Carrier head and carrier head unit

CMP retaining ring with soft retaining ring insert

Retaining ring with shaped surface

Polishing apparatus

Carrier head with narrow inner ring and wide outer ring

SUBSTRATE EDGE TUNING WITH RETAINING RING

Retaining ring with shaped profile

SUBSTRATE HOLDER TO REDUCE SUBSTRATE EDGE STRESS DURING CHEMICAL MECHANICAL POLISHING

REAL-TIME MONITORING OF RETAINING RING THICKNESS AND LIFETIME

Multilayer retaining ring for chemical mechanical polishing

Retaining ring with shaped surface

Method and apparatus for polishing a substrate

CMP RETAINING RING

Substrate retainer

Retaining rings

Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same

METHOD FOR MANUFACTURING POLISHING HEAD AND POLISHING APPARATUS

Retaining ring for chemical mechanical polishing

Apparatus and method for deterministic control of surface figure during full aperture polishing

Stepped retaining ring

Carrier head membrane roughness to control polishing rate

Carrier ring for carrier head

Retaining ring and articles for carrier head

Carrier head with retaining ring and carrier ring

Partial Contact Wafer Retaining Ring Apparatus

Retaining ring with tapered inner surface

Retainer ring

WAFER HEAD TEMPLATE FOR CHEMICAL MECHANICAL POLISHING AND A METHOD FOR ITS USE

Carrier head using flexure restraints for retaining ring alignment

CMP retaining ring

SEMICONDUCTOR DEVICE FABRICATING METHOD, AND SEMICONDUCTOR FABRICATING DEVICE

Substrate retaining ring for CMP

Planarization System

RETAINING RING FOR HOLDING SEMICONDUCTOR WAFERS IN A CHEMICAL MECHANICAL POLISHING APPARATUS

Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same

Substrate holding apparatus and polishing apparatus

Multilayer retaining ring for chemical mechanical polishing

Polishing apparatus

FULL-CONTACT RING FOR A LARGE WAFER

Polishing apparatus

Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

Flattening method and flattening apparatus

Substrate retainer

POLISHING HEAD AND EDGE CONTROL RING THEREOF, AND METHOD OF INCREASING POLISHING RATE AT WAFER EDGE

RETAINING RING FOR CHEMICAL MECHANICAL POLISHING, ITS OPERATIONAL METHOD AND APPLICATION SYSTEM

Retaining ring with shaped profile

Substrate holding apparatus, polishing apparatus, and polishing method

Substrate holding apparatus, polishing apparatus, and polishing method

RETAINER-RING OF CMP (CHEMICAL MECHANICAL POLISHING) MACHINE

Substrate holding apparatus and substrate polishing apparatus

Retainer ring

Retainer Ring For Cmp Device

Retainer ring and polishing machine

Retaining ring with shaped surface

Polishing apparatus including separate retainer rings

Retainer ring for polishing head

Substrate holding apparatus and polishing apparatus

RETAINING RING FOR A CHEMICAL MECHANICAL POLISHING TOOL

Semiconductor device manufacturing apparatus and method

Carrier head with retaining ring and carrier ring

Carrier ring for carrier head

Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly

Stepped retaining ring

Substrate retaining ring for CMP

Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device

Polishing apparatus

Substrate holding apparatus and substrate polishing apparatus

Polishing apparatus and manufacturing method of an electronic apparatus

Ethylene terephthalate polymer retaining ring for a chemical mechanical polishing head

Substrate holding apparatus and substrate polishing apparatus

REATAINING RING AND ARTICLES FOR CARRIER HEAD

RETAINING RING WITH CONDUCTIVE PORTION

WAFER POLISHING HEAD

CMP-apparatus retainer ring and manufacturing method thereof, and CMP apparatus

Friction weld of two dissimilar materials

METHOD AND APPARATUS FOR POLISHING A WAFER WITH A HIGHER IN-PLANE UNIFORMITY

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Substrate holding apparatus, polishing apparatus, and polishing method

CMP retaining ring

Polishing apparatus

Composite retaining ring

Attaching components of a carrier head

RETAINING RINGS, AND ASSOCIATED PLANARIZING APPARATUSES, AND RELATED METHODS FOR PLANARIZING MICRO-DEVICE WORKPIECES

Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces

Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method

RETAINING RINGS, AND ASSOCIATED PLANARIZING APPARATUSES, AND RELATED METHODS FOR PLANARIZING MICRO-DEVICE WORKPIECES

Wafer carrier with pressurized membrane and retaining ring actuator

RETAINING RING STRUCTURE FOR ENHANCED REMOVAL RATE DURING FIXED ABRASIVE CHEMICAL MECHANICAL POLISHING

Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces

Retainer ring, Polishing head, and chemical mechanical polishing apparatus

Grooved retaining ring

Retainer ring of chemical mechanical polishing device

Independent edge control for CMP carriers

Carrier employing snap-fitted membrane retainer

Retaining ring with flange for chemical mechanical polishing

Composite retaining ring

Wafer polishing template for polishing semiconductor wafers in a wax free polishing process

Substrate holding apparatus and polishing apparatus

Wafer carrier with pressurized membrane and retaining ring actuator

Magnetically secured retaining ring

Vibration damping in chemical mechanical polishing system

Retaining ring structure for edge control during chemical-mechanical polishing

Chemical mechanical polishing apparatus

Biased retaining ring

Polishing apparatus

Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Method for polishing a semiconductor wafer

System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control

Retainer and wafer polishing apparatus

Retaining ring structure for edge control during chemical-mechanical polishing

Pad backer and CMP process using the same

Retaining ring with conductive portion

Retaining ring assembly for use in chemical mechanical polishing

Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces

Method of making carrier head backing plate having low-friction coating

Methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies

Wafer carrier with pressurized membrane and retaining ring actuator

Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same

Chemical mechanical polishing retaining ring with integral polymer backing

Independent edge control for CMP carriers

Retaining ring with shaped surface

Retaining ring for wafer carriers

Method of controlling carrier head with multiple chambers

Apparatus for polishing a semiconductor wafer

Retaining ring with slurry transport grooves

CMP polishing heads retaining ring groove design for microscratch reduction

Method and apparatus for two-part CMP retaining ring

Retaining ring for wafer carriers

Substrate holding apparatus and substrate polishing apparatus

Carrier head having low-friction coating and planarizing machine using same

Carrier head with a flexible membrane

Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces

Substrate retainer wear detection method and apparatus

Retaining ring with wear pad for use in chemical mechanical planarization

Retaining ring with trigger for chemical mechanical polishing apparatus

Method for hardening the wear portion of a retaining ring