relief channel

#306
20050275135
2005-12-15

Method of forming a polishing pad with reduced stress window

#307
20050266771
2005-12-01

Polishing pad with window

#308
20050260928
2005-11-24

Integral polishing pad and manufacturing method thereof

#309
20050255794
2005-11-17

Polishing pad

#310
20050239372
2005-10-27

Substrate polishing apparatus

#311
20050221723
2005-10-06

Multi-layer polishing pad for low-pressure polishing

#312
20050215179
2005-09-29

Low surface energy CMP pad

#313
20050197050
2005-09-08

Multi-layer polishing pad material for CMP

#314
20050191945
2005-09-01

Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making

#315
20050189065
2005-09-01

Method of forming a layered polishing pad

#316
20050170751
2005-08-04

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

#317
20050148183
2005-07-07

Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device

#318
20050142996
2005-06-30

Polishing pad and method of producing same

#319
20050133363
2005-06-23

Conductive polishing article for electrochemical mechanical polishing

#320
20050124273
2005-06-09

Method of forming a polishing pad for endpoint detection

#321
20050113011
2005-05-26

Chemical mechanical polishing pad

#322
20050113008
2005-05-26

Polishing pad with high optical transmission window

#323
20050101228
2005-05-12

Polishing pad comprising biodegradable polymer

#324
20050090187
2005-04-28

Polishing pad having grooved window therein and method of forming the same

#325
20050090105
2005-04-28

Methods and systems for planarizing workpieces, e.g., microelectronic workpieces

#326
20050070216
2005-03-31

Resilient polishing pad for chemical mechanical polishing

#327
20050064802
2005-03-24

Polishing pad with window

#328
20050060943
2005-03-24

Polishing pad with recessed window

#329
20050016868
2005-01-27

Electrochemical mechanical processing apparatus

#330
20050014376
2005-01-20

Chemical mechanical polishing pad and chemical mechanical polishing method

#331
20050009449
2005-01-13

Polishing pad with built-in optical sensor