B28D5/02 - CPC Classification Index

ClassID:

48011 ⎘

B28D5/02 - CPC Classification

Classification description:

Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills

Sub-classes:

B28D5/021 » {by drilling} 9
B28D5/022 » {by cutting with discs or wheels} 122

Recent Application in this class:

20250100185

2025-03-27

METHOD OF MILLING BRITTLE MATERIALS USING A POLYCRYSTALLINE DIAMOND END MILLING TOOL

20220266298

2022-08-25

Ultrasonic resonator support structure and ultrasonic vibration machining apparatus

20210320000

2021-10-14

Wafer trimming device

20200039109

2020-02-06

Method of machining brittle materials

20190295850

2019-09-26

Cutting apparatus

20170069537

2017-03-09

Wafer processing method

20150020667

2015-01-22

Cutting apparatus

20150020666

2015-01-22

Cutting apparatus

20130244403

2013-09-19

Method and device for cutting semiconductor wafers

#10

20130237402

2013-09-12

SAPPHIRE MATERIAL AND PRODUCTION METHOD THEREOF

#11

20120207869

2012-08-16

Cutting Tool, Method for Manufacturing Molding Die, and Molding Die for Array Lens

#12

20100006081

2010-01-14

METHOD FOR MANUFACTURING SILICON MATTER FOR PLASMA PROCESSING APPARATUS

#13

20090061599

2009-03-05

Semiconductor wafer processing method