B28D5/007 - CPC Classification Index

ClassID:

48006 ⎘

B28D5/007 - CPC Classification

Classification description:

Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor; Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material Use, recovery or regeneration of abrasive mediums

Recent Application in this class:

20240246260

2024-07-25

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SAW, AND SEMICONDUCTOR WAFERS MADE OF MONOCRYSTALLINE SILICON

20220152873

2022-05-19

Variable-step-distance micro-milling repair cutter path generating method for damage points on surface of optical crystal

20220040882

2022-02-10

Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon

20220024073

2022-01-27

CRYSTAL INGOT CUTTING DEVICE AND CRYSTAL INGOT CUTTING METHOD

20220016802

2022-01-20

METHOD FOR SLICING WORKPIECE AND WIRE SAW

20210308905

2021-10-07

CUTTING METHOD AND CUTTING DEVICE

20190184603

2019-06-20

Ingot clamping device and wire sawing apparatus for slicing ingot having the same

20180281231

2018-10-04

Saw wire and cutting apparatus

20180215074

2018-08-02

ABRASIVE DIAMOND GRAIN FOR WIRE TOOL AND WIRE TOOL

#10

20180178409

2018-06-28

Wire saw device and workpiece cutting method

#11

20180079108

2018-03-22

Wire saw apparatus

#12

20180021981

2018-01-25

METHOD FOR RECOVERING SILICON PARTICLES AND ABRASIVE GRAINS FROM WASTED ABRASIVE SLURRY

#13

20170361494

2017-12-21

Wire sawing apparatus

#14

20170343528

2017-11-30

Method for evaluating abrasive grains, and method for manufacturing silicon wafer

#15

20170015019

2017-01-19

Method for slicing workpiece and processing liquid

#16

20150306788

2015-10-29

Abrasive regeneration method

#17

20150224673

2015-08-13

SLICING DEVICE

#18

20150013235

2015-01-15

Method for separating polishing material and regenerated polishing material

#19

20150000208

2015-01-01

Slurry and method for producing slurry

#20

20140331567

2014-11-13

Abrasive material regeneration method and regenerated abrasive material

#21

20140165988

2014-06-19

Resin-coated saw wire and cut article

#22

20130327308

2013-12-12

Apparatus for slicing ingot

#23

20130206126

2013-08-15

Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece

#24

20130174828

2013-07-11

Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw

#25

20120255535

2012-10-11

Method for cutting workpiece with wire saw

#26

20120211404

2012-08-23

METHOD AND DEVICE FOR RECOVERING EXHAUSTED MACHINING SLURRIES

#27

20120171101

2012-07-05

Recycling and Treatment Method of Waste Liquid in Cutting Mono Silicon

#28

20120132045

2012-05-31

SUSPENSION OF ABRASIVE GRAINS

#29

20120110789

2012-05-10

METHOD FOR PREPARING A SUSPENSION

#30

20120034146

2012-02-09

CARRIER FLUIDS FOR ABRASIVES

#31

20120027660

2012-02-02

Methods to recover and purify silicon particles from saw kerf

#32

20120024761

2012-02-02

Methods to slice a silicon ingot

#33

20110303210

2011-12-15

Wiresaw cutting method

#34

20110280785

2011-11-17

Methods and apparatus for recovery of silicon and silicon carbide from spent wafer-sawing slurry

#35

20110240002

2011-10-06

CUTTING FLUID COMPOSITION FOR WIRESAWING

#36

20110240001

2011-10-06

Wiresaw apparatus and method for continuous removal of magnetic impurties during wiresaw cutting

#37

20110239836

2011-10-06

Composition for improving dryness during wire sawing

#38

20110147979

2011-06-23

METHOD FOR PURIFICATION AND COMPACTION OF FEEDSTOCK FOR PHOTOVOLTAIC APPLICATIONS

#39

20110132345

2011-06-09

WIRE SAW DEVICE AND METHOD FOR OPERATING SAME

#40

20110059002

2011-03-10

METHODS AND APPARATUS FOR RECOVERY OF SILICON AND SILICON CARBIDE FROM SPENT WAFER-SAWING SLURRY

#41

20110048396

2011-03-03

Wire saw device

#42

20110017230

2011-01-27

Method and System for Processing Abrasive Slurry

#43

20100278707

2010-11-04

Method for recovering silicon from sawing waste

#44

20100258103

2010-10-14

Method for slicing workpiece by using wire saw and wire saw

#45

20100206285

2010-08-19

Wire saw apparatus

#46

20100170495

2010-07-08

Method and system for manufacturing wafer-like slices from a substrate material

#47

20100163462

2010-07-01

Methods to recover and purify silicon particles from saw kerf

#48

20100163010

2010-07-01

Slicing method and a wire saw apparatus

#49

20100126489

2010-05-27

In-situ wafer processing system and method

#50

20100126488

2010-05-27

METHOD AND APPARATUS FOR CUTTING WAFERS BY WIRE SAWING

#51

20100068115

2010-03-18

SILICON RECLAMATION APPARATUS AND METHOD OF RECLAIMING SILICON

#52

20100061913

2010-03-11

Method to convert waste silicon to high purity silicon

#53

20100061911

2010-03-11

METHOD TO CONVERT SILICON POWDER TO HIGH PURITY POLYSILICON THROUGH INTERMEDIATE SiF4

#54

20100037881

2010-02-18

Slicing method

#55

20100037880

2010-02-18

Slurry for slicing silicon ingot and method for slicing silicon ingot using the same

#56

20100032630

2010-02-11

Recovery of silicon from kerf silicon waste

#57

20090293369

2009-12-03

Wire saw slurry recycling process

#58

20090288530

2009-11-26

Slicing method and method for manufacturing epitaxial wafer

#59

20090258580

2009-10-15

AQUEOUS ABRASIVES DISPERSION MEDIUM COMPOSITION

#60

20090126713

2009-05-21

Slurry composition containing non-ionic polymer and method for use

#61

20090032006

2009-02-05

Wire saw process

#62

20080250723

2008-10-16

Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components

#63

20080223351

2008-09-18

Method of producing silicon blocks and silicon wafers

#64

20080149085

2008-06-26

Method and device for sawing a workpiece

#65

20080057833

2008-03-06

Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof

#66

20080011134

2008-01-17

Sawing strip and method for simultaneously cutting off a multiplicity of slices from a cylindrical workpiece using a sawing strip

#67

20070190912

2007-08-16

Apparatus and method for slicing an ingot

#68

20070190897

2007-08-16

Apparatus and method for slicing an ingot

#69

20070186917

2007-08-16

Apparatus and method for slicing an ingot

#70

20070178807

2007-08-02

Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control

#71

20070169422

2007-07-26

Aqueous abrasives dispersion medium composition

#72

20070049173

2007-03-01

Process, apparatus and slurry for wire sawing

#73

20060249134

2006-11-09

Multi-wire saw

#74

20060107940

2006-05-25

Apparatus and method for slicing an ingot

#75

20060075687

2006-04-13

Slurry for slicing silicon ingot and method for slicing silicon ingot using same

#76

20060025051

2006-02-02

Wire sawing apparatus

#77

20050051913

2005-03-10

Fluid mixing device and cutting device