MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

CAPACITIVE MICROELECTROMECHANICAL PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS

LOUDSPEAKER COMPRISING A MICRO-ELECTROMECHANICAL UNIT

ACOUSTIC LIMITER FOR MICRO-ELECTRICAL-MECHANICAL SYSTEMS (MEMS) MICROPHONES AND OTHER DEVICES

METHOD FOR ATTACHING A BRIDGING METAL LAYER IN VIA HOLES FOR SUPPORTING POSTS

MEMS SENSOR ARRANGEMENT AND METHOD FOR MANUFACTURING A MEMS SENSOR ARRANGEMENT

METHOD FOR MANUFACTURING MEMS DEVICE INCLUDING COIL STRUCTURE

GAS SENSOR AND METHOD FOR MANUFACTURING THEREOF

MICRO-DEVICE STRUCTURES WITH ETCH HOLES

SELF-ALIGNED ACOUSTIC HOLE FORMATION IN PIEZOELECTRICAL MEMS MICROPHONE

MICROELECTROMECHANICAL SYSTEMS DEVICE AND MANUFACTURING METHOD THEREOF

MICRO-DIFFERENTIAL PRESSURE SENSOR, PACKAGING STRUCTURE, TESTING METHOD AND ELECTRONIC DEVICE

MICROELECTROMECHANICAL SENSOR WITH IMPROVED EXTERNAL FLUIDIC COUPLING AND MANUFACTURING PROCESS THEREOF

DROP RESISTANT MEMS ACTUATOR-IMAGER ASSEMBLY PACKAGE

MEMS SPEAKER

VIBRATION SENSOR, ELECTRONIC DEVICE AND VIBRATION DETECTION METHOD

MEMS CANTILEVER-ENCLOSURE SPACING

SENSOR MODULE AND MANUFACTURING METHOD OF THE SAME

MEMS ELEMENT

MEMS ELEMENT

DIFFERENTIAL DIRECTIONAL ACOUSTIC SENSOR DEVICE

AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE

ELECTRODES FOR MICROELECTROMECHANICAL SYSTEM MICROPHONES

EXTREMAL MICROSTRUCTURED SURFACES

MICRO-ELECTROMECHANICAL SYSTEM (MEMS) STRUCTURE AND MEMS MICROPHONE COMPRISING SAME

METHOD FOR PRODUCING FINE STRUCTURES IN THE VOLUME OF A SUBSTRATE COMPOSED OF HARD BRITTLE MATERIAL

MEMS microphone

MICRO-DEVICE STRUCTURES WITH ETCH HOLES

MULTI-DIRECTIONAL ACOUSTIC SENSOR DEVICES

Dual-Layer Micro-ribbon MEMS Light Modulator

TRIPLE-MEMBRANE MEMS DEVICE

MICROELECTROMECHANICAL DEVICE AND MICROELECTROMECHANICAL LOUDSPEAKER

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

MEMS Microphone

MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVING PROTECTION WALL

Inertial Sensor

ACOUSTIC SENSOR DEVICE WITH MULTI-SIDED ANCHOR

ATTACHABLE MICROPHONE AND MANUFACTURING METHOD THEREFOR

LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP

MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

CAPACITIVE MEMS PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS

MEMS Switch, Preparation Method thereof, and Electronic Apparatus

DIRECTIONAL MEMS MICROPHONE

MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

INERTIAL SENSOR AND INTERTIAL MEASUREMENT UNIT

MEMS MICROPHONE

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VIBRATION SENSOR AND FABRICATING METHOD THEREOF

MICROMECHANICAL Z-ACCELERATION SENSOR

MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

CAPACITIVE MICROPHONE SENSOR DESIGN AND FABRICATION METHOD FOR ACHIEVING HIGHER SIGNAL TO NOISE RATIO

Triple-membrane MEMS device

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MEMS OPTICAL MICROPHONE

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE

Method of manufacturing a micro-fluid probe

MEMS MICROPHONE PACKAGE

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME

MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD

PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE

Self-Aligned Acoustic Hole Formation in Piezoelectrical MEMS Microphone

MEMS Device

MEMS STRUCTURE

MEMS MICROPHONE

MEMS MICROPHONE WITH AN ANCHOR

MEMS Microphone

Microfluidic chip and fabrication method

MEMS DEVICE HAVING A MECHANICAL BARRIER STRUCTURE

MEMS chip

MEMS chip

PIEZOELECTRIC SINGLE-CRYSTAL ELEMENT, MEMS DEVICE USING SAME, AND METHOD FOR MANUFACTURING SAME

Microelectromechanical microphone with membrane trench reinforcements and method of fabrication

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM DIFFERENT MATERIAL THICKNESSES

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM DIFFERENT MATERIAL PROPERTIES

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM ONE OR MORE COMPENSATION LAYERS

Semiconductor structure and formation thereof

MEMS device with perimeter barometric relief pierce

CHARGE TRANSFER CIRCUITRY FOR MEMS DEVICES

Capacitive microphone sensor design and fabrication method for achieving higher signal to noise ratio

MEMS PRESSURE SENSOR BUILT USING THE BEOL METAL LAYERS OF A SOLID-STATE SEMICONDUCTOR PROCESS

ELECTROSTATICALLY GATED NANOFLUIDIC MEMBRANES FOR CONTROL OF MOLECULAR TRANSPORT

MEMS MICROPHONE AND METHOD FOR FABRICATING THE SAME

Dual-layer micro-ribbon MEMS light modulator

Method for producing fine structures in the volume of a substrate composed of hard brittle material

Sensor Device with Cover Layer

MEMS CHIP AND ELECTRIC DEVICE

Electrostatic device, electrostatic device intermediate body and production method

Sensing device and method for manufacturing sensing device

MICROFLUIDIC CHIP

Deep reactive ion etching process for fluid ejection heads

Micro-electro mechanical system and manufacturing method thereof

Microfluidic chip and valve, production process and uses

Substrate and microphone unit

Triple-membrane MEMS device

Microfluidic devices with electrodes formed as physically separated sections of microchannel side walls

MICRO-FLUIDIC CHIP, LIQUID LOADING METHOD THEREOF AND MICRO-FLUIDIC SYSTEM

Micro-electromechanical system and method for fabricating MEMS having protection wall

Micro-device structures with etch holes

Substrate assembly and method of bonding substrates

Structure of micro-electro-mechanical-system microphone and method for fabricating the same

Chip package and manufacturing method thereof

Capacitive microphone sensor design and fabrication method for achieving higher signal to noise ratio

Micromechanical component for a sensor device and manufacturing method for a micromechanical component for a sensor device

Method for producing a sequencing unit for sequencing a biochemical material and sequencing unit

MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE WITH BACKSIDE PINHOLE RELEASE AND RE-SEAL

MEMS device and process

Extremal microstructured surfaces

Use of an uncoupling structure for assembling a component having a casing

Structure forming method and device

Process for forming inkjet nozzle devices

Electronic package including cavity formed by removal of sacrificial material from within a cap

Microfluidic chip and microfluidic device

Method for manufacturing an opening structure and opening structure

MEMS microphone and method of manufacturing the same

Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process

MEMS microphone chip and MEMS microphone

Nanopore-forming method, nanopore-forming device and biomolecule measurement device

Method for producing fine structures in the volume of a substrate composed of hard brittle material

Methods for micro and nano fabrication by selective template removal

Process for filling etched holes using first and second polymers

Sensor

METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE

Pressure sensor, in particular a microphone with improved layout

CHIP PACKAGE AND CHIP PACKAGING METHOD

Plurality of filters

MOx-based gas sensor and manufacturing method thereof

Substrate assembly and method of bonding substrates

Microphone and manufacturing method therefor

SENSOR

Method of manufacturing membrane device, membrane device, and nanopore device

Device including micromechanical components in cavities having different pressures and method for its manufacture

Methods for creating fluidic cavities by transmembrane etching through porous membranes and structures made thereby and uses of such structures

Microfluidic device and sample analysis method

Semiconductor package with a through port for sensor applications

Method for forming film and method for manufacturing inkjet print head

Process for filling etched holes using photoimageable thermoplastic polymer

COMBO MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD THEREOF

MEMS grid for manipulating structural parameters of MEMS devices

Electronic package including cavity formed by removal of sacrificial material from within a cap

Method for processing silicon substrate and method for manufacturing liquid ejection head

Method of manufacturing a plurality of through-holes in a layer of first material

Method of manufacturing a plurality of through-holes in a layer of first material

Nanopore structure, ionic device using nanopore structure and method of manufacturing nanomembrane structure

2-dimensional patterning employing tone inverted graphoepitaxy

System and method for a MEMS transducer

Process for filling etched holes

Substrate for diaphragm-type resonant MEMS devices, diaphragm-type resonant MEMS device and method for manufacturing same

Reducing background fluorescence in MEMS materials by low energy ion beam treatment

INTERNAL BARRIER FOR ENCLOSED MEMS DEVICES

Method for manufacturing an opening structure and opening structure

Method for producing a micromechanical component, and micromechanical component

Methods of forming a substrate opening

Method for controlling the size of solid-state nanopores

Fabrication of nanopores using high electric fields

Solid state nanopore devices for nanopore applications to improve the nanopore sensitivity and methods of manufacture

Process for fabricating MEMS device

Nanogap device with capped nanowire structures

Method of making a nozzle

Three-dimensional (3D) porous device and method of making a 3D porous device

Article with controlled wettability

BONDED DOUBLE SUBSTRATE APPROACH TO SOLVE LASER DRILLING PROBLEMS

Forming curved features using a shadow mask

Cavity open process to improve undercut

COMPOSITIONS AND METHODS OF GENERATING REPROGRAMMED ADIPOCYTE CELLS AND METHODS OF USE THEREFORE

Forming nanometer-sized patterns by electron microscopy

Laser processing method

METHODS FOR GRAPHENE-ASSISTED FABRICATION OF MICRO-AND NANOSCALE STRUCTURES AND DEVICES FEATURING THE SAME

Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element

Method for making via interconnection

Micrometer-scale grid structure based on single crystal silicon and method of manufacturing the same

METHOD FOR FUNCTIONALISING THE WALL OF A PORE

Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same

Method of forming sub-lithographic features using directed self-assembly of polymers

METHODS OF MAKING MICROFLUIDIC DEVICES AND DEVICES RESULTING

Method for manufacturing an intergrated pressure sensor

Vibration sensor and method for manufacturing the vibration sensor

System and method for filling vias

Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same

Method of manufacturing semiconductor device

System and method for forming through wafer vias using reverse pulse plating

Micromechanical sensor

Method of making a MEMS device containing a cavity with isotropic etch followed by anisotropic etch

Integrated microfluidic vias, overpasses, underpasses, septums, microfuses, nested bioarrays and methods for fabricating the same

Creating novel structures using deep trenching of oriented silicon substrates

Nanopore structure and method using an insulating substrate

Multiple layer etch stop and etching method

Method for making fluid emitter orifice

Method of producing semiconductor device

Micro-machined nozzles

Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes

Conductive bond for through-wafer interconnect

Semiconductor device and method of producing the same

Apparatus and method for making a tensile diaphragm with an insert

Apparatus and method for making a tensile diaphragm with a compressive region

Drop resistant MEMS actuator-imager assembly package

Back chamber volume enlargement microphone package

MEMS microphone