Patents-Review.com
ClassID:

54201 ⎘

B29L2031/3493 - CPC Classification

Classification description:

Other particular articles; Electrical apparatus, e.g. sparking plugs or parts thereof Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces

Recent Application in this class:
#1
20250374438
2025-12-04

METHOD FOR PREPARING MICRO-NANO FLEXIBLE CONDUCTIVE CIRCUIT BASED ON ULTRASONIC DRIVING OF LIQUID METAL

 #2
20250202183
2025-06-19

ELECTRICAL CONNECTORS WITH THIN INTERIOR WALLS

 #3
20250007110
2025-01-02

OVERMOLDED BUSBARS AND INTEGRATED SENSORS

 #4
20240269907
2024-08-15

METHOD AND TOOL FOR PRODUCING A CONNECTION BETWEEN AT LEAST TWO METAL PARTS

 #5
20240181727
2024-06-06

METHOD OF MANUFACTURING A MATERIAL COMPRISING AT LEAST ONE ELECTRONIC ELEMENT

 #6
20230294374
2023-09-21

METHOD FOR MANUFACTURING POLYMER COMPOSITES WITH EMBEDDED FUNCTIONALITIES

 #7
20220393419
2022-12-08

Electrical connectors with thin interior walls

 #8
20210282234
2021-09-09

Lens heating systems and methods for an LED lighting system

 #9
20210138704
2021-05-13

Process for plastic overmolding on a metal surface and plastic-metal hybride part

 #10
20210023750
2021-01-28

Hybrid molding with selective release additive material systems

 #11
20190217529
2019-07-18

Method and apparatus for manufacturing a mechatronic system by three-dimensional printing

 #12
20190001536
2019-01-03

Resin-molding device and method for producing resin-molded product

 #13
20180354189
2018-12-13

Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning

 #14
20180337296
2018-11-22

Composite vehicle skin co-cured with solar-cell array

 #15
20170334139
2017-11-23

METHOD FOR ADDITIVE MANUFACTURING OF A 3D MECHATRONIC OBJECT

 #16
20170217062
2017-08-03

Device for molding semiconductor package

 #17
20170214191
2017-07-27

Connector assembly

 #18
20170103932
2017-04-13

Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same

 #19
20170066168
2017-03-09

Multilayer body and method for producing same

 #20
20160214292
2016-07-28

Insert-moulded lead frame and method for the production thereof

 #21
20160061634
2016-03-03

Injection-molded circuit carrier

 #22
20160049718
2016-02-18

Wired pipe coupler connector

 #23
20150372438
2015-12-24

Molding method using mold structure

 #24
20150303637
2015-10-22

Mold structure

 #25
20150251344
2015-09-10

Methods of manufacturing a pattern recognition feature on a molded lead frame

 #26
20150194797
2015-07-09

Heat sink for contactor in power distribution assembly

 #27
20150190954
2015-07-09

Strain relief for connector and cable interconnection

 #28
20150073068
2015-03-12

Liquid crystal polyester composition, method for producing liquid crystal polyester composition, and molded article

 #29
20130108829
2013-05-02

STAMPED FEATURE FOR VISUAL PATTERN RECOGNITION

 #30
20130084740
2013-04-04

Strain relief for connector and cable interconnection

 #31
20120134631
2012-05-31

Molded Interconnect Device (MID) with Thermal Conductive Property and Method for Production Thereof

 #32
20110135858
2011-06-09

Housing and method for making the same

 #33
20110057858
2011-03-10

Device housing

 #34
20100039745
2010-02-18

METHOD OF ANTISTATIC DEPOSITION ON COMPONENTS OF MOBILE PHONE

 #35
20100028648
2010-02-04

Product with internal cavities, and method, system and mould for manufacturing such a product

 #36
20090020328
2009-01-22

Hybrid antenna structure

 #37
20070166530
2007-07-19

Injection molding method with surface modification

 #38
20050231197
2005-10-20

Position sensor provided in the form of a hall-effect sensor

 #39
20050205407
2005-09-22

Multi-shot molded touch switch

 #40
20050175849
2005-08-11

Injection molding method with surface modification