48023 ⎘
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Silicon Rod Cutting System
#2Filter Device for Cutting Fluid, Cleaning Method for Filter Device, and Filter Circulation System
#3SYSTEM AND METHOD FOR SLICING WORKPIECE
#4HIGH DEFECT SiC WAFER WITH DEVICE LAYER AND METHODS OF MANUFACTURE
#5SiC INGOT AND METHOD FOR MANUFACTURING SiC SUBSTRATE
#6FULLY-AUTOMATIC MULTI-STATION CUTTING MACHINE AND METHOD FOR CUTTING MATERIAL
#7Semiconductor Crystal Wafer Manufacturing Device and Manufacturing Method
#8Wire Take-Up and Pay-Off Device and Slicing Machine
#9SPRAYER FOR SQUARING CRYSTAL ROD AND CRYSTAL ROD SQUARING DEVICE
#10UNDER-WIRE SPRAY CLEANING DEVICE FOR WIRE CUTTING MACHINE
#11CUTTING DEVICE AND MULTI-WIRE CUTTING MACHINE INCLUDING CUTTING DEVICE
#12DIAMOND WIRE MULTI-WIRE CUTTING MACHINE AND CUTTING DEVICE THEREOF, AND SILICON INGOT SLICING PRODUCTION LINE
#13METHOD FOR CUTTING SILICON INGOT
#14INTELLIGENT MONITORING SYSTEM AND METHOD FOR WIRE NET WAFERING
#15METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS
#16LOWER JACKING MEMBER, WIRE WITHDRAWAL METHOD, AND SQUARING MACHINE
#17PROCESSING METHOD AND PROCESSING SYSTEM FOR WIRE MESH ABNORMALITY AND ELECTRONIC DEVICE
#18PROCESSING METHOD OF CUTTING THROUGH WORKPIECE AND PROCESSING SYSTEM
#19GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND ALUMINUM NITRIDE SINGLE CRYSTAL SUBSTRATE
#20Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutting System
#21INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT
#22CNC WIRE CUTTING MACHINE
#23METAL WIRE AND SAW WIRE
#24LARGE-SIZE SINGLE CRYSTAL CUTTING DEVICE AND METHOD OF THE SAME
#25BRICK LOADING/UNLOADING APPARATUS AND METHOD
#26Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer
#27METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SAW, AND SEMICONDUCTOR WAFERS MADE OF MONOCRYSTALLINE SILICON
#28METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICONDUCTOR MATERIAL
#29Method for solving bright line scratched during lifting of large-size silicon wafer
#30METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING
#31METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICONDUCTOR MATERIAL
#32MONOCRYSTALLINE SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE
#33ALLOY WIRE ROD AND PREPARATION METHOD AND APPLICATION THEREOF
#34SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLICED IN A WIRE SAW
#35Monocrystalline SIC Substrates Having an Asymmetrical Geometry and Method of Producing Same
#36Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece
#37Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
#38Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
#39Ingot wafering systems and methods for slicing a silicon ingot
#40SOLAR SILICON WAFER CUTTING METHOD, DEVICE, AND STORAGE MEDIUM
#41METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES
#42Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
#43TUNGSTEN WIRE, SAW WIRE, AND TUNGSTEN WIRE FOR SCREEN PRINTING
#44METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES
#45Workplate for Y-axis compensation of ingot and Y-axis compensation method of ingot using the same
#46METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES
#47Wire saw having dust collecting apparatus
#48Ingot temperature controller and wire sawing device having same
#49METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING A NUMBER OF SEPARATING PROCESSES BY MEANS OF A WIRE SAW, AND SEMICONDUCTOR WAFER MADE OF MONOCRYSTALLINE SILICON
#50Manufacturing method of silicon carbide wafer, silicon carbide wafer and system for manufacturing wafer
#51Method for cutting silicon rod and apparatus for dimaond multi-wire cutting
#52Monolayer graphene on non-polar face SiC substrate and control method thereof
#53Method for cutting substrate wafer from indium phosphide crystal bar
#54METHOD FOR PRODUCING SEMICONDUCTOR WAFERS BY MEANS OF A WIRE SAW
#55Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
#56MULTI-LINE CUTTING METHOD, MULTI-LINE CUTTING APPARATUS AND USE THEREOF, SEMICONDUCTOR MATERIAL AND POWER DEVICE
#57Wire saw apparatus and method for manufacturing wafer
#58CUTTING METHOD AND CUTTING DEVICE
#59Wire saw device, and processing method and processing device for workpiece
#60METHOD AND APPARATUS FOR SIMULATING PRODUCTION TIME OF WAFER SLICER
#61Method for manufacturing hexagonal semiconductor plate crystal
#62Method for preparing SiC ingot, method for preparing SiC wafer and the SiC wafer prepared therefrom
#63Method for slicing ingot and wire saw
#64Method for manufacturing ingot block, method for manufacturing semiconductor wafer, and device for manufacturing ingot block
#65Method for manufacturing silicon carbide substrate, method for manufacturing silicon carbide epitaxial substrate, and method for manufacturing silicon carbide semiconductor device
#66Method for slicing workpiece and wire saw
#67METHOD AND APPARATUS FOR RESUMING THE WIRE SAWING PROCESS OF A WORKPIECE AFTER AN UNPLANNED INTERRUPTION
#68Longitudinal silicon ingot slicing apparatus
#69Slurry sprayers, adjustable supports for same, and methods for slicing a silicon ingot
#70Method for slicing workpiece
#71Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot
#72Spool with saw wire having elastic and plastic rotations
#73PROCESS FOR CUTTING SLICES FROM AN INGOT MADE OF HARD MATERIAL AND ABRASIVE WIRE
#74Methods and system for controlling a surface profile of a wafer
#75Metal wire, saw wire, cutting apparatus, and method of manufacturing metal wire
#76WIRE MANAGEMENT SYSTEM
#77Ingot clamping device and wire sawing apparatus for slicing ingot having the same
#78Method for manufacturing wire saw apparatus and wire saw apparatus
#79Abrasive article and method of forming
#80Diamond wire cutting method for crystal boules
#81Shaped silicon ingot using layer transfer
#82WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WORKPIECE
#83Saw wire and cutting apparatus
#84Method for slicing workpiece and wire saw
#85Workpiece holder and method for slicing workpiece
#86ABRASIVE DIAMOND GRAIN FOR WIRE TOOL AND WIRE TOOL
#87ABRASIVE WIRE FOR CUTTING SLICES FROM AN INGOT OF HARD MATERIAL
#88Wire saw device and workpiece cutting method
#89Abrasive article and method of forming
#90Ingot pressing apparatus and ingot slicing apparatus including the same
#91Silicon ingot slicing apparatus using microbubbles and wire electric discharge machining
#92Ingot slicing apparatus
#93METHODS FOR PRODUCING DIAMOND GRITS FOR A WAFER SLICING SYSTEM
#94Ingot cutting apparatus, and load detecting device used in ingot cutting apparatus
#95METHOD FOR MANUFACTURING HEXAGONAL SEMICONDUCTOR PLATE CRYSTAL
#96Chain driven diamond wire cutter
#97Methods and system for controlling a surface profile of a wafer
#98Wire sawing apparatus
#99WIRE CUTTING DEVICE COMPRISING A ROTARY MEMBER PROVIDED WITH MEANS FOR LUBRICATION OF THE WIRE
#100RECOVERY OF SILICON VALUE FROM KERF SILICON WASTE
#101Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
#102ABRASIVE ARTICLE AND METHOD OF FORMING
#103Method for slicing workpiece and processing liquid
#104Method and device for slicing a shaped silicon ingot using layer transfer
#105Abrasive article and method of forming
#106MULTI-WIRE SAW
#107Silicon carbide substrate, semiconductor device and methods for manufacturing them
#108Method for slicing workpiece and workpiece holder
#109Method for slicing workpiece
#110METHOD AND DEVICE FOR WIRE CUTTING OF A MATERIAL
#111Silicon carbide ingot and method for manufacturing silicon carbide substrate
#112Method of manufacturing silicon carbide substrate
#113Systems and methods for manufacturing diamond coated wires
#114Method for slicing ingot and wire saw
#115Method for producing a silicon ingot having symmetrical grain boundaries
#116Method for manufacturing a silicon cylinder by growth on seeds in a directed solidification furnace
#117Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries
#118Abrasive sawing wire, production method thereof and use of same
#119Method of growing group III nitride crystals
#120Sample preparation apparatus for direct numerical simulation of rock properties
#121Wire saw
#122Ingot cutting method capable of reducing wafer damage percentage
#123Method of resuming operation of wire saw
#124Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece
#125Methods for producing rectangular seeds for ingot growth
#126Method for processing semiconductor wafer
#127Wire management system
#128Wire saw apparatus and cut-machining method
#129Method for slicing wafers from a workpiece using a sawing wire
#130ABRASIVE-GRAIN WIRE TOOL
#131Wire discharge-machining apparatus with parallel cutting wires
#132SLICING DEVICE
#133Wire guide, wire saw apparatus including the same, and method for slicing ingot using the same
#134PRODUCTION OF MONO-CRYSTALLINE SILICON
#135Wire saw and workpiece machining method employing same
#136Sample preparation apparatus for direct numerical simulation of rock properties
#137Method for cutting high-hardness material by multi-wire saw
#138METHOD FOR CUTTING A SINGLE CRYSTAL
#139Sapphire wafer squaring machine with double swing cutter heads
#140Method for slicing wafers from a workpiece by means of a wire saw
#141Sawing wire, method and equipment for manufacturing such a wire, and use
#142PRODUCTION OF MONO-CRYSTALLINE SILICON
#143AQUEOUS WIRE SLICING FLUIDS AND RELATED METHODS OF SLICING
#144Method for simultaneously cutting a multiplicity of wafers from a workpiece
#145Methods, wires, and apparatus for slicing hard materials
#146Slurry and method for producing slurry
#147Semiconductor device and method for manufacturing semiconductor device
#148METHOD FOR SLICING WORKPIECE
#149Abrasive article and method of forming
#150Method for slicing semiconductor single crystal ingot
#151SYSTEM AND METHOD FOR DIVIDING SILICON BLOCKS
#152Methods for producing rectangular seeds for ingot growth
#153Resin-coated saw wire and cut article
#154Precision wire saw including surface modified diamond
#155ABRASIVE ARTICLE AND METHOD OF FORMING
#156Method for resuming a wire sawing process of a workpiece after an unplanned interruption
#157Method and device for slicing a shaped silicon ingot using layer transfer
#158Method of growing group III nitride crystals
#159Method of growing group III nitride crystals
#160WAFER SAWING SYSTEM
#161ABRASIVE ARTICLE AND METHOD OF FORMING
#162Abrasive article and method of forming
#163Abrasive article and method of forming
#164Method for resuming operation of wire saw and wire saw
#165Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece
#166Apparatus for slicing ingot
#167METHOD FOR MANUFACTURING HEXAGONAL SEMICONDUCTOR PLATE CRYSTAL
#168METHOD OF CUTTING AN INGOT FOR SOLAR CELL FABRICATION
#169Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing method
#170SAPPHIRE MATERIAL AND PRODUCTION METHOD THEREOF
#171Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece
#172Methods for mounting an ingot on a wire saw
#173Systems For Controlling Temperature Of Bearings In A Wire Saw
#174Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw
#175Methods For Controlling Displacement Of Bearings In A Wire Saw
#176Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw
#177Methods, wires, and apparatus for slicing hard materials
#178Sawing apparatus of single crystal ingot
#179Methods, wires, and apparatus for slicing hard materials
#180SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECE
#181Abrasive article and method of forming
#182METHOD OF MANUFACTURING GROUP III NITRIDE CRYSTAL SUBSTRATE
#183Silicon carbide substrate, semiconductor device, and methods for manufacturing them
#184Method of manufacturing silicon carbide substrate
#185Wire saw with tension detecting means and guide roller speed control
#186Method of cutting workpiece with wire saw, and wire saw
#187WIRE SAW WORK PIECE SUPPORT DEVICE, SUPPORT SPACER AND METHOD OF SAWING USING SAME
#188DIAMOND WIRE SAW DEVICE
#189Method for slicing wafers from a workpiece
#190Method for slicing wafers from a workpiece
#191Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries
#192METHOD OF SLICING SILICON INGOT USING WIRE SAW AND WIRE SAW
#193Abrasive article and method of forming
#194METHOD AND DEVICE FOR PRODUCING THIN SILICON RODS
#195GUIDE ROLLER FOR WIRES
#196APPARATUS AND METHOD FOR SAWING SINGLE CRYSTAL INGOT
#197WIRE SAW
#198Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member
#199Wiresaw cutting method
#200SILICON SUBSTRATE FOR SOLAR BATTERY, MANUFACTURING APPARATUS THEREOF, MANUFACTURING METHOD THEREOF, AND SOLAR BATTERY
#201Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material
#202Ingot cutting apparatus and ingot cutting method
#203WIRE SAW DEVICE AND METHOD FOR OPERATING SAME
#204Band saw cutting apparatus and ingot cutting method
#205MULTI-WIRE WAFER CUTTING APPARATUS AND METHOD
#206Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device
#207Wire and methodology for cutting materials with wire
#208Wire discharge-machining apparatus with parallel cutting wires
#209METHOD FOR RESUMING OPERATION OF WIRE SAW AND WIRE SAW
#210Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device
#211Method for slicing workpiece
#212Wafer dividing apparatus and methods
#213Wire saw device
#214Method and System for Processing Abrasive Slurry
#215Method for slicing workpiece by using wire saw and wire saw
#216Method for slicing workpiece by using wire saw and wire saw
#217Wire saw apparatus
#218Method and product for cutting materials
#219Method of improving nanotopography of surface of wafer and wire saw apparatus
#220Method and system for manufacturing wafer-like slices from a substrate material
#221Slicing method and a wire saw apparatus
#222Multi-wire saw and method for cutting ingot
#223Method and apparatus for cutting and cleaning wafers in a wire saw
#224In-situ wafer processing system and method
#225METHOD AND APPARATUS FOR CUTTING WAFERS BY WIRE SAWING
#226Slicing method and wire saw apparatus
#227Method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers
#228Wire monitoring
#229Slicing method
#230Slurry for slicing silicon ingot and method for slicing silicon ingot using the same
#231WIRE SLICING SYSTEM
#232CARBON NANOTUBE FIBER WIRE FOR WAFER SLICING
#233Cutting methods and cutting apparatus
#234Slicing method and method for manufacturing epitaxial wafer
#235Monofilament metal saw wire
#236Method of manufacturing (110) silicon wafer
#237Methods, wires, and apparatus for slicing hard materials
#238WORKPIECE MOUNTING AND METHOD FOR WIRE SAWING
#239Method of producing III-nitride substrate
#240Wire guide roll for wire saw and method
#241Method of producing silicon blocks and silicon wafers
#242Method and device for sawing a workpiece
#243Method for slicing a multiplicity of wafers from a workpiece
#244Abrasive wire sawing
#245METHOD AND CUTTING AND LAPPING A WORKPIECE
#246System and method for cutting soluble scintillator material
#247Precision slicing of large work pieces
#248Apparatus and method for slicing an ingot
#249Apparatus and method for slicing an ingot
#250Apparatus and method for slicing an ingot
#251Wire saw
#252Method of producing III-nitride substrate
#253Process for the detection of a malfunction in a device for wire sawing and device for practicing said process
#254Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same
#255Method of producing III-nitride substrate
#256Multi-wire saw
#257Method for wire sawing
#258Method for cutting a single crystal ingot
#259Apparatus and method for slicing an ingot
#260Wire sawing apparatus and wire sawing method
#261Method of cutting rare-earth alloy
#262Method and apparatus of cutting crystalline material
#263Longitudinal silicon ingot slicing machine and jig fixture