44782 ⎘
Lapping machines or devices; Accessories; Lapping tools; Lapping pads for working plane surfaces characterised by a multi-layered structure
MULTI-LAYER SUB PAD FOR CMP PROCESSES
#2CHEMICAL MECHANICAL POLISHING PADS, METHODS OF MANUFACTURING CHEMICAL MECHANICAL POLISHING PADS, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
#3SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING THE SAME
#4Two Component Chemical Mechanical Polishing
#5RECYCLED POLISHING PAD AND PREPARATION METHOD THEREOF
#6MULTI-LAYER SUB PAD FOR CMP PROCESSES
#7POLISHING PAD WITH THERMAL MANAGEMENT FEATURES
#8POLISHING PAD HAVING FILLED NON-POROUS SUB-PAD
#9CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#10POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING
#11CHEMICAL MECHANICAL POLISHING PAD, AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#12Two Component Chemical Mechanical Polishing
#13CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#14SUB-PAD FOR POLISHING PAD, POLISHING PAD INCLUDING SAME, AND METHOD FOR MANUFACTURING SUB-PAD FOR POLISHING PAD
#15POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREPARING A SEMICONDUCTOR DEVICE USING THE SAME
#16POLISHING PAD AND PROCESS FOR PREPARING THE SAME
#17POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
#18MULTILAYER CMP PADS
#19POLISHING PAD AND POLISHING APPARATUS
#20UV CURABLE PRINTABLE FORMULATIONS FOR POROSITY CONTROL IN HIGH PERFORMANCE CHEMICAL MECHANICAL POLISHING PADS
#21POLISHING PAD FORMED FROM DUAL CURATIVE
#22POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICONDUCTOR DEVICE USING THE SAME
#23CMP POLISHING PAD
#24POLISHING PAD AND MANUFACTURING METHOD OF POLISHING PAD AND POLISHING METHOD
#25METHOD OF USING POLISHING PAD
#26SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING THE SAME
#27POLISHING PAD WITH ADJUSTED CONTENT OF CHLORINE AND PROCESS FOR PREPARING SEMICONDUCTOR DEVICE USING THE SAME
#28POLISHING PAD AND PREPARATION METHOD THEREOF
#29POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE
#30CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
#31UV CURABLE PRINTABLE FORMULATIONS FOR HIGH PERFORMANCE 3D PRINTED CMP PADS
#32POLISHING PAD AND POLISHING METHOD
#33POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
#34POLISHING PAD AND METHOD OF MONITORING A POLISHING PROCESS USING THE SAME
#35COMPOSITE POLISHING PAD INCLUDING HIGHLY ABRASION-RESISTANT THIN FILM COATING BOUND WITH CARBON NANOTUBES, AND METHOD FOR PRODUCING SAME
#36Chemical Mechanical Polishing Process Method and Device
#37CHEMICAL MECHANICAL POLISHING PAD WITH FLUORINATED POLYMER AND MULTIMODAL GROOVE PATTERN
#38MEMBRANE COATING COMPOUND FOR CHEMICAL MECHANICAL POLISHING PROCESS, MEMBRANE INCLUDING THE SAME, AND POLISHING APPARATUS INCLUDING THE SAME
#39DUAL-LAYER CMP POLISHING SUBPAD
#40MICRO-LAYER CMP POLISHING SUBPAD
#41CORRECTION OF FABRICATED SHAPES IN ADDITIVE MANUFACTURING
#42POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
#43POLISHING PAD AND POLISHING METHOD
#44POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
#45METHODS AND PRECURSOR FORMULATIONS FOR FORMING ADVANCED POLISHING PADS BY USE OF AN ADDITIVE MANUFACTURING PROCESS
#46CMP POLISHING PAD
#47ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS
#48POLISHING PAD, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISHING METHOD FOR WAFER
#49Chemical Mechanical Planarization Pad Having Polishing Layer with Multi-lobed Embedded Features
#50CURABLE COMPOSITION AND ABRASIVE ARTICLES MADE USING THE SAME
#51METHOD OF MAKING LOW SPECIFIC GRAVITY POLISHING PADS
#52CMP PAD HAVING POLISHING LAYER OF LOW SPECIFIC GRAVITY
#53POLISHING PAD AND METHOD FOR MANUFACTURING POLISHED PRODUCT
#54CURABLE COMPOSITION AND CURED ARTICLE THEREOF
#55POLISHING PAD
#56POLISHING PADS WITH IMPROVED PLANARIZATION EFFICIENCY
#57CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL
#58Method of using polishing pad
#59CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#60POLISHING PAD WITH IMPROVED WETTABILITY AND METHOD FOR PREPARING SAME
#61POROUS CHEMICAL MECHANICAL POLISHING PADS
#62Polishing Pad with Secondary Window Seal
#63POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD AND POLISHING APPARATUS
#64POLISHING PAD, POLISHING DEVICE INCLUDING SAME, AND MANUFACTURING METHOD THEREOF
#65POLISHING PAD, CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#66ADDITIVE MANUFACTURING OF POLISHING PADS
#67POLISHING PADS AND SYSTEMS FOR AND METHODS OF USING SAME
#68LAMINATED POLISHING PAD
#69POLISHING PAD, POLISHING UNIT, POLISHING DEVICE, AND METHOD FOR MANUFACTURING POLISHING PAD
#70CMP POLISHING PAD WITH POLISHING ELEMENTS ON SUPPORTS
#71POLISHING PAD WITH WINDOW AND METHOD OF MANUFACTURING THE SAME
#72CHEMICAL PLANARIZATION
#73Chemical mechanical polishing pad and preparation thereof
#74POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#75POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#76CHEMICAL MECHANICAL PLANARIZATION PAD WITH A RELEASE LINER COMPRISING A PULL TAB
#77Polishing pads for high temperature processing
#78ADHESIVE SHEET AND POLISHING PAD WITH ADHESIVE SHEET
#79POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#80CMP POLISHING PAD
#81CHEMICAL MECHANICAL POLISHING APPARATUS WITH POLISHING PAD INCLUDING DEBRIS DISCHARGE TUNNELS AND METHODS OF OPERATING THE SAME
#82Polishing tool
#83Abrasive composition and method of manufacturing same
#84POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#85POLISHING PAD, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#86POLISHING PAD AND METHOD FOR MANUFACTURING SAME
#87POLISHING PAD AND POLISHING METHOD
#88POLISHING PAD, METHOD FOR PRODUCING THE SAME AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
#89Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith
#90Formulations for chemical mechanical polishing pads and CMP pads made therewith
#91Formulations for chemical mechanical polishing pads with high planarization efficiency and CMP pads made therewith
#92Chemical mechanical polishing pad and polishing method
#93POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
#94Polishing pad sheet, polishing pad, and method for manufacturing semiconductor device
#95Polishing pad, method for producing the same and method of fabricating semiconductor device using the same
#96POLISHING PAD CONDITIONER AND MANUFACTURING METHOD THEREOF
#97POLISHING PAD HAVING PATTERN STRUCTURE FORMED ON POLISHING SURFACE, POLISHING DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING POLISHING PAD
#98Polishing pad and method of fabricating semiconductor device using the same
#99Polishing pad assembly
#100POLISHING PAD AND POLISHING METHOD
#101POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME
#102Window in thin polishing pad
#103Advanced polishing pads and related polishing pad manufacturing methods
#104Polyurethane for polishing layers, polishing layer and polishing pad
#105Polishing pad and method for producing same
#106POLISHING PAD AND POLISHING METHOD USING SAME
#107POLISHING PAD AND METHOD FOR PRODUCING POLISHED PRODUCT
#108CHEMICAL-MECHANICAL POLISHING PAD WITH PROTRUDED STRUCTURES
#109Roughing Disc Having a Backing Layer
#110POLYURETHANE FOR POLISHING LAYER, POLISHING LAYER, AND POLISHING PAD
#111CMP polishing pad with polishing elements on supports
#112Polishing pad and method for preparing semiconductor device using same
#113Polishing pad having excellent airtightness
#114Chemical Mechanical Polishing Apparatus and Method
#115Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
#116Rigid backsize to prevent fiber disc curling
#117ABRASIVE ARTICLES INCLUDING CONFORMABLE COATINGS AND POLISHING SYSTEM THEREFROM
#118Composition for polishing pad and polishing pad
#119Polishing pads produced by an additive manufacturing process
#120Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing pad
#121POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD APPLYING POLISHING PAD
#122Method of using polishing pad
#123Manufacturing method for phosphor glass thin plate and piece thereof, and phosphor glass thin plate and piece thereof
#124CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND POLISHING PAD AND CHEMICAL MECHANICAL POLISHING DEVICE
#125Cationic fluoropolymer composite polishing method
#126Cationic fluoropolymer composite polishing pad
#127Low-debris fluopolymer composite CMP polishing pad
#128Fluopolymer composite CMP polishing method
#129THIN FILM FLUOROPOLYMER COMPOSITE CMP POLISHING PAD
#130Chemical planarization
#131Polishing pad with secondary window seal
#132Chemical mechanical planarization pads with constant groove volume
#133Polishing pad for wafer polishing apparatus and manufacturing method therefor
#134Chemical mechanical planarization pads via vat-based production
#135Polishing pad
#136Temperature-based assymetry correction during CMP and nozzle for media dispensing
#137Temperature-based in-situ edge assymetry correction during CMP
#138Chemical mechanical polishing temperature scanning apparatus for temperature control
#139Polishing pad, manufacturing method of polishing pad and polishing method
#140Polishing pad that minimizes occurrence of defects and process for preparing the same
#141Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer
#142Surface projection polishing pad
#143Microreplicated polishing surface with enhanced co-planarity
#144CMP pad construction with composite material properties using additive manufacturing processes
#145Method for polishing using polishing pad provided with adsorption layer
#146Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#147POLISHING PAD FOR WAFER POLISHING APPARATUS
#148Apparatus and method of forming a polishing article that has a desired zeta potential
#149Polishing layer and polishing method
#150Chemical mechanical polishing apparatus and method
#151Apparatus and methods for chemical mechanical polishing
#152Polishing pad with improved fluidity of slurry and process for preparing same
#153Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same
#154Hydrophilic and zeta potential tunable chemical mechanical polishing pads
#155Polishing pad, manufacturing method of polishing pad and polishing method
#156Porous polishing pad and process for producing the same all fees
#157POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
#158PRINTED CHEMICAL MECHANICAL POLISHING PAD
#159POLISHING ROLL
#160Structured abrasive articles and methods of making the same
#161Piezo-electric end-pointing for 3D printed CMP pads
#162Polishing pad with pad wear indicator
#163POROUS CHEMICAL MECHANICAL POLISHING PADS
#164WAFER POLISHING PAD AND METHOD OF WAFER POLISHING USING THE SAME
#165High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
#166Window in thin polishing pad
#167Leakage-proof polishing pad and process for preparing the same
#168Polishing pad, method for manufacturing polishing pad, and polishing method
#169POLISHING APPARATUS
#170Chemical mechanical polishing apparatus and method
#171Flanged optical endpoint detection windows and CMP polishing pads containing them
#172CMP layer based on porous cerium oxide and preparation method thereof
#173Method and system for monitoring polishing pad
#174Polishing method and polishing pad
#175Wafer polishing pad and using method thereof
#176Adhesives for chemical mechanical planarization applications
#177Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
#178Chemical mechanical polishing pads for improved removal rate and planarization
#179Polishing table and polishing apparatus having ihe same
#180Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same
#181Method and systems to control optical transmissivity of a polish pad material
#182Polishing pad having grooves on bottom surface of top layer
#183Polishing pads and systems and methods of making and using the same
#184Slurry and Slurry Delivery Technique for Chemical Mechanical Polishing of Copper
#185Polishing pad and polishing method
#186Polishing pad and polishing method
#187Polishing pad and polishing apparatus
#188CMP pad construction with composite material properties using additive manufacturing processes
#189Polishing pad and method of using
#190Polishing pad and method for making the same
#191Coated compressive subpad for chemical mechanical polishing
#192Polishing pad, polishing apparatus and method for manufacturing polishing pad
#193Grinding wheel
#194CHEMICAL MECHANICAL POLISHING PADS HAVING A CONSISTENT PAD SURFACE MICROTEXTURE
#195Endpoint detection with compensation for filtering
#196Overpolishing based on electromagnetic inductive monitoring of trench depth
#197High planarization efficiency chemical mechanical polishing pads and methods of making
#198Lapping device
#199Polishing pad with secondary window seal
#200Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#201Chemical mechanical polishing pad and method for manufacturing the same
#202Lapping pads and systems and methods of making and using the same
#203POLISHING PAD, POLISHING APPARATUS AND METHOD FOR MANUFACTURING POLISHING PAD
#204Method for manufacturing in series optical grade polishing tools
#205Method for manufacturing in series optical grade polishing tools
#206Method for manufacturing in series optical grade polishing tools
#207Manufacturing method of polishing layer, and polishing method
#208Multi-layered nano-fibrous CMP pads
#209Abrasive Articles with Removable Abrasive Member and Methods of Separating and Replacing Thereof
#210Base layer, polishing pad with base layer, and polishing method
#211CHEMICAL MECHANICAL POLISHING APPARATUS
#212Non-porous molded article for polishing layer, polishing pad, and polishing method
#213Pad structure and fabrication methods
#214POLISHING PAD
#215Polishing tool and polishing method for member having curved surface shape
#216Polishing pad having polishing surface with continuous protrusions
#217Porous chemical mechanical polishing pads
#218Method of manufacturing chemical mechanical polishing pads
#219Chemical mechanical polishing pad, polishing layer analyzer and method
#220Polishing pads and systems and methods of making and using the same
#221Polishing pads and systems and methods of making and using the same
#222Polishing pad
#223Polishing pad, method for manufacturing polishing pad, and polishing method
#224Polishing pad and method for manufacturing the same
#225Ultrafine abrasive biopolymer soft polishing film and manufacturing method thereof
#226Apparatus and method of forming a polishing pads by use of an additive manufacturing process
#227Polishing pad with foundation layer and window attached thereto
#228Advanced polishing pads having compositional gradients by use of an additive manufacturing process
#229Polishing apparatus
#230Polyurethane CMP pads having a high modulus ratio
#231Interrupted structured abrasive article and methods of polishing a workpiece
#232Composite polishing pad having layers with different hardness and process for producing the same
#233Polishing pad, polishing system and polishing method
#234Method of making composite polishing layer for chemical mechanical polishing pad
#235Chemical mechanical polishing pad composite polishing layer formulation
#236Composite polishing layer chemical mechanical polishing pad
#2373D-PRINTED POLISHING PAD FOR CHEMICAL-MECHANICAL PLANARIZATION (CMP)
#238Sandpaper with non-slip coating layer
#239COATED ABRASIVE ARTICLE AND METHOD OF MAKING THE SAME
#240Multi-layered polishing pads
#241Sanding pad
#242COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHING
#243Advanced polishing pad materials and formulations
#244POLISHING PAD AND METHOD FOR MAKING THE SAME
#245Polishing pads produced by an additive manufacturing process
#246Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
#247CMP pad construction with composite material properties using additive manufacturing processes
#248Printed chemical mechanical polishing pad
#249Polishing pads produced by an additive manufacturing process
#250Polishing pad and polishing method
#251Polishing pad configuration and chemical mechanical polishing system
#252HARD SHEET AND METHOD FOR PRODUCING THE SAME
#253Method to provide an abrasive product and abrasive products thereof
#254Multi-layer polishing pad for CMP
#255Polishing pad
#256MULTILAYER POLISHING PAD
#257POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
#258Polishing pad with foundation layer and polishing surface layer
#259Polishing pad with grooved foundation layer and polishing surface layer
#260Abrasive product with a concave-convex structure and preparation method thereof
#261POLISH CLOTH AND METHOD OF MANUFACTURING POLISH CLOTH
#262POLISHING PAD, POLISHING APPARATUS AND METHOD FOR MANUFACTURING POLISHING PAD
#263POLISHING PAD, COMPOSITION FOR THE MANUFACTURE THEREOF, AND METHOD OF MAKING AND USING
#264LAMINATED POLISHING PAD AND METHOD FOR MANUFACTURING SAME
#265Abrasive pad and method for abrading glass, ceramic, and metal materials
#266Composite polishing pad and method for making the same
#267Laminated polishing pad and method for producing same
#268Method of fabricating a polishing
#269Method of chemical mechanical polishing a substrate
#270CHEMICAL MECHANICAL POLISHING PAD
#271Polishing pad with homogeneous body having discrete protrusions thereon
#272Polishing pad with porous interface and solid core, and related apparatus and methods
#273Method for producing laminated polishing pad
#274Polishing pad
#275Soft and conditionable chemical mechanical window polishing pad
#276Soft and conditionable chemical mechanical polishing pad stack
#277Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
#278Multi-layered chemical-mechanical planarization pad
#279Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
#280Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad
#281Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window
#282Multilayer chemical mechanical polishing pad
#283Polishing pad
#284Polishing pad having polishing surface with continuous protrusions
#285Polishing pad
#286Method of hand sanding a work surface
#287Polishing pad and manufacturing method therefor
#288LAMINATED POLISHING PAD
#289Polishing pad and manufacturing method therefor
#290Preparation method for porous pressure sensitive adhesive article
#291Method for manufacturing polishing pad
#292Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
#293CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME
#294Replaceable fine machining membrane, stationary fine machining tool, and method for producing a replaceable fine machining membrane
#295Polishing Pad and Method For Polishing A Semiconductor Wafer
#296Polishing pad with foundation layer and polishing surface layer
#297Polishing pad with grooved foundation layer and polishing surface layer
#298Method of forming open-network polishing pads
#299Method of forming layered-open-network polishing pads
#300Method of forming structured-open-network polishing pads