Patents-Review.com
ClassID:

48022 ⎘

B28D5/042 - CPC Classification

Classification description:

Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame

Recent Application in this class:
#1
20250312944
2025-10-09

CUTTING METHOD AND MANUFACTURING METHOD FOR CHIP

 #2
20250222627
2025-07-10

AUTOMATIC STROKE SETTING APPARATUS OF CUTTING DEVICE USING MULTI-WIRE

 #3
20250162198
2025-05-22

CRYSTAL WAFERING SYSTEM AND METHOD

 #4
20250033247
2025-01-30

CUTTING MONOCRYSTALLINE SILICON SQUARE ROD

 #5
20230136895
2023-05-04

Methods of recycling silicon swarf into electronic grade polysilicon or metallurgical-grade silicon

 #6
20220410434
2022-12-29

Wire saw having dust collecting apparatus

 #7
20220310382
2022-09-29

Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrate

 #8
20220310381
2022-09-29

Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrate

 #9
20220024073
2022-01-27

CRYSTAL INGOT CUTTING DEVICE AND CRYSTAL INGOT CUTTING METHOD

 #10
20220016802
2022-01-20

METHOD FOR SLICING WORKPIECE AND WIRE SAW

 #11
20210301421
2021-09-30

SiC wafer and manufacturing method for SiC wafer

 #12
20210104643
2021-04-08

Methods of recycling silicon swarf into electronic grade polysilicon or metallurgical-grade silicon

 #13
20210016413
2021-01-21

Method for slicing workpiece and wire saw

 #14
20200058484
2020-02-20

Abrasive grains, evaluation method therefor, and wafer manufacturing method

 #15
20190070751
2019-03-07

SLICING METHOD AND A SLICING APPARATUS FOR AN INGOT

 #16
20180311864
2018-11-01

WIRE SUPPLYING AND RECEIVING DEVICE FOR A WIRE SAW, INGOT SLICING WIRE SAW INCLUDING THE SAME, AND METHOD OF SLICING INGOT

 #17
20180079108
2018-03-22

Wire saw apparatus

 #18
20170239842
2017-08-24

INGOT SLICING WIRE SAW, ROLLER MODULE THEREOF, AND METHOD FOR SLICING INGOT

 #19
20140295126
2014-10-02

Method for slicing semiconductor single crystal ingot

 #20
20140017984
2014-01-16

Abrasive article and method of forming

 #21
20130192435
2013-08-01

WAFER CUTTING METHOD AND DEVICE

 #22
20120017741
2012-01-26

Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder

 #23
20100038456
2010-02-18

METHOD AND SYSTEM FOR SEPARATING A MULTIPLICITY OF CERAMIC COMPONENTS FROM A COMPONENT BLOCK

 #24
20080099006
2008-05-01

Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers

 #25
20080011134
2008-01-17

Sawing strip and method for simultaneously cutting off a multiplicity of slices from a cylindrical workpiece using a sawing strip