B28D5/022 - CPC Classification Index

ClassID:

48013 ⎘

B28D5/022 - CPC Classification

Classification description:

Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels

Sub-classes:

B28D5/023 » {with a cutting blade mounted on a carriage} 17
B28D5/024 » {with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage} 24
B28D5/026 » {with a cutting blade carried by a movable arm, e.g. pivoted } 1
B28D5/027 » {with a cutting blade arranged underneath a stationary work table} 4
B28D5/028 » {with a ring blade having an inside cutting edge} 0
B28D5/029 » {with a plurality of cutting blades} 38

Recent Application in this class:

20260109081

2026-04-23

FANCY CONCAVE CUTTING GEMSTONE FACETING ATTACHMENT DEVICE

20250083358

2025-03-13

DIVIDING METHOD

20250050541

2025-02-13

PROCESSING METHOD FOR WORKPIECE

20240404749

2024-12-05

TECHNIQUES FOR PATTERNING FERRITE MATERIALS

20230191511

2023-06-22

Cutting apparatus

20230039736

2023-02-09

Dicing blade including diamond particles

20220266298

2022-08-25

Ultrasonic resonator support structure and ultrasonic vibration machining apparatus

20220234156

2022-07-28

Cutting apparatus

20220063135

2022-03-03

METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULANT BY CUTTING A GEMSTONE INTO 100-SIDED BODY

#10

20210354257

2021-11-18

Blade replacing apparatus and adjusting method of blade replacing apparatus

#11

20210316477

2021-10-14

Blade holding jig

#12

20210123160

2021-04-29

Method for preparing SiC ingot, method for preparing SiC wafer and the SiC wafer prepared therefrom

#13

20210078204

2021-03-18

CUTTING BLADE AND MANUFACTURING METHOD OF CUTTING BLADE

#14

20200324391

2020-10-15

Hubbed blade

#15

20200324390

2020-10-15

HUBBED BLADE

#16

20200249384

2020-08-06

Pattern structure and method of manufacturing the pattern structure

#17

20200198183

2020-06-25

Cutting blade mounting method

#18

20200030928

2020-01-30

Cutting apparatus

#19

20190378745

2019-12-12

Wafer processing method using a ring frame and a polyester sheet

#20

20190326136

2019-10-24

Cutting apparatus

#21

20190229018

2019-07-25

Processing apparatus

#22

20190084124

2019-03-21

Cutting blade mounting mechanism

#23

20190009379

2019-01-10

Blade mounting and dismounting jig, blade mounting and dismounting method, blade extracting method, and cutting apparatus

#24

20190006185

2019-01-03

Wafer processing method

#25

20190001526

2019-01-03

CUTTING BLADE MOUNTING METHOD

#26

20180286756

2018-10-04

Workpiece processing method

#27

20180286754

2018-10-04

Workpiece processing method

#28

20180286708

2018-10-04

Plate-shaped workpiece processing method

#29

20180286689

2018-10-04

Method of processing workpiece

#30

20180286688

2018-10-04

Method of processing workpiece

#31

20180229396

2018-08-16

Wafer processing method

#32

20180204771

2018-07-19

Method of processing a substrate

#33

20180113242

2018-04-26

Pattern structure and method of manufacturing the pattern structure

#34

20180015638

2018-01-18

Cutting apparatus

#35

20170372908

2017-12-28

Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object

#36

20170133249

2017-05-11

Apparatus for laminating a tape film on a substrate and a system of fabricating a semiconductor device using the same

#37

20170084879

2017-03-23

Method for cutting display panel

#38

20160346956

2016-12-01

Processing system

#39

20160343614

2016-11-24

Wafer processing method

#40

20160311127

2016-10-27

CUTTING APPARATUS AND CUTTING METHOD

#41

20160284611

2016-09-29

Workpiece cutting method using dummy wafer to determine condition of cutting blade

#42

20160260626

2016-09-08

Cutting apparatus and wafer cutting method

#43

20160218023

2016-07-28

Cutting blade having cutting edge containing photocatalyst particles

#44

20160207216

2016-07-21

Mount flange

#45

20160189989

2016-06-30

PROCESSING APPARATUS

#46

20160136843

2016-05-19

Cutting apparatus

#47

20160067970

2016-03-10

Methods of making an inkjet print head by sawing discontinuous slotted recesses

#48

20160049333

2016-02-18

Method of tip shape of cutting member, semiconductor chip manufacturing method, circuit board, and electronic apparatus

#49

20150367529

2015-12-24

Cleaning mechanism for semiconductor singulation saws

#50

20150367450

2015-12-24

Dicing method

#51

20150183131

2015-07-02

SEMICONDUCTOR WAFER DICING BLADE

#52

20150107572

2015-04-23

Dicing blade

#53

20150020670

2015-01-22

Cutting apparatus

#54

20150020667

2015-01-22

Cutting apparatus

#55

20150020666

2015-01-22

Cutting apparatus

#56

20140356991

2014-12-04

Methods of making an inkjet print head by sawing discontinuous slotted recesses

#57

20140298968

2014-10-09

Disk-shaped workpiece dividing method

#58

20140208663

2014-07-31

Outer blade cutting wheel and making method

#59

20140030850

2014-01-30

Package substrate processing method

#60

20130220090

2013-08-29

Wafer edge trim blade with slots

#61

20130062747

2013-03-14

Semiconductor device and manufacturing method of the same

#62

20130008422

2013-01-10

Cemented carbide base outer blade cutting wheel and making method

#63

20120313231

2012-12-13

Method and apparatus for dicing die attach film on a semiconductor wafer

#64

20120252330

2012-10-04

Outer blade cutting wheel and making method

#65

20120244682

2012-09-27

WAFER DIVIDING METHOD

#66

20120009026

2012-01-12

Wafer dicing blade and wafer dicing apparatus including the same

#67

20110294403

2011-12-01

Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus

#68

20110233705

2011-09-29

Wafer processing

#69

20110192819

2011-08-11

System and method for the manufacture of surgical blades

#70

20110124181

2011-05-26

WORKPIECE CUTTING METHOD

#71

20100248450

2010-09-30

Method of producing semiconductor device

#72

20100212470

2010-08-26

DISKLIKE CUTTING TOOL AND CUTTING DEVICE

#73

20100207252

2010-08-19

Manufacturing method of semiconductor device

#74

20100197114

2010-08-05

Methods of die sawing

#75

20100181681

2010-07-22

Semiconductor device and manufacturing method of the same

#76

20100133659

2010-06-03

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT CHIP

#77

20100122617

2010-05-20

Dicing machine and adapter for dicing machine

#78

20100081255

2010-04-01

Methods for reducing defects through selective laser scribing

#79

20090317945

2009-12-24

Manufacturing method of semiconductor device

#80

20090314144

2009-12-24

Dicing method, program for the dicing method, and storage medium for the dicing method

#81

20090294913

2009-12-03

Method for manufacturing semiconductor chip and semiconductor device

#82

20090166782

2009-07-02

Wafer processing

#83

20090165768

2009-07-02

Outer blade cutting wheel and making method

#84

20090162993

2009-06-25

Method for fabricating semiconductor device

#85

20080313875

2008-12-25

Blade changing tool

#86

20080306432

2008-12-11

Cutting apparatus with ultrasonic transducer

#87

20080277806

2008-11-13

Semiconductor wafer with assisting dicing structure and dicing method thereof

#88

20080218904

2008-09-11

Electronic component and tape head having a closure

#89

20080191318

2008-08-14

SEMICONDUCTOR DEVICE AND METHOD OF SAWING SEMICONDUCTOR DEVICE

#90

20080104997

2008-05-08

Method and apparatus for dividing brittle material

#91

20080092714

2008-04-24

MULTILAYER DICING BLADE

#92

20070298690

2007-12-27

Method of eliminating surface stress of silicon wafer

#93

20070293019

2007-12-20

Methods of die sawing and structures formed thereby

#94

20070269980

2007-11-22

Methods for reducing contamination of semiconductor devices and materials during wafer processing

#95

20070243695

2007-10-18

Method for producing semiconductor wafers and a system for determining a cut position in a semiconductor ingot

#96

20070218586

2007-09-20

Manufacturing method of semiconductor device

#97

20070173035

2007-07-26

Manufacturing method of semiconductor device

#98

20070173032

2007-07-26

Wafer dicing by channels and saw

#99

20070164440

2007-07-19

Semiconductor device, dicing saw and method for manufacturing the semiconductor device

#100

20070122999

2007-05-31

Method and apparatus for fabricating and connecting a semiconductor power switching device

#101

20070111482

2007-05-17

Method for dicing glass substrate

#102

20070066188

2007-03-22

Cutting method and cutting apparatus

#103

20070045229

2007-03-01

System and method for the manufacture of surgical blades

#104

20070023026

2007-02-01

Dicing blade

#105

20070004175

2007-01-04

Semiconductor wafer cutting blade and method

#106

20060258051

2006-11-16

Method and system for solder die attach

#107

20060178098

2006-08-10

Machining apparatus

#108

20060162717

2006-07-27

Apparatus and methods for aligning a center of mass with a rotational axis of a shaft or spindle

#109

20060162173

2006-07-27

Scribing system with particle remover

#110

20060162172

2006-07-27

Scribing tool and method

#111

20060097362

2006-05-11

Method and apparatus for fabricating and connecting a semiconductor power switching device

#112

20060094342

2006-05-04

Monolithic rotating tool

#113

20060032332

2006-02-16

Cutting tool and cutting machine

#114

20060005672

2006-01-12

Blades, saws, and methods for cutting microfeature workpieces

#115

20050268763

2005-12-08

Method and apparatus for cutting semiconductor wafers

#116

20050255630

2005-11-17

Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method

#117