83883 ⎘
Basic microelectromechanical structures; Static structures characterized by their profile sloped profile
MEMS MICROPHONE
#2METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#3Electromechanical Microsystem for Moving a Mechanical Part in Two Opposite Directions
#4Microelectromechanical System for Moving a Mechanical Part in Two Opposite Directions
#5Membrane support for dual backplate transducers
#6Dual membrane transducer
#7PIEZOELECTRIC ACTUATOR STACK WITH TAPERED SIDEWALL
#8Semiconductor structure and method for forming the same
#9Production method for a micromechanical device having inclined optical windows, and micromechanical device having inclined optical windows
#10Membrane support for dual backplate transducers
#11Bionic SERS substrate with metal-based compound eye bowl structure and its construction method and application
#12Membrane support for dual backplate transducers
#13Interposer substrate, MEMS device and corresponding manufacturing method
#14Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure
#15Protective wafer including inclined optical windows and device
#16Method for forming a cavity and a component having a cavity
#17Method for producing optical components using functional elements
#18Manufacturing method for semiconductor structure
#19Semiconductor structure and manufacturing method for the same
#20Method of fabricating a MEMS and/or NEMS structure comprising at least two elements suspended from a support at different distances from said support
#21MANUFACTURING METHOD FOR A MICROMECHANICAL WINDOW STRUCTURE AND CORRESPONDING MICROMECHANICAL WINDOW STRUCTURE
#22Method for manufacturing a protective wafer including inclined optical windows and device
#23Method of forming micro-pipes on a substrate and a structure formed thereof
#24Microelectromechanical displacement structure and method for controlling displacement
#25Microelectromechanical displacement structure and method for controlling displacement
#26Method for forming a cavity and a component having a cavity
#27Silicon-based component with at least one chamfer and its fabrication method
#28Micromechanical component with a reduced contact surface and its fabrication method
#29Mechanism for MEMS bump side wall angle improvement
#30Process for fabricating MEMS device
#31Method for manufacturing micro-structure and optically patternable sacrificial film-forming composition
#32Sloped structure, method for manufacturing sloped structure, and spectrum sensor
#33Method for producing an optical window device for a MEMS device
#34Fluidic structure with nanopore array
#35Mechanism for MEMS bump side wall angle improvement
#36Sloped structure, method for manufacturing sloped structure, and spectrum sensor
#37Method for manufacturing micro-structure and optically patternable sacrificial film-forming composition
#38PROTUBERANT STRUCTURE AND METHOD FOR MAKING THE SAME
#39Micromechanical sound transducer having a membrane support with tapered surface
#40COMPOSITIONS AND METHODS OF GENERATING REPROGRAMMED ADIPOCYTE CELLS AND METHODS OF USE THEREFORE
#41METHOD FOR MANUFACTURING STRUCTURE
#42Cover device for a micro-optomechanical component, and manufacturing method for such a cover device
#43Method for producing oblique surfaces in a substrate and wafer having an oblique surface
#44Laser processing method
#45Sealed cavity and method for producing such a sealed cavity
#46Structure and method to form nanopore
#47Method for producing micromechanical patterns having a relief-like sidewall outline shape or an adjustable angle of inclination
#48Method of manufacturing semiconductor device
#49Method of forming an undercut microstructure
#50Polymers, methods of use thereof, and methods of decomposition thereof
#51Microchip and process for producing microchip
#52Microchip and Method of Manufacturing Same
#53Cover for microsystems and method for producing a cover
#54Metal-ceramic multilayer structure
#55Method for forming non-aligned microcavities of different depths
#56Mitigation of high stress areas in vertically offset structures
#57Polymers, Methods Of Use Thereof, And Methods Of Decomposition Thereof
#58Production method for a micromechanical component, and a micromechanical component
#59Micro-posts having improved uniformity and a method of manufacture thereof
#60MICROMECHANICAL SENSOR- OR ACTUATOR COMPONENT AND METHOD FOR THE PRODUCTION OF MICROMECHANICAL SENSOR- OR ACTUATOR COMPONENTS
#61Polymers, Methods Of Use Thereof, And Methods Of Decomposition Thereof
#62MICROSTRUCTURE AND MANUFACTURING METHOD THEREOF
#63Micro electro mechanical systems device
#64Hermetic packaging and method of manufacture and use therefore
#65Microfabrication
#66Orientation-dependent etching of deposited AlN for structural use and sacrificial layers in MEMS
#67Method for generating a micromechanical structure
#68HERMETIC SEALING OF MICRO DEVICES
#69Cap Wafer for Wafer Bonded Packaging and Method for Manufacturing the Same
#70Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same
#71Method for manufacturing a mass-spring system
#72Microstructure and manufacturing method thereof
#73Polymers, methods of use thereof, and methods of decomposition thereof
#74Micro-mirror device package and method for fabricating the same
#75Micromechanical component and method for production thereof
#76Silicon substrate comprising positive etching profiles with a defined slope angle, and production method
#77Optical scanner package and method of manufacturing the same
#78Method for making fluid emitter orifice
#79Method for structuring of silicon substrates for microsystem technological device elements and associated silicon substrate
#80Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same
#81Systems and methods for three-dimensional lithography and nano-indentation
#82System and method of fabricating micro cavities