COMPOSITE COPPER FOIL AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING COMPOSITE METAL FOIL

SILVER-TIN COATING FOR ELECTRICAL CONNECTORS, AND ELECTRICAL CONNECTORS WITH SILIVER-TIN COATINGS

METALLIC FOAM BODY WITH CONTROLLED GRAIN SIZE ON ITS SURFACE, PROCESS FOR ITS PRODUCTION AND USE THEREOF

Composite metal foil

MULTILAYER COATING FOR INTERFACE CONES

Silver-Bismuth Electrolyte for Separating Hard Silver Layers

AG-COATED MATERIAL, METHOD FOR PRODUCING AG-COATED MATERIAL, AND TERMINAL COMPONENT

Hybrid base plate

NOBLE METAL COATED SILVER NANOWIRES

Samarium-silver alloy clad structure for charging terminals and manufacturing method thereof

THERMAL RADIATION ELEMENT, THERMAL RADIATION ELEMENT MODULE, AND THERMAL RADIATION LIGHT SOURCE

Silver-plated product and method for producing same

STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER

Bonding sheet and bonded structure

NANOCRYSTALLINE PLATINUM ALLOY LAYERS AND RELATED ARTICLES

MULTILAYER PLATING FILM

MULTI-COLORED DECORATIVE COMPONENT AND METHOD

Copper alloy for electronic/electrical devices, copper alloy planar bar stock for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar

Copper-alloy capping layers for metallization in touch-panel displays

Heat sink, semiconductor package and semiconductor module

Laminate

Laminate and method for producing same

Electrical contact element

Bonding wire

Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof

Photosensitive electrically conductive structure and touch sensor

METAL MATERIAL AND CONNECTION TERMINAL

Palladium plating solution and plating method

NANOSTRUCTURED PALLADIUM-BASED ALLOYS AND RELATED METHODS

Copper-alloy capping layers for metallization in touch-panel displays

Immersion plating treatments for indium passivation

METHOD FOR THE REALIZATION OF A TWO LAYER METAL WIRE, IN PARTICULAR MADE OF GOLD-BASED ALLOY AND OF SILVER, AND A SEMI-FINISHED TUBULAR ELEMENT

Discontinuous vacuum-metalized thin film and wire and method for manufacturing same

Superhydrophobic platform for sensing urine metabolites and toxins

Plating film and plated member

METALLIC FOAM BODY WITH CONTROLLED GRAIN SIZE ON ITS SURFACE, PROCESS FOR ITS PRODUCTION AND USE THEREOF

Roll-bonded laminate and method for producing the same

Composite and multilayered silver films for joining electrical and mechanical components

Core-shell nanowire, method of forming core-shell nanowire, and stretchable composite comprising core-shell nanowire

Magnetic head and magnetic recording device having magnetic layers and non-magnetic layers between shield and magnetic pole

METHODS FOR IMPROVING LOADING RATIO OF HYDROGEN GAS

Metallic material and connection terminal

Coated articles

Materials for near field transducers and near field transducers containing same

Thermalization of cryogenic quantum circuits

ALLOY FOR MAKING TRACE WIRES AND TOUCH PANEL USING THE SAME

Thin metal membrane with support

Silver-plated product and method for producing same

Optical thin film, optical element, optical system, and method for producing optical thin film

Copper-based antimicrobial PVD coatings

SURFACE-TREATED MATERIAL AND COMPONENT PRODUCED BY USING THE SAME

METHOD OF PLATING A METALLIC SUBSTRATE TO ACHIEVE A DESIRED SURFACE COARSENESS

Electromagnetic relay

Laminated member, laminated body, and motor

Wiring board and method for manufacturing same

Electrical contact element for an electrical connector having microstructured caverns under the contact surface

Ceramic circuit substrate and method for producing ceramic circuit substrate

Clad material for electric contacts and method for producing the clad material

MATERIALS FOR NEAR FIELD TRANSDUCERS AND NEAR FIELD TRANSDUCERS CONTAINING SAME

Coil component

Bonding wire for semiconductor device

Materials for near field transducers and near field transducers containing same

JOINT STRUCTURE AND MANUFACTURING METHOD THEREOF

Surface mount metal unit and electric device including same

Seal ring and method for manufacturing seal ring

Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar

Thin-film transistor and method of forming an electrode of a thin-film transistor

Materials for near field transducers and near field transducers containing same

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Single-phase alloy of gold and tungsten

Double pinned magnetoresistance element with temporary ferromagnetic layer to improve annealing

COATED ARTICLES AND METHODS

Silver-plated product and method for producing same

Palladium composite membrane

Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same

Noble metal-coated nanostructures and related methods

COPPER ALLOY PLATE STRIP FOR USE IN LED LEAD FRAME

ARTICLES INCLUDING NICKEL-FREE COATING AND METHODS

ARTICLES INCLUDING A MULTI-LAYER COATING AND METHODS

Bonding wire for semiconductor device

METALLIC FOAM BODY WITH CONTROLLED GRAIN SIZE ON ITS SURFACE, PROCESS FOR ITS PRODUCTION AND USE THEREOF

Corrosion resistant optical device

Wafer reconfiguration during a coating process or an electric plating process

Age hardenable clad metal having gold fineness and a surface layer with enhanced resistance to tarnish, scratching, and wear

Electrical contact material, method of producing an electrical contact material, and terminal

Materials for near field transducers, near field tranducers containing same, and methods of forming

Noble metal coated silver nanowires, methods for performing the coating

Palladium (Pd)-coated copper wire for ball bonding

Bonding wire for semiconductor device

Methods of forming metallic glass multilayers

Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

Device comprising a connecting component and method for producing a connecting component

Metal plate coated stainless material and method of producing metal plate coated stainless material

Lead-free solder ball

ELECTROLESS PLATING METHOD AND ELECTROLESS PLATING FILM

Spark plug

Gold plate coated material

Composite and multilayered silver films for joining electrical and mechanical components

Self-aligned tunable metamaterials

Materials for near field transducers and near field transducers containing same

CONTACT TERMINAL STRUCTURE

CONTACT ELEMENT WITH GOLD COATING

COMPOSITE LAMINATE AND ELECTRONIC DEVICE

Age hardenable clad metal having silver fineness and a surface layer with enhanced resistance to tarnish, scratching, and wear

Corrosion Resistant Barrier Formed by Vapor Phase Tin Reflow

Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same

Metallization stack and chip arrangement

METHODS OF FORMING METALLIC GLASS MULTILAYERS

Low-temperature nanosolders

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

THIN METAL MEMBRANE WITH SUPPORT

Seal ring and method for manufacturing seal ring

BONDING WIRE AND PROCESS FOR MANUFACTURING A BONDING WIRE

Encapsulated beam and method of forming

Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component

METHOD AND DEVICE FOR PRODUCING SILVER-CONTAINING LAYER, SILVER-CONTAINING LAYER, AND SLIDING CONTACT MATERIAL USING SILVER-CONTAINING LAYER

HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES

Silver-plated product and method for producing same

Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same

SILVER ELECTROPLATING SOLUTION

Method of electroless gold plating

Electric contact and socket for electric parts

Electric contact and socket for electrical part

Plated member and plated terminal for connector

Electrode material for thermal-fuse movable electrode

Metallic material for electronic components, and connector terminals, connectors and electronic components using same

Electrical plug type connector having a microstructured contact element

Materials for near field transducers, near field tranducers containing same, and methods of forming

Materials for near field transducers and near field transducers containing same

Materials for near field transducers and near field transducers containing same

Tin whisker mitigation material using thin film metallic glass underlayer

Metal material for electronic component and method for manufacturing the same

Bonding wire and method for manufacturing same

Multi shell metal particles and uses thereof

Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate

Solder powder, and solder paste using solder powder

Solder, solder joint structure and method of forming solder joint structure

Pt-Al-Hf/Zr coating and method

PLATING DESIGN AND PROCESS FOR IMPROVED HERMETICITY AND THERMAL CONDUCTIVITY OF GOLD-GERMANIUM SOLDER JOINTS

Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board

Tribologically Loadable Mixed Noble Metal/Metal Layers

Alloy powder for oxidation-resistant coating, and alloy material formed of the powder and excellent in oxidation resistance characteristics

Lead-free solder ball

ZIRCONIUM-COATED STEEL PLATES AND CHEMICAL DEVICE ELEMENTS PRODUCED WITH SUCH PLATES

Connector with gold-palladium plated contacts

Method for manufacturing electronic component device with a Ni—Bi alloy sealing frame

Encapsulated beam and method of forming

Bonding material and bonding body, and bonding method

Coated articles and methods

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Multiple layer FePt structure

Method for depositing a nickel-metal layer

High temperature resistant silver coated substrates

Alloy wire and methods for manufacturing the same

Process for producing sliding member and sliding member

Components for EUV Lithographic Apparatus, EUV Lithographic Apparatus Including Such Components and Method for Manufacturing Such Components

Surface-treated metal sheet and process for producing formed article from the surface-treated metal sheet

COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURE FOR SAME

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device

Disk with an electrical connection element

Immersion platinum plating solution

Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same

Electrooptical or electromechanical component or sliding element

Disk with an electrical connection element

Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material

MULTILAYER STRUCTURE WITH HIGH ORDERED FePt LAYER

SILVER-NICKEL CORE-SHEATH NANOSTRUCTURES AND METHODS TO FABRICATE

Porous metal article and about method for manufacturing same

SLIDING BEARING

SYSTEM AND METHOD FOR SYNTHESIZING CORE/ALLOY NANOSTRUCTURES

High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device

Ring manufacturing method, apparatus of the same and ring

ELECTROLYTIC GOLD OR GOLD PALLADIUM SURFACE FINISH APPLICATION IN CORELESS SUBSTRATE PROCESSING

Coated articles and methods

METHOD OF PRODUCING PRESS-HARDENED STRUCTURAL PARTS

OXIDE-DISPERSION-STRENGTHENED PLATINUM MATERIAL AND METHOD FOR PRODUCING THE SAME

Electrical feedthrough assembly

FUEL CELL SEPARATOR MATERIAL, FUEL CELL SEPARATOR USING SAME, FUEL CELL STACK, AND METHOD FOR PRODUCING FUEL CELL SEPARATOR MATERIAL

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same

Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same

Immersion platinum plating solution

Coated articles and methods

PLATINUM WELD STRUCTURES AND METHODS

Electronic component device with a Ni-Bi alloy sealing frame

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

Bonding wire for semiconductor

SLIDING CONTACT MATERIAL

Coated articles and methods

Plain bearing composite material, use thereof and production methods therefor

Sliding contact material, clad composite material, and motor

Pt-Al-Hf/Zr coating and method

Slide member

Magnesium alloy compound type thermal metal material

Method for preparing FePt media at low ordering temperature and fabrication of exchange coupled composite media and gradient anisotropy media for magnetic recording

SILVER-COATED MATERIAL FOR MOVABLE CONTACT COMPONENT AND METHOD FOR MANUFACTURING SUCH SILVER-COATED MATERIAL

Transparent conductive layer and preparation method thereof

Connecting wire and method for manufacturing same

PRECIOUS METAL COMPOSITION, METHOD AND ARTICLE OF JEWELRY COMPRISING SAME

Slide member

HIGH REFLECTIVITY INFRARED COATING APPLICATIONS FOR USE IN HIRSS APPLICATIONS

Composite material with electric contact layer, and method of making the same

METAL MATERIAL WITH ELECTRIC CONTACT LAYER AND MANUFACTURING METHOD OF THE SAME

Plain bearing composite material, use thereof and production methods therefor

Cladding material and its manufacturing method, press-forming method, and heat sink using cladding material

Method of surface treatment for the inhibition of whiskers

Bonding pad structure and semiconductor device including the bonding pad structure

Zirconium-coated steel plates and chemical device elements produced with such plates

Material for electric contact and method of producing the same

PRECIOUS METAL JEWELRY AND PROCESS FOR PRODUCING THE SAME

Process for protecting the surface of a substrate of intermetallic alloy with a titanium aluminide base against corrosion

SILVER/ALUMINUM/COPPER/TITANIUM NICKEL/BRAZING ALLOYS FOR BRAZING WC-CO TO TITANIUM AND ALLOYS THEREOF, BRAZING METHODS, AND BRAZED ARTICLES

Novel Ruthenium-Based Materials and Ruthenium Alloys, Their Use in Vapor Deposition or Atomic Layer Deposition and Films Produced Therefrom

Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same

PALLADIUM-CONTAINING PLATING SOLUTION AND ITS USES

Multi-ply cookware with copper-aluminum-stainless steel

Novelty in the Method for the Combination of Gold and the Other Minerals

Copper-silver alloy wire and method for manufacturing the same

TWO WAY COMPOSITE NITINOL ACTUATOR

Light weight x-ray radiation shield for electronics components and related fabrication method

Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method

Magnetic structures, methods of fabricating magnetic structures and micro device incorporating such magnetic structures

Razor blades and compositions and processes for the production of razor blades

Reduction of the loss of zinc by its reaction with oxygen in galvanized steel and batteries

Plated film of gold-cobalt amorphous alloy, electroplating bath, and method for electroplating

Gold/nickel/copper/titanium brazing alloys for brazing WC-Co to titanium alloys

Hydrogen permeable alloy

Electronic component package including joint material having higher heat conductivity

Process for coating silver indium alloy metallic seal

Commutator and brush materials for small electric motor, clad composite material, and small electric DC motor using the same

Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof

Electrical contact and electrical equipment including the same

Contact surfaces for electrical contacts and method for producing the same

Electric contact

Electrical plug contacts and a semi-finished product for the production thereof

Pellicle frame

Electrical contact

High reflectivity infrared coating applications for use in HIRSS applications

Synthetic pattern exchange configuration for side reading reduction

Method and structure for arresting/preventing fires in titanium clad compositions

Enhanced stability bipolar plate

Metal member and electric contact using same

Submount and semiconductor device

Two way composite nitinol actuation

Metallic separator for fuel cell and manufacturing method therefor

Metal member coated with metal layers

Al-Cu bonded structure and method for making the same

Electrodeposited platinum-gold alloy

Stable nanocrystalline metal alloy coatings with ultra-low wear