48024 ⎘
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS
#2PEELING APPARATUS
#3SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING
#4Ultrasonic resonator support structure and ultrasonic vibration machining apparatus
#5Cutting method
#6MULTI-LINE CUTTING METHOD, MULTI-LINE CUTTING APPARATUS AND USE THEREOF, SEMICONDUCTOR MATERIAL AND POWER DEVICE
#7Sound-assisted crack propagation for semiconductor wafering
#8Ultrasonic peening-type integrated machining method of cutting and extrusion
#9Processing apparatus
#10Peeling apparatus
#11Sound-assisted crack propagation for semiconductor wafering
#12Silicon wafer forming method
#13Semiconductor substrate manufacturing method
#14Tool unit applied to ultrasonic machining
#15Ultrasonic micron precision molding apparatus
#16Method of processing tempered glass
#17Cutting method of honeycomb formed body
#18Honeycomb catalyst body
#19Spindle and flexible hinge used in ultrasonic machine
#20Process for producing components
#21Cutting method and cutting apparatus
#22Impact induced crack propagation in a brittle material
#23Ultrasonic induced crack propagation in a brittle material
#24Cutting or grinding machine
#25Acoustic cleaving apparatus and methods of acoustic cleaving