ClassID:

48009

B28D5/0088 - CPC Classification

Classification description:

Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor; Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable

Recent Application in this class:
#1
20250312944
2025-10-09

CUTTING METHOD AND MANUFACTURING METHOD FOR CHIP

#2
20230219258
2023-07-13

Workplate for Y-axis compensation of ingot and Y-axis compensation method of ingot using the same

#3
20220063135
2022-03-03

METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULANT BY CUTTING A GEMSTONE INTO 100-SIDED BODY

#4
20190109023
2019-04-11

Apparatus for dividing workpiece

#5
20190022895
2019-01-24

Diamond wire cutting method for crystal boules

#6
20180215075
2018-08-02

Workpiece holder and method for slicing workpiece

#7
20150375421
2015-12-31

Gemstone processing

#8
20150165646
2015-06-18

Sapphire wafer squaring machine with double swing cutter heads

#9
20150092920
2015-04-02

Intelligent machines and process for production of monocrystalline products with goniometer continual feedback

#10
20140295126
2014-10-02

Method for slicing semiconductor single crystal ingot

#11
20130028385
2013-01-31

Intelligent machines and process for production of monocrystalline products with goniometer continual feedback

#12
20110179934
2011-07-28

SCRIBING APPARATUS FOR THIN FILM SOLAR CELLS

#13
20110059679
2011-03-10

Method for slicing workpiece

#14
20100006082
2010-01-14

WIRE SLICING SYSTEM

#15
20090263954
2009-10-22

Semiconductor wafer sawing system and method

#16
20080213079
2008-09-04

Apparatus and Method for Separating and Transporting Substrates

#17
20080153260
2008-06-26

Method for sawing semiconductor wafer

#18
20070297885
2007-12-27

PRODUCT DESIGNED TO BE USED WITH HANDLING SYSTEM

#19
20060032430
2006-02-16

Method and apparatus for the measurement, orientation and fixation of at least one single crystal

#20
20050145238
2005-07-07

Laser diamond blocking machine for faceting the bottom of a diamond

#21
20050139047
2005-06-30

Brittle material rotating and aligning mechanism for use in a brittle material scribing and/or breaking apparatus