Patents-Review.com
ClassID:

83913 ⎘

B81B2207/115 - CPC Classification

Classification description:

Microstructural systems or auxiliary parts thereof; Structural features, others than packages, for protecting a device against environmental influences Protective layers applied directly to the device before packaging

Recent Application in this class:
#1
20250313454
2025-10-09

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

 #2
20250304430
2025-10-02

ASYMMETRIC FILLER AS TEMPERATURE TRANSIENT FIX

 #3
20250059025
2025-02-20

METHOD FOR DETECTING CONTAMINATION OF A MEMS SENSOR

 #4
20240327205
2024-10-03

PRESSURE SENSING MODULE AND MANUFACTURING METHOD THEREOF

 #5
20240034620
2024-02-01

MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE

 #6
20230404777
2023-12-21

A MICROFLUIDIC SENSOR

 #7
20230271822
2023-08-31

MICRO-ELECTROMECHANICAL SYSTEM (MEMS) INCLUDING TANTALUM AS A STRUCTURAL MATERIAL

 #8
20230126914
2023-04-27

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

 #9
20230112443
2023-04-13

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM DIFFERENT MATERIAL THICKNESSES

 #10
20230107094
2023-04-06

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE FROM A SINGLE SEMICONDUCTOR WAFER AND RELATED MEMS DEVICE

 #11
20230099440
2023-03-30

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM DIFFERENT MATERIAL PROPERTIES

 #12
20230094674
2023-03-30

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM ONE OR MORE COMPENSATION LAYERS

 #13
20230016038
2023-01-19

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE

 #14
20210246012
2021-08-12

Micromechanical component for a sensor device and manufacturing method for a micromechanical component for a sensor device

 #15
20210238030
2021-08-05

Support structure for MEMS device with particle filter

 #16
20210206630
2021-07-08

Method for producing monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS

 #17
20210047176
2021-02-18

Support structure for MEMS device with particle filter

 #18
20200385263
2020-12-10

PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPHONE PACKAGE AND PACKAGING METHOD THEREOF

 #19
20200239301
2020-07-30

ELEVATED MEMS DEVICE IN A MICROPHONE WITH INGRESS PROTECTION

 #20
20190202685
2019-07-04

CHIP PACKAGE AND CHIP PACKAGING METHOD

 #21
20190177160
2019-06-13

Monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS and method for producing the same

 #22
20190084828
2019-03-21

Elevated MEMS device in a microphone with ingress protection

 #23
20180327257
2018-11-15

Membrane for a capacitive MEMS pressure sensor and method of forming a capacitive MEMS pressure sensor

 #24
20180201498
2018-07-19

Micro-electro-mechanical system structure and method for forming the same

 #25
20180111824
2018-04-26

Semiconductor structure and manufacturing method thereof

 #26
20180044177
2018-02-15

Wafer-level package with enhanced performance

 #27
20170355599
2017-12-14

Method and system for CMOS based MEMS bump stop contact damage prevention

 #28
20170260041
2017-09-14

Membrane of amorphous carbon and MEMS including such a membrane

 #29
20170247250
2017-08-31

Semiconductor pressure sensor for harsh media application

 #30
20170210615
2017-07-27

Micro-electro-mechanical system structure and method for forming the same

 #31
20170066645
2017-03-09

Refractory seed metal for electroplated MEMS structures

 #32
20170022051
2017-01-26

Stress isolation features for stacked dies

 #33
20160304335
2016-10-20

Anodic bonding of dielectric substrates

 #34
20160297676
2016-10-13

Method for applying a structured coating to a component

 #35
20160185592
2016-06-30

Method of selectively removing an anti-stiction layer on a eutectic bonding area

 #36
20160176703
2016-06-23

Multi-level getter structure and encapsulation structure comprising such a multi-level getter structure

 #37
20160130135
2016-05-12

Physical quantity sensor, method for manufacturing physical quantity sensor, electronic device, and moving body

 #38
20150326979
2015-11-12

Top-port MEMS microphone and method of manufacturing the same

 #39
20150291415
2015-10-15

Hermetic encapsulation for microelectromechanical systems (MEMS) devices

 #40
20150291413
2015-10-15

Method and system for CMOS based MEMS bump stop contact damage prevention

 #41
20150235779
2015-08-20

MEMS device with constant capacitance

 #42
20150232325
2015-08-20

MICRO ELECTRO MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD THEREOF

 #43
20150001651
2015-01-01

MEMS device having a suspended diaphragm and manufacturing process thereof

 #44
20140374859
2014-12-25

Sensor device

 #45
20140339656
2014-11-20

MEMS pressure transducer assembly

 #46
20140029078
2014-01-30

DEVICES AND METHODS FOR PROTECTING ELECTROMECHANICAL DEVICE ARRAYS

 #47
20130320510
2013-12-05

Durable, heat-resistant multi-layer coatings and coated articles

 #48
20130214365
2013-08-22

MEMS pressure transducer assembly and method of packaging same

 #49
20130113055
2013-05-09

Sensor device manufacturing method and sensor device

 #50
20130001710
2013-01-03

PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT

 #51
20120205808
2012-08-16

MEMS and protection structure thereof

 #52
20110193184
2011-08-11

Micromechanical system and method for manufacturing a micromechanical system

 #53
20110031624
2011-02-10

MEMS and a protection structure thereof

 #54
20110012212
2011-01-20

MEMS sensor and production method of MEMS sensor

 #55
20100221497
2010-09-02

Device with protective layer

 #56
20090047479
2009-02-19

MEMS sensor and production method of MEMS sensor

 #57
20080299288
2008-12-04

Durable, heat-resistant multi-layer coatings and coated articles

 #58
20080248253
2008-10-09

Procedural Functional Element of a Stack of Films

 #59
20070284699
2007-12-13

Microfabricated devices and method for fabricating microfabricated devices

 #60
20060289415
2006-12-28

Micromechanical device having integrated heating

 #61
20050168224
2005-08-04

Receiver electronics proximate antenna

 #62
20050150691
2005-07-14

High temperature environment tool system and method

 #63
20050104176
2005-05-19

High temperature electronic devices

 #64
14737896
2016-03-22

MEMS packaging techniques