83797 ⎘
Microstructural systems; Auxiliary parts of microstructural devices or systems; Packages or encapsulation for reducing stress inside of the package structure between the package lid and the substrate
MEMS ACTUATORS HAVING A VISCOUS LIQUID OR GEL LOCATED BETWEEN A MOVABLE MIRROR AND A SUBSTRATE
#2Sensor devices with gas-permeable cover and associated production methods
#3Method and structure for CMOS-MEMS thin film encapsulation
#4Method of manufacturing a sensor device and moulding support structure
#5METHOD FOR MANUFACTURING A DETECTION DEVICE COMPRISING A PERIPHERAL WALL MADE OF A MINERAL MATERIAL
#6Micro-acoustic wafer-level package and method of manufacture
#7Sensor devices with gas-permeable cover and associated production methods
#8Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process
#9Semiconductor device packages and methods of manufacturing the same
#10Single line axis solder dispense process for a MEMS device
#11Semiconductor package with flexible interconnect
#12Semiconductor package structure and method for manufacturing the same
#13Method and structure for CMOS-MEMS thin film encapsulation
#14MEMs device and electronic device
#15Method of manufacturing a sensor device and moulding support structure
#16Encapsulation of sensing device
#173D-printed protective shell structures with support columns for stress sensitive circuits
#18Process for fabricating a device for detecting electromagnetic radiation having an improved encapsulation structure
#19FORCE SENSOR AND MANUFACTURE METHOD THEREOF
#20Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process
#21Force sensor and manufacture method thereof
#22Deposition of protective material at wafer level in front end for early stage particle and moisture protection
#23MEMS pressure sensor with multiple sensitivity and small dimensions
#24Sensor
#25Method for manufacturing a micromechanical sensor
#26Deposition of protective material at wafer level in front end for early stage particle and moisture protection
#27Wafer level packaging for MEMS device
#28Gas sensor packages
#29Method for closing off a micromechanical device by laser melting, and micromechanical device having a laser melt closure
#30Micromechanical component
#31Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process
#32Semiconductor package with a through port for sensor applications
#33Method and structure for CMOS-MEMS thin film encapsulation
#34Oil pressure sensor attaching structure
#35Sensor fixing structure including valve body and pressure sensor
#36Low stress integrated device packages
#37Method and structure of MEMS PLCSP fabrication
#38PACKAGING FOR MEMS TRANSDUCERS
#39SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE
#40Wafer level packaging of MEMS
#41Pressure sensor
#42Laser beam deflection for targeted energy deposition
#43LASER RESEAL INCLUDING STRESS COMPENSATION LAYER
#44Structures for reducing and avoiding stresses on the seal bottom side during laser reseal
#45Microelectromechanical system and fabricating process having decoupling structure that includes attaching element for fastening to carrier
#46Semiconductor device package including a wall and a grounding ring exposed from the wall
#47Manufacturing method of electronic device, electronic device, electronic apparatus, and moving body
#48CHIP SCALE PACKAGE
#49Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications
#50Hermetically sealed package having stress reducing layer
#51Method for hermetically sealing with reduced stress
#52MICROELECTROMECHANICAL SYSTEMS DEVICE
#53Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof
#54Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same
#55Wafer level packaging of MEMS
#56MEMS device structure and methods of forming same
#57MEMS device
#58MEMS device with a bonding layer embedded in the cap
#59Physical quantity measurement sensor
#60Fabricating a microelectronics lid using sol-gel processing
#61Electronic component element and composite module including the same
#62Electrical component and method of manufacturing the same
#63Anodically bonded strain isolator
#64MEMS microphone device and method for making same
#65MEMS device structure and methods of forming same
#66Sealed packaging for microelectromechanical systems
#67Foaming process for preparing wafer-level glass micro-cavities
#68MEMS microphone device and method for making same
#69Semiconductor device and method of manufacture thereof
#70Chip package and fabrication method thereof
#71LOW DISTORTION PACKAGE FOR A MEMS DEVICE INCLUDING MEMORY
#72Electronic component for surface mounting
#73SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
#74FRAME AND METHOD OF MANUFACTURING ASSEMBLY
#75Sensor device and production method therefor
#76Wafer level package structure and production method therefor
#77Micromechanical component and method for producing a micromechanical component
#78Semiconductor module
#79METHOD FOR FABRICATING FLOW CHANNEL CAPABLE OF BALANCING AIR PRESSURE
#80Methods for packaging and sealing an integrated circuit die
#81Backages with buried electrical feedthroughs
#82Integrated circuit having a semiconductor sensor device with embedded column-like spacers
#83MEMS device package and method of manufacturing the same
#84Optical element housing package
#85Package for sealing an integrated circuit die
#86Method for packaging semiconductor chips and corresponding semiconductor chip system
#87Acceleration sensor
#88MEMS actuators having a physical gap filled with fluid
#89Thin MEMS die
#90Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device