48021 ⎘
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Sub-classes:GEMSTONE
#2SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD
#3METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SAW, AND SEMICONDUCTOR WAFERS MADE OF MONOCRYSTALLINE SILICON
#4SYSTEMS FOR AUTHENTICATION AND RELATED DEVICES AND METHODS
#5MONOCRYSTALLINE SILICON MICRO-NANO DUAL-SCALE ANTI-REFLECTION TEXTURE AND PREPARATION METHOD THEREFOR
#6Method for manufacturing monocrystalline silicon wafer containing arced side, method for manufacturing monocrystalline silicon cell, and photovoltaic module
#7METHOD FOR CUTTING SUBSTRATE ELEMENTS
#8METHOD FOR CORING AND SLICING A CVD DIAMOND PRODUCT AND APPARATUS FOR CARRYING IT OUT
#9Method of marking a diamond, markings formed from such methods and diamonds marked according to such method
#10METHOD OF MANUFACTURING NITRIDE CERAMIC SUBSTRATE AND NITRIDE CERAMIC BASE MATERIAL
#11LASER MACHINING INSIDE MATERIALS
#12Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
#13WAFER PRODUCTION METHOD
#14Wire saw device, and processing method and processing device for workpiece
#15Workpiece processing method
#16Method for manufacturing monocrystalline silicon wafer containing arced side, method for manufacturing monocrystalline silicon cell, and photovoltaic module
#17Method for manufacturing ingot block, method for manufacturing semiconductor wafer, and device for manufacturing ingot block
#18Wafer processing method and cutting apparatus
#19Method for slicing workpiece and wire saw
#20Shaped saw wire with controlled curvature at bends
#21Gemstone verification
#22Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device
#23GEMSTONE
#24Method for slicing ingot
#25Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device
#26Method for manufacturing wire saw apparatus and wire saw apparatus
#27Apparatus for cutting substrate and system for processing same
#28GEMSTONE
#29Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device
#30Shaped saw wire with controlled curvature at bends
#31METHOD OF MANUFACTURE OF MICRO COMPONENTS, AND COMPONENTS FORMED BY SUCH A PROCESS
#32CRUCIBLE, FABRICATION METHOD OF THE CRUCIBLE, AND FABRICATION METHOD OF A CRYSTALLINE MATERIAL BY MEANS OF SUCH A CRUCIBLE
#33Wafer producing method
#34Apparatus and method for processing a substrate
#35Method of manufacturing silicon carbide substrate
#36METHODS OF FABRICATING POLYGON-SECTIONAL RODLIKE INGOT AND SUBSTRATE WITH ORIENTATION MARKER OR ROUNDED CORNERS, RODLIKE INGOT AND SUBSTRATE
#37Method for producing a silicon ingot having symmetrical grain boundaries
#38Abrasive sawing wire, production method thereof and use of same
#39Method for manufacturing a silicon cylinder by growth on seeds in a directed solidification furnace
#40Tool unit applied to ultrasonic machining
#41Surface delayering with a programmed manipulator
#42FIXED ABRASIVE GRAIN WIRE SAW, ITS MANUFACTURING METHOD, AND METHOD OF CUTTING WORKPIECE BY USING IT
#43Systems and methods for producing seed bricks
#44Method of manufacturing silicon carbide substrate
#45PROCESS AND SYSTEM FOR CUTTING A BRITTLE-MATERIAL PLATE, AND WINDOW GLASS FOR A VEHICLE
#46METHOD AND APPARATUS FOR THE PRODUCTION OF THIN DISKS OR FILMS FROM SEMICONDUCTOR BODIES
#47Laser beam machining apparatus with detection laser beam oscillator
#48Wafer manufacturing method and device
#49Method for producing semiconductor wafers and a system for determining a cut position in a semiconductor ingot
#50Method for producing single crystal ingot from which semiconductor wafer is sliced
#51Method of making solar cell
#52Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method
#53Method for cleaving brittle materials