48004 ⎘
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Sub-classes:WAFER MANUFACTURING METHOD, LASER PROCESSING APPARATUS, AND WAFER MANUFACTURING APPARATUS
#2UPPER JACKING STRUCTURE, HALF-SLITTING MACHINE AND HALF-SLITTING METHOD
#3CLEANING DEVICE FOR NET MONITOR AND SLICER
#4METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SAW, AND SEMICONDUCTOR WAFERS MADE OF MONOCRYSTALLINE SILICON
#5SYSTEMS FOR AUTHENTICATION AND RELATED DEVICES AND METHODS
#6Inspection substrate
#7Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
#8Diamond rotors for MAS-NMR
#9Cutting blade mounting method
#10Spool with saw wire having elastic and plastic rotations
#11FOR OBTAINING A DIAMETER OF A MAIN ROLLER INCLUDED IN A MULTI-ROLLER MODULE SYSTEM
#12Cutting apparatus and groove detecting method
#13CUTTING BLADE MOUNTING METHOD
#14WIRE SUPPLYING AND RECEIVING DEVICE FOR A WIRE SAW, INGOT SLICING WIRE SAW INCLUDING THE SAME, AND METHOD OF SLICING INGOT
#15Silicon ingot slicing apparatus using microbubbles and wire electric discharge machining
#16Method and apparatus for processing sapphire
#17Methods for aligning an ingot with mounting block
#18APPARATUS AND METHOD FOR MULTIPLE SUBSTRATE PROCESSING
#19Blade changing tool