B28D5/0094 - CPC Classification Index

ClassID:

48010 ⎘

B28D5/0094 - CPC Classification

Classification description:

Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor; Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Recent Application in this class:

20250010518

2025-01-09

UNLOADING AND COLLECTING DEVICE FOR SLICE AND CUTTING MACHINE WITH THE SAME

20240149379

2024-05-09

MANUFACTURING METHOD OF GALLIUM NITRIDE SUBSTRATE

20230373129

2023-11-23

PEELING APPARATUS

20230219256

2023-07-13

SUBSTRATE MANUFACTURING METHOD

20230112548

2023-04-13

SUBSTRATE MANUFACTURING METHOD

20220161367

2022-05-26

Wafer producing method and laser processing apparatus

20220032503

2022-02-03

Si SUBSTRATE MANUFACTURING METHOD

20210339428

2021-11-04

Production method of wafer

20210237299

2021-08-05

Cutting apparatus for cutting workpiece with cutting blade

#10

20210197319

2021-07-01

SiC ingot processing method and laser processing apparatus

#11

20200391410

2020-12-17

Cutting apparatus

#12

20200335370

2020-10-22

Dividing apparatus including an imaging unit for detecting defects in a workplace

#13

20200307022

2020-10-01

Cutting apparatus with auto chuck cleaning mechanism

#14

20200266091

2020-08-20

Chuck table and inspection apparatus

#15

20200086527

2020-03-19

Cutting apparatus with auto chuck cleaning mechanism

#16

20200086426

2020-03-19

Wafer producing method and laser processing apparatus

#17

20190378732

2019-12-12

TREATMENT APPARATUS FOR TREATING WORKPIECE

#18

20190352099

2019-11-21

Conveyance system

#19

20190275700

2019-09-12

Chuck table and processing apparatus including the same

#20

20190160708

2019-05-30

Peeling apparatus

#21

20180286757

2018-10-04

Method of processing workpiece including cutting step that uses cutting fluid with organic acid and oxidizing agent to reduce ductility of layered bodies containing metal

#22

20180236691

2018-08-23

CUTTING BLADE AND CUTTING APPARATUS

#23

20170288084

2017-10-05

Photovoltaic structure cleaving system

#24

20170076971

2017-03-16

Workpiece support jig

#25

20160163907

2016-06-09

Photovoltaic structure cleaving system

#26

20140030850

2014-01-30

Package substrate processing method

#27

20140008855

2014-01-09

Apparatus and method for supporting a workpiece during processing

#28

20120167362

2012-07-05

Gemstone alignment

#29

20110256689

2011-10-20

Optical device wafer processing method and laser processing apparatus

#30

20110045656

2011-02-24

SYSTEM AND PROCESS FOR DICING INTEGRATED CIRCUITS

#31

20110021003

2011-01-27

Supply mechanism for the chuck of an integrated circuit dicing device

#32

20110008145

2011-01-13

METHOD OF, AND APPARATUS FOR, SEPARATING WAFERS FROM A WAFER STACK

#33

20100011927

2010-01-21

Apparatus for cutting flat display panel

#34

20090211424

2009-08-27

Method and Device for the Mechanical Structuring of Flexible Thin-Film Solar Cells

#35

20090008373

2009-01-08

Laser processing method

#36

20080213975

2008-09-04

Supply mechanism for the chuck of an integrated circuit dicing device

#37

20080164646

2008-07-10

WORKHOLDER FOR SUPPORTING ELECTRONIC DEVICES

#38

20070214925

2007-09-20

SUBSTRATE DICING SYSTEM, SUBSTRATE MANUFACTURING APPARATUS, AND SUBSTRATE DICING METHOD

#39

20070141811

2007-06-21

Wafer dividing method

#40

20070068504

2007-03-29

Group encapsulated dicing chuck

#41

20070063402

2007-03-22

Substrate processing table and substrate processing device

#42

20070062511

2007-03-22

Group encapsulated dicing chuck

#43

20060245138

2006-11-02

Perforated plate for water chuck

#44

20060203222

2006-09-14

Wafer holding mechanism

#45

20060097022

2006-05-11

Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus

#46