44843 ⎘
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
SYSTEM AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING
#2METHOD FOR CONDITIONING POLISHING PAD
#3INTELLIGENT SURFACE BURNISHING TOOL SYSTEM
#4SUBSTRATE POLISHING APPARATUS
#5APPARATUS AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING
#6CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#7MULTIFUNCTIONAL ENDPOINT DETECTION WINDOW
#8MULTIFUNCTIONAL ENDPOINT DETECTION WINDOW
#9ACOUSTIC SENSOR, METHOD OF MANUFACTURING THE SAME, AND CHEMICAL MECHANICAL POLISHING APPARATUS
#10CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#11CHEMICAL MECHANICAL POLISHING APPARATUS
#12METHOD FOR MONITORING RUPTURE OF BONDING BUBBLE IN WAFER BONDING PROCESS DURING MANUFACTURING OF CHIPS
#13GRINDING APPARATUS
#14POLISHING APPARATUS AND POLISHING END POINT DETECTION METHOD IN POLISHING APPARATUS
#15CARRIER HEAD ACOUSTIC MONITORING WITH SENSOR IN PLATEN
#16MONITORING SYSTEM FOR A MOVABLE COMPONENT CONNECTED TO A STATIONARY COMPONENT
#17APPARATUS AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING
#18MONITORING SYSTEM FOR A MOVABLE COMPONENT CONNECTED TO A STATIONARY COMPONENT
#19MONITORING SYSTEM FOR A MOVABLE COMPONENT CONNECTED TO A STATIONARY COMPONENT
#20ACOUSTIC MONITORING OF CONDITIONER DURING POLISHING
#21DETERMINING SUBSTRATE PRECESSION WITH ACOUSTIC SIGNALS
#22DETERMINING SUBSTRATE ORIENTATION WITH ACOUSTIC SIGNALS
#23Chemical mechanical polishing apparatus and method
#24CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
#25SELF-MODIFYING AGITATION PROCESS AND APPARATUS FOR SUPPORT REMOVAL IN ADDITIVE MANUFACTURING AND 3D PRINTED MATERIAL
#26CALIBRATION METHOD FOR ACOUSTIC SENSOR
#27PERFORMANCE GRINDING SOLUTIONS
#28SYSTEM AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING
#29Probe grinding device by acoustic positioning
#30AE-SIGNAL DETECTING DEVICE FOR ABRASIVE WHEEL
#31DETECTION OF PLANARIZATION FROM ACOUSTIC SIGNAL DURING CHEMICAL MECHANICAL POLISHING
#32METHODS OF MODELING AND CONTROLLING PAD WEAR
#33METHOD FOR CONDITIONING POLISHING PAD
#34Method for Determining State Information Relating to a Belt Grinder by Means of a Machine Learning System
#35ACTIVE ACOUSTIC MONITORING FOR CHEMICAL MECHANICAL POLISHING
#36PASSIVE ACOUSTIC MONITORING AND ACOUSTIC SENSORS FOR CHEMICAL MECHANICAL POLISHING
#37SUBSTRATE PROCESSING APPARATUS
#38CONTROL METHOD FOR PROCESSING OF A SUBSTRATE
#39Automatic grinding machine with positioning effect
#40ABRASION METHOD
#41Cutting machine
#42Measurement device for grinding wheel
#43Acoustic crankpin location detection
#44Wafer scale ultrasonic sensing device and manufacturing method thereof
#45PLANARIZATION ENDPOINT DETERMINATION
#46Performance Grinding Solutions
#47METHOD AND SYSTEM FOR CONTROLLING POLISHING AND GRINDING
#48Systems and Methods for Obtaining Real-Time Abrasion Data
#49Single-point diamond dresser for grinding wheel based on acoustic emission online monitoring
#50Techniques for combining CMP process tracking data with 3D printed CMP consumables
#51Chemical mechanical polishing apparatus and method
#52Polishing apparatus
#53Chemical mechanical polishing apparatus and method
#54ESTIMATION MODEL CREATING DEVICE FOR GRINDING WHEEL SURFACE CONDITION ESTIMATION, GRINDING WHEEL SURFACE CONDITION ESTIMATING DEVICE, ADJUSTMENT MODEL CREATING DEVICE FOR GRINDING MACHINE OPERATION COMMAND DATA ADJUSTMENT, AND UPDATING DEVICE FOR GRINDING MACHINE OPERATION COMMAND DATA UPDATE
#55Device for removing burrs from aluminum alloy hub
#56MACHINE TOOL AND METHOD FOR DETERMINING AN ACTUAL STATE OF A MACHINE TOOL
#57Self-modifying agitation process and apparatus for support removal in additive manufacturing and 3D printed material
#58Polishing tool wear amount prediction device, machine learning device, and system
#59Method for conditioning polishing pad
#60System, control method and apparatus for chemical mechanical polishing
#61System and method for monitoring operation conditions of semiconductor manufacturing apparatus
#62System and method for monitoring chemical mechanical polishing
#63Polishing apparatus, polishing method, and polishing control apparatus
#64Trowel-Grinder-Polisher Machines
#65Grinding apparatus and grinding method
#66Chemical mechanical polishing retaining ring with integrated sensor
#67METHOD AND APPARATUS FOR MONITORING ABRASIVE MACHINING
#68Spindle device for a program-controlled machine tool
#69Techniques for combining CMP process tracking data with 3D printed CMP consumables
#70Device for controlling the sharpening state of a blade
#71Control device for blades sharpening
#72Grinding machine
#73Polishing device and polishing method
#74Acoustic emission monitoring and endpoint for chemical mechanical polishing
#75Chemical mechanical polishing retaining ring with integrated sensor
#76Polishing device and polishing method
#77Saw blade sharpening apparatus
#78Grinding abnormality monitoring method and grinding abnormality monitoring device
#79Methods for real-time error detection in CMP processing
#80Method for detecting and/or preventing grind burn
#81Method of phasing threaded grinding stone, as well as device therefor
#82Device for phasing threaded grinding wheel
#83Apparatus and method for measuring tooth surface deviation, apparatus and method for forming grinding tool, and gear meshing method for gear grinding apparatus
#84Grinding method for grinding a workpiece using a grinding wheel
#85EVALUATING CENTRAL NERVOUS SYSTEM
#86Method for detecting and/or preventing grind burn
#87DETECTION-SIGNAL TRANSMITTING APPARATUS
#88Working system, method for detecting contact, and acoustic emission contact detection device
#89METHODS AND APPARATUS FOR POLISHING CONTROL
#90Method for optimizing cancer therapy by monitoring maturation of tumor associated vasculature by selenium
#91In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
#92System and method for the identification of chemical mechanical planarization defects
#93Detection-signal transmitting apparatus
#94Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
#95Method of determining state variables and changes in state variables
#96Real time monitoring of CMP pad conditioning process
#97Methods and apparatus for polishing control
#98Porphyrin compounds and their use in high-field MRI
#99Energy enhanced surface planarization
#100System and Method for the Identification of Chemical Mechanical Planarization Defects
#101Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
#102Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
#103In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
#104Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
#105Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
#106Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces