83872 ⎘
Basic microelectromechanical structures Static structures
Sub-classes:Processing Methods for Wafer-Level Encapsulated MEMS Devices with Stable Cavity Pressure Over Temperature
#2SENSOR
#3SUBSTRATES COMPRISING NANO-PATTERNING SURFACES AND METHODS OF PREPARING THEREOF
#4MULTI-LEVEL MEMS PROCESS
#5Capacitive Linearization Method Applied to MEMS Microphones Systems
#6SENSOR
#7Substrates comprising nano-patterning surfaces and methods of preparing thereof
#8Substrates comprising nano-patterning surfaces and methods of preparing thereof
#9Substrates comprising nano-patterning surfaces and methods of preparing thereof
#10Micromechanical component and method for producing a micromechanical component having a thin-layer cap
#11Micromechanical component and method for producing a micromechanical component having a thin-layer cap