83799 ⎘
Microstructural systems; Auxiliary parts of microstructural devices or systems; Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
ENVIRONMENTAL BARRIER STRUCTURE WITH INTEGRATED FLUID CHANNEL
#2PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#3ASSEMBLY METHOD FOR INERTIAL SENSORS IN LIMITED SPACE APPLICATIONS
#4MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT
#5SEMICONDUCTOR DEVICE WITH A MICROMECHANICAL COMPONENT
#6BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#7DEVICE INCLUDING MEMS SENSOR AND METHOD OF MANUFACTURING THE SAME
#8DROP RESISTANT MEMS ACTUATOR-IMAGER ASSEMBLY PACKAGE
#9INTEGRATED ULTRASONIC TRANSDUCERS
#10MICROELECTROMECHANICAL SYSTEM
#11Parasitic Insensitive Sampling in Sensors
#12ROTATION RATE SENSOR WITH A MICROMECHANICAL STRUCTURE, AND METHOD FOR OPERATING A ROTATION RATE SENSOR
#13Suspension for Resonators and MEMS Devices
#14SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
#15ELECTROCHEMICAL REDUCTION OF CARBON DIOXIDE
#16Parasitic insensitive sampling in sensors
#17SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#18SEALED ACOUSTIC COUPLER FOR MICRO-ELECTROMECHANICAL SYSTEMS MICROPHONES
#19MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF USER INTERFACE ELEMENT
#20MICROMECHANICAL STRUCTURE WITH BONDED COVER
#21Ingress protection mechanism
#22Integrated ultrasonic transducers
#23WIRE-BOND DAMPER FOR SHOCK ABSORPTION
#24METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCE
#25PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#26PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#27PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#28PACKAGE, MICROPHONE DEVICE, AND ELECTRONIC APPARATUS
#29Fabrication Method of MEMS Transducer Element
#30PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MANUFACTURING PRESSURE SENSOR STRUCTURE
#31PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING
#32Waterproof MEMS Pressure Sensor Package With A Metal Lid And An Embedded ePTFE Filter And Process Of Making
#33COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER FOR AN INFRARED DETECTOR
#34Semiconductor structure and formation thereof
#35PROTECTIVE BONDLINE CONTROL STRUCTURE
#36Sensor Device with Cover Layer
#37Process for manufacturing a combined microelectromechanical device and corresponding combined microelectromechanical device
#38HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME
#39Stress isolated device package and method of manufacture
#40BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#41VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION
#42BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE
#43Wire-bond damper for shock absorption
#44Microelectronic isolation system
#45Hermetically sealed transparent cavity and package for same
#46Detachable MEMS package top cover
#47Hermetically sealed, toughened glass package and method for producing same
#48MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
#49Parasitic insensitive sampling in sensors
#50Semiconductor structures
#51MOBILE DEVICE HAVING A TUBULAR MICROPHONE INTEGRATED INTO A COVER ASSEMBLY
#52MEMS package with shock and vibration protection
#53MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT
#54Sound producing package structure including sound producing membranes actuated toward cavity center
#55Semiconductor package with built-in vibration isolation, thermal stability, and connector decoupling
#56Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method
#57MEMS nanotube based thermal neutron detector
#58SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#59Microelectromechanical structure with bonded cover
#60Microphone
#61Packaged environmental sensor
#62Integrated ultrasonic transducers
#63MEMS device, liquid ejecting head, liquid ejecting apparatus, manufacturing method of MEMS device, manufacturing method of liquid ejecting head, and manufacturing method of liquid ejecting apparatus
#64Waterproof MEMS button device, input device comprising the MEMS button device and electronic apparatus
#65Semiconductor component and method for producing same
#66Thin-film filter, thin-film filter substrate, method of manufacturing the thin-film filter, method of manufacturing the thin-film filter substrate, MEMS microphone and method of manufacturing the MEMS microphone
#67SENSOR UNIT, ELECTRONIC APPARATUS, AND VEHICLE
#68Systems and methods for bias suppression in a non-degenerate MEMS sensor
#69MEMS device and fabrication method thereof
#70Semiconductor structures
#71MEMs device and electronic device
#72Thin-film filter, thin-film filter substrate, method of manufacturing the thin-film filter, method of manufacturing the thin-film filter substrate, MEMS microphone and method of manufacturing the MEMS microphone
#73Integrated packaging devices and methods with backside interconnections
#74Parasitic insensitive sampling in sensors
#75Pressure sensors on flexible substrates for stress decoupling
#76Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure
#77Water proofing and water detection schemes for MEMS-based environmental sensing devices
#78Apparatus having a bondline structure and a diffusion barrier with a deformable aperture
#79MEMS microphone and a manufacturing method thereof
#80MEMS devices and processes
#813D-printed protective shell structures with support columns for stress sensitive circuits
#82Wafer-level fan-out package with enhanced performance
#83MEMS microphone system with low pressure gap and back volume
#84MEMS microphone
#85Encapsulated microelectromechanical structure
#86Sensor packages
#87Over-under sensor packaging with sensor spaced apart from control chip
#88Semiconductor module
#89LIQUID PROOF PRESSURE SENSOR
#90Bottom package exposed die MEMS pressure sensor integrated circuit package design
#91Overmolded lead frame assembly for pressure sensing applications
#92Shock caging features for MEMS actuator structures
#93Integrated ultrasonic transducers
#94MEMS assembly
#95Vibration isolator platform with electronic acceleration compensation
#96Top port multi-part surface mount silicon condenser microphone
#97SPACE-EFFICIENT PLANAR INTERPOSER FOR ENVIRONMENT-RESISTANT PACKAGING
#983D-printed protective shell structures for stress sensitive circuits
#99PROTECTIVE BONDLINE CONTROL STRUCTURE
#100Sensor assembly and arrangement and method for manufacturing a sensor assembly
#101Electronic apparatus including holding structure for micro electro mechanical system (MEMS) microphone that reduces sound noise due to photoelectric effect
#102Biocompatible monolithically integrated sensor, in particular for an active implantable medical device
#103Semiconductor component and method for producing same
#104Low cost overmolded leadframe force sensor with multiple mounting positions
#105Water proofing and water detection schemes for MEMS-based environmental sensing devices
#106Encapsulated microelectromechanical structure
#107Electromagnetic activated mirror array with fluid damping and micro-fabricated recess for magnet assembly
#108Over-under sensor packaging with sensor spaced apart from control chip
#109PACKAGING STRUCTURE AND PACKAGING METHOD OF MEMS CHIP AND ASIC CHIP
#110MEMS microphone system with low pressure gap and back volume
#111Embedded vibration management system having an array of vibration absorbing structures
#112Transducer packaging
#113Method for forming filter net on MEMS sensor and MEMS sensor
#114Method for packaging at least one semiconductor component and semiconductor device
#115Apparatus with a high heat capacity and method for producing the same
#116SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES
#117Vibrator device, oscillator, electronic device, and vehicle
#118Environmental sensor
#119Top port multi-part surface mount MEMS microphone
#120MULTI-LAYER GLASS STRUCTURES
#121MANUFACTURING METHOD FOR A MICROMECHANICAL WINDOW STRUCTURE AND CORRESPONDING MICROMECHANICAL WINDOW STRUCTURE
#122Semiconductor package with a through port for sensor applications
#123Integrated packaging devices and methods with backside interconnections
#124Encapsulations for mems sense elements and wire bonds
#125MEMS sensor package systems and methods
#126Systems and methods for bias suppression in a non-degenerate MEMS sensor
#127Circuit board module comprising a continuous cavity, associated sonic transducer assembly, and production method
#128Electrolytic seal
#129Electrolytic seal
#130GLASS-SENSOR STRUCTURES
#131MANUFACTURING METHOD FOR A MICROMECHANICAL DEVICE INCLUDING AN INCLINED OPTICAL WINDOW AND CORRESPONDING MICROMECHANICAL DEVICE
#132Wafer processing equipment having exposable sensing layers
#133Method for producing a semiconductor module
#134Low cost overmolded leadframe force sensor with multiple mounting positions
#135Bottom package exposed die MEMS pressure sensor integrated circuit package design
#136Protective coating on trench features of a wafer and method of fabrication thereof
#137Flexible disposable MEMS pressure sensor
#138Integral metallic joint based on electrodeposition
#139INERTIAL FORCE SENSOR
#140Shock caging features for MEMS actuator structures
#141Thermocompression bonding with raised feature
#142Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices
#143Sensor device
#144Electronic component with a component housing
#145Atomic Layer Deposition Layer for a Microelectromechanical system (MEMS) Device
#146Covering for a component and method for producing a covering for a component
#147Top port multi-part surface mount silicon condenser microphone
#148Semiconductor pressure sensor for harsh media application
#149Waterproof member, manufacturing method of waterproof member, pressure sensor, and electronic module
#150Microphone Arrangement which has an Enlarged Opening and is Decoupled from the Cover
#151Protection structure for semiconductor device package
#152Semiconductor device
#153Wafer level MEMS package including dual seal ring
#154Multi-faced component-based electromechanical device
#155SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE
#156MEMS device
#157Pressure sensor and packaging method thereof
#158Physical Quantity Sensor
#159Housing with a damping element for a micromechanical sensor element
#160Wafer level MEMS package including dual seal ring
#161METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE AND A COMPONENT HAVING THIS MICROMECHANICAL STUCTURE
#162Method and apparatus for using universal cavity wafer in wafer level packaging
#163Semiconductor device and method for manufacturing the same
#164MEMS packages and methods of manufacture thereof
#165Pressure sensor package with stress isolation features
#166Chip package and a method of producing the same
#167Manufacturing method thereof
#168Method for applying a structured coating to a component
#169Semiconductor device including a cavity lid
#170Thin Film Encapsulation of Electrodes
#171Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof
#172MEMS cavity substrate
#173Integrated MEMS device
#174Top port multi-part surface mount silicon condenser microphone
#175Encapsulated microelectromechanical structure
#176Method of lower profile MEMS package with stress isolations
#177Open cavity plastic package
#178STRESS ISOLATED MEMS DEVICE WITH ASIC AS CAP
#179Environment-resistant module, micropackage and methods of manufacturing same
#180MEMS capping method
#181Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof
#182Semiconductor structure and fabrication method
#183MEMS device and fabrication method thereof
#184Semiconductor package with air pressure sensor
#185Sensor protective coating
#186SEMICONDUCTOR CAVITY PACKAGE USING PHOTOSENSITIVE RESIN
#187Packaged semiconductor sensor device with lid
#188MEMS device structure and methods of forming same
#189Methods and apparatus to reduce semiconductor wafer warpage in the presence of deep cavities
#190MEMS pressure sensor and method of manufacturing the same
#191Encapsulated component comprising a MEMS component and method for the production thereof
#192Top port MEMS cavity package and method of manufacture thereof
#193Micro-electrical-mechanical system (MEMS) microphone
#194MEMS capping method
#195ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME
#196MEMS package structure and manufacturing method thereof
#197Method for manufacturing an integrated MEMS device
#198CAP MODULE FOR MICRO ELECTRO MECHANICAL SYSTEM AND MICRO ELECTRO MECHANICAL SYSTEM SENSOR HAVING THE SAME
#199Semiconductor device package and method of the same
#200MEMS structures and methods for forming the same
#201MICRO ELECTRO MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD THEREOF
#202SUPPORT FOR MEMS COVER
#203Shielding MEMS structures during wafer dicing
#204MEMS package structure
#205Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereof
#206MEMS device with release aperture
#207MEMS encapsulation by multilayer film lamination
#208MEMS DEVICE PACKAGE
#209Sensor protective coating
#210Acoustic Assembly and Method of Manufacturing The Same
#211MEMS microphone with membrane antennas
#212MEMS package structure and manufacturing method thereof
#213Chip with a Micro-Electromechanical Structure and Covering Element, and a Method for the Production of Same
#214Multi-port device package
#215Gyroscope structure and gyroscope
#216MOVABLE DEVICE HAVING DROP RESISTIVE PROTECTION
#217Wafer encapsulated microelectromechanical structure
#218Encapsulation structure including a mechanically reinforced cap and with a getter effect
#219MEMS device having a suspended diaphragm and manufacturing process thereof
#220Sensor device
#221PRESSURE SENSOR AND METHOD OF PACKAGING SAME
#222Inertial force sensor
#223MEMS pressure transducer assembly
#224MEMS package structure
#225Method of etching a wafer
#226Methods and devices for packaging integrated circuits
#227Top port MEMS cavity package and method of manufacture thereof
#228Top port MEMS cavity package and method of manufacture thereof
#229Monolithic Package for Housing Microelectromechanical Systems
#230Component and method for producing same
#231PRESSURE SENSING DEVICE AND MANUFACTURING METHOD OF THE SAME
#232Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap
#233Electronic device and its manufacturing method
#234MEMS sensor package systems and methods
#235Packaged device exposed to environmental air and liquids and manufacturing method thereof
#236Physical quantity sensor and method of making the same
#237DEVICES AND METHODS FOR PROTECTING ELECTROMECHANICAL DEVICE ARRAYS
#238Component and method for producing a component
#239Inertial force sensor
#240MEMS DEVICE ENCAPSULATION WITH CORNER OR EDGE SEALS
#241Semiconductor package with air pressure sensor
#242MEMS device structure and methods of forming same
#243Venting array and manufacturing method
#244Physical quantity detector
#245Waterproof structure and electronic equipment including the same
#246SYSTEM AND METHOD FOR MINIMIZING DEFLECTION OF A MEMBRANCE OF AN ABSOLUTE PRESSURE SENSOR
#247MEMS pressure transducer assembly and method of packaging same
#248Module and production method
#249MEMS structures and methods for forming the same
#250METHODS OF CREATING SPACERS BY SELF-ASSEMBLY
#251METAL THIN SHIELD ON ELECTRICAL DEVICE
#252PLANARIZED SPACER FOR COVER PLATE OVER ELECTROMECHANICAL SYSTEMS DEVICE ARRAY
#253Integrated pressure sensor seal
#254MEMS package structure
#255MEMS device with release aperture
#256Surface mount silicon condenser microphone package
#257Environment-resistant module, micropackage and methods of manufacturing same
#258VIBRATION ISOLATION TARGET MOUNTING STRUCTURE AND METHOD
#259Pressure sensor package systems and methods
#260Method of etching and singulating a cap wafer
#261Surface mount silicon condenser microphone package
#262Encapsulated active transducer and method of fabricating the same
#263Method for encapsulating a microcomponent using a mechanically reinforced cap
#264Physical quantity sensor including bonding wire with vibration isolation performance characteristics
#265Physical quantity sensor
#266MEMS package structure and method for fabricating the same
#267Inertia force sensor
#268Method of fabricating an inertial sensor
#269Method of producing an isolator for a microelectromechanical system (MEMS) die
#270Sensor component
#271PREMOLD HOUSING HAVING INTEGRATED VIBRATION ISOLATION
#272Method for producing a MEMS package
#273Sensor module and method for producing a sensor module
#274Inertial sensor with dual cavity package and method of fabrication
#275Method of making a physical quantity sensor
#276DEVICE FOR ASSEMBLING AN ELECTRONIC COMPONENT
#277Chip housing having reduced induced vibration
#278Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
#279Method For The Preparation Of A Flexible Transducer Unit, The Flexible Transducer Unit So Prepared And An Array Containing Such Flexible Transducer Units
#280Environment-resistant module, micropackage and methods of manufacturing same
#281Semiconductor device having multiple substrates
#282MEMS SWITCH AND METHOD OF FABRICATING THE SAME
#283Semiconductor device carrying micro electro mechanical system
#284Integrated circuit having a semiconductor sensor device with embedded column-like spacers
#285Silicon condenser microphone and manufacturing method
#286Silicon condenser microphone and manufacturing method
#287Wafer encapsulated microelectromechanical structure and method of manufacturing same
#288Wafer encapsulated microelectromechanical structure and method of manufacturing same
#289Wafer encapsulated microelectromechanical structure and method of manufacturing same
#290Wafer encapsulated microelectromechanical structure and method of manufacturing same
#291Wafer encapsulated microelectromechanical structure and method of manufacturing same
#292Wafer encapsulated microelectromechanical structure and method of manufacturing same
#293Wafer encapsulated microelectromechanical structure and method of manufacturing same
#294Wafer encapsulated microelectromechanical structure and method of manufacturing same
#295Wafer encapsulated microelectromechanical structure and method of manufacturing same
#296Wafer encapsulated microelectromechanical structure and method of manufacturing same
#297Microelectromechanical component and method for the production thereof
#298Semiconductor sensor device with sensor chip and method for producing the same
#299Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device
#300Microelectromechanical (MEM) device with a protective cap that functions as a motion stop