Patents-Review.com
ClassID:

83914 ⎘

B81B2207/99 - CPC Classification

Classification description:

Microstructural systems or auxiliary parts thereof Microstructural systems or auxiliary parts thereof not provided for in  - 

Recent Application in this class:
#1
20260139166
2026-05-21

EXPANSION MEDIATED ADHESIVE DEVICE

 #2
20250361139
2025-11-27

IMPACT-RESISTANT MICROMECHANICAL ARMS

 #3
20250019230
2025-01-16

MONOCRYSTALLINE NICKEL-TITANIUM FILMS ON SINGLE CRYSTAL SILICON SUBSTRATES USING SEED LAYERS

 #4
20240425364
2024-12-26

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

 #5
20240262678
2024-08-08

MEMS DEVICE, METHOD FOR MANUFACTURING MEMS DEVICE AND ELECTRONIC DEVICE

 #6
20240243035
2024-07-18

Anchor and cavity configuration for MEMS-based cooling systems

 #7
20230298862
2023-09-21

INTEGRATED SHOWERHEAD

 #8
20230052052
2023-02-16

Method of forming monocrystalline nickel-titanium films on single crystal silicon substrates using seed layers

 #9
20230030322
2023-02-02

Anchor and cavity configuration for MEMS-based cooling systems

 #10
20220411259
2022-12-29

IMPACT-RESISTANT MICROMECHANICAL ARMS

 #11
20220361974
2022-11-17

Pop-Up Laminate Structures with Integrated Electronics

 #12
20220212920
2022-07-07

LIQUID-RESISTANT AIR INLET PASSIVE DEVICE AND METHODS OF MAKING SAME

 #13
20210340412
2021-11-04

EXPANSION MEDIATED ADHESIVE DEVICE

 #14
20210114866
2021-04-22

MEMS device with particle filter and method of manufacture

 #15
20200354214
2020-11-12

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

 #16
20200140260
2020-05-07

Microfluidic mixing

 #17
20200131029
2020-04-30

Waterproof microphone and associated packing techniques

 #18
20200071159
2020-03-05

Directional microphone and associated packing techniques

 #19
20200015920
2020-01-16

Pop-up laminate structures with integrated electronics

 #20
20200006470
2020-01-02

Electronic device including a capacitor

 #21
20190169019
2019-06-06

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

 #22
20190068135
2019-02-28

Tunable power amplifier with wide frequency range

 #23
20190055119
2019-02-21

Directional microphone and associated packing techniques

 #24
20180315748
2018-11-01

ESD protection of MEMS for RF applications

 #25
20180141306
2018-05-24

DISPLAY PANEL AND DEVICE USING THE SAME

 #26
20180127266
2018-05-10

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

 #27
20170275157
2017-09-28

System and method for an ovenized silicon platform using Si/SiOhybrid supports

 #28
20170197823
2017-07-13

Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

 #29
20170142524
2017-05-18

Directional microphone and associated packing techniques

 #30
20170137282
2017-05-18

Waterproof microphone and associated packing techniques

 #31
20170044010
2017-02-16

SENSOR ELEMENT, METHOD FOR MANUFACTURING SENSOR ELEMENT, DETECTION DEVICE, AND METHOD FOR MANUFACTURING DETECTION DEVICE

 #32
20170005628
2017-01-05

Tunable power amplifier with wide frequency range

 #33
20160340175
2016-11-24

Method of lower profile MEMS package with stress isolations

 #34
20160236932
2016-08-18

MEMS pressure sensor and method for forming the same

 #35
20160184041
2016-06-30

Pop-up laminate structures with integrated electronics

 #36
20160043698
2016-02-11

Tunable power amplifier with wide frequency range

 #37
20130032570
2013-02-07

Method of manufacturing a switch system

 #38
20110241136
2011-10-06

MEMS device

 #39
20110156245
2011-06-30

Method and apparatus for cooling an integrated circuit