MICRO-TRANSFER PRINTING FOR MEMS

METHOD FOR PROCESSING SILICON SUBSTRATE AND METHOD FOR PROCESSING LIQUID EJECTION HEAD SUBSTRATE

MEMS DEVICE

CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE

Microfluidic passage with protective layer

MEMS device, liquid ejecting head, and liquid ejecting apparatus

DEVICE AND METHOD OF MANUFACTURING THE DEVICE

PRINTER JETTING MECHANISM AND PRINTER EMPLOYING THE PRINTER JETTING MECHANISM

Deep reactive ion etching process for fluid ejection heads

EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER

Corrosion tolerant micro-electromechanical fluid ejection device

Three-dimensional features formed in molded panel

MEMS device, liquid ejecting head, liquid ejecting apparatus, manufacturing method of MEMS device, manufacturing method of liquid ejecting head, and manufacturing method of liquid ejecting apparatus

MEMS chip assembly having multiple trenches

Process for forming inkjet nozzle devices

Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process

Inkjet printhead with grout retaining features

Inkjet printhead with encapsulant-retaining features

Process for filling etched holes using first and second polymers

MEMS device, liquid ejecting head, and liquid ejecting apparatus

AMORPHOUS THIN METAL FILM

Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head

Three-dimensional features formed in molded panel

Bond rings in semiconductor devices and methods of forming same

Method for forming film and method for manufacturing inkjet print head

Nozzle substrate, ink-jet print head, and method for producing nozzle substrate

MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device

MEMS device, liquid ejecting head, and liquid ejecting apparatus

Manufacturing method of joined body, manufacturing method of MEMS device, manufacturing method of liquid ejecting head, and manufacturing device of joined body

Method of forming space for use in analysis devices

MEMS device, head and liquid jet device

Process for filling etched holes using photoimageable thermoplastic polymer

Bond rings in semiconductor devices and methods of forming same

Method for processing silicon substrate and method for manufacturing liquid ejection head

Elastic device

MEMS device, liquid ejecting head, and liquid ejecting apparatus

WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE, METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTING APPARATUS

Heating system and method for microfluidic and micromechanical applications

Process for filling etched holes

Substrate etch

Substrate etch

Fluidic circuits and related manufacturing methods

Substrate plate for MEMS devices

Coated microfluidic devices and methods of making

Substrate processing method

Corrugated membrane MEMS actuator fabrication method

Article with controlled wettability

Fibrous projections structure

Method of manufacturing liquid ejection head substrate

Forming nozzles

Coated microfluidic devices and methods of making

Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same

Heating system and method for microfluidic and micromechanical applications

METHOD OF REMOVING PHOTORESIST AND ETCH-RESIDUES FROM VIAS

METHOD OF ETCHING BACKSIDE INK SUPPLY CHANNELS FOR AN INKJET PRINTHEAD

Inkjet nozzle assembly having bilayered passive beam

Silicon structure, method for manufacturing the same, and sensor chip

BONDING METHOD OF SILICON BASE MEMBERS, DROPLET EJECTION HEAD, DROPLET EJECTION APPARATUS, AND ELECTRONIC DEVICE

Forming nozzles

Multi-step process for forming high-aspect-ratio holes for MEMS devices

Method Of Fabricating A Printhead IC

Decreased actuation voltage in MEMS devices by constraining membrane displacement without using conductive “landing pad”

Bonded Microfluidics System Comprising CMOS-Controllable Microfluidic Devices

Method of forming an ink supply channel

Printer with reduced co-efficient of static friction nozzle plate

Heating system and method for microfluidic and micromechanical applications

METHOD OF REMOVING PHOTORESIST

Method of fabricating inkjet printhead with projections patterned across nozzle plate

Formation of a slot in a silicon substrate

Formation of silicon nitride layer on back side of substrate

Semiconductor fabrication method suitable for MEMS

Thermal bend actuator comprising passive element having negative thermal expansion

Substrate preparation method for a MEMS fabrication process

Electrostatic actuator and method of making the electrostatic actuator

Method for making a micro-fluid ejection device

Method for dry etching fluid feed slots in a silicon substrate

Multiple stage MEMS release for isolation of similar materials

Method of fabricating suspended beam in a MEMS process

Reduced stiction printhead surface

Method of forming low-stiction nozzle plate for an inkjet printhead

Sloped thin film substrate edges

Method for dry etching fluid feed slots in a silicon substrate

Integrated circuit device including a bifunctional core material in a chamber

Method of removing a polymer coating from an etched trench

Method of modifying an etched trench

Method of separating MEMS devices from a composite structure

Method for forming a chamber in an electronic device and device formed thereby

Method for making a micro-fluid ejection device

Slotted substrates and methods of forming

Microdevice processing systems and methods

Thermal bend actuator with corrugate profile

Method of forming a through-substrate interconnect

Method of fabricating MEMS devices on a silicon wafer

Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film