Embedded Digital Sensor Structure

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF

METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMBLIES

MEMS switch and manufacture method

ELECTRONIC COMPONENT WITH REDUCED STRESS

SEALED CAVITY STRUCTURE AND METHOD FOR MANUFACTURING SEALED CAVITY STRUCTURE

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

MEMS device with a diaphragm having a net compressive stress

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Device with terminal-containing sensor

Micromechanical component

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

Sensor with symmetrically embedded sensor elements

Stress decoupled piezoresistive relative pressure sensor and method for manufacturing the same

Method and structure of MEMS PLCSP fabrication

Deformable apparatus and method

Pressure sensor

Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process

Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications

VHF etch barrier for semiconductor integrated microsystem

Encapsulated component comprising a MEMS component and method for the production thereof

Method of protecting microelectro mechanical system device

Stress buffer layer for integrated microelectromechanical systems (MEMS)

Semiconductor arrangement with stress release and thermal insulation

Semiconductor arrangement with stress release configuration

Pressure sensor with deformable membrane and method of manufacture

Reduced stress pressure sensor

Integrated CMOS back cavity acoustic transducer and the method of producing the same

Electrical component and method of manufacturing the same

Surface mount actuator

Cantilever packages for sensor MEMS (micro-electro-mechanical system)

Microelectro mechanical system encapsulation scheme

Dynamic quantity sensor

Sensor device manufacturing method and sensor device

Surface mount actuator

MEMS device assembly and method of packaging same

Mechanical isolation for MEMS electrical contacts

Sensor module

Leadless package housing having a symmetrical construction with deformation compensation

Isolation channel improving measurement accuracy of MEMS devices

Integrated semiconductor device

Housing with a Cavity for a Mechanically-Sensitive Electronic Component and Method for Production

Wafer level sensing package and manufacturing process thereof

Wafer level sensing package and manufacturing process thereof

Embedded digital sensor structure

Method of improving MEMS microphone mechanical stability