83801 ⎘
Microstructural systems; Auxiliary parts of microstructural devices or systems; Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
MEMS Sensor Module
#2SEALED BONDED STRUCTURES AND METHODS FOR FORMING THE SAME
#3ELECTRONIC DEVICE
#4SYSTEMS AND METHODS FOR ESD PROTECTION OF SEMICONDUCTOR DEVICES
#5ELECTRONIC DEVICES INCLUDING DEVICE PACKAGES HAVING A PORT HOLE WITH A SPARK ARREST SHOULDER AND RELATED METHODS
#6WAFER-LEVEL PACKAGING STRUCTURE, MANUFACTURING METHOD THEREFOR, AND SENSOR
#7PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#8HANDHELD ELECTRONIC PRODUCT
#9ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR
#10MEMS DEVICE
#11CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#12Reduced light reflection package
#13Wearable device
#14PACKAGE, MICROPHONE DEVICE, AND ELECTRONIC APPARATUS
#15Semiconductor Device and Method of Making a MEMS Semiconductor Package
#16PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MANUFACTURING PRESSURE SENSOR STRUCTURE
#17Microphone assembly with disturbance compensation
#18ANTENNA APPARATUS
#19System for protecting mems product under ESD event
#20Enclosures for Microphone Assemblies Including a Fluoropolymer Insulating Layer
#21Reduced light reflection package
#22Acoustic transducer assembly
#23Wearable infrared temperature sensing device
#24Semiconductor structures
#25Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method
#26MEMS-Sensor
#27Capacitive sensors having temperature stable output
#28Stacked structure and method for manufacturing the same
#29Package level thermal gradient sensing
#30SEALED BONDED STRUCTURES AND METHODS FOR FORMING THE SAME
#31PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPHONE PACKAGE AND PACKAGING METHOD THEREOF
#32Packaging for MEMS transducers
#33Semiconductor structures
#34Packaged circuit system structure
#35Wearable infrared temperature sensing device
#36MEMS device with movable stage
#37Molded lead frame sensor package
#38MEMS microphone and a manufacturing method thereof
#39Piezoelectric micromachined ultrasonic transducers and methods for fabricating thereof
#40MEMS devices and processes
#41Shielded semiconductor device and lead frame therefor
#42Device for suppressing stray radiation
#43MEMS TRANSDUCER PACKAGE AND A MEMS DEVICE INCLUDING THE SAME
#44SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
#45MEMS chip and electrical packaging method for MEMS chip
#46Over-under sensor packaging with sensor spaced apart from control chip
#47CMOS-MEMS integrated device without standoff in MEMS
#48Antenna apparatus
#49MEMS assembly and method for producing a MEMS assembly
#50MEMS-sensor
#51MEMS assembly
#52EMI reduction in piezoelectric micromachined ultrasound transducer array
#53Device package with reduced radio frequency losses
#54Top port multi-part surface mount silicon condenser microphone
#55Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
#56EMC PROTECTION OF A SEMICONDUCTOR COMPONENT
#57Wearable infrared temperature sensing device
#58ELECTROSTATIC OFFSET CORRECTION
#59Over-under sensor packaging with sensor spaced apart from control chip
#60Microphone with hydrophobic ingress protection
#61MEMS pressure sensing element
#62Apparatus with a high heat capacity and method for producing the same
#63MEMS package
#64MEMS transducer package
#65Top port multi-part surface mount MEMS microphone
#66Microphone
#67Microelectromechanical systems package structure
#68SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#69Filter including bulk acoustic wave resonator
#70Integrated multi-sensing systems
#71Packaging structure of integrated sensor
#72MEMS capacitive shear sensor system having an interface circuit
#73Integral metallic joint based on electrodeposition
#74Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices
#75PACKAGING FOR MEMS TRANSDUCERS
#76Molded cavity package with embedded conductive layer and enhanced sealing
#77Top port multi-part surface mount silicon condenser microphone
#78Physical quantity sensor
#79PACKAGING FOR MEMS TRANSDUCERS
#80Semiconductor device package including a wall and a grounding ring exposed from the wall
#81PRINTED WIRING BOARD AND MAGNETICSHIELD PACKAGE
#82MEMS devices and fabrication methods thereof
#83Method for producing a micro-electromechanical component and a micro-electromechanical component
#84Reversible top/bottom MEMS package
#85Physical quantity sensor, electronic apparatus, and moving object
#86Transducer array subdicing
#87Semiconductor device including a cavity lid
#88Wearable infrared temperature sensing device
#89Top port multi-part surface mount silicon condenser microphone
#90Physical quantity sensor and method for manufacturing the same
#91MEMS microphone package
#92Methods and structures of integrated MEMS-CMOS devices
#93MEMS microphone package
#94Environment-resistant module, micropackage and methods of manufacturing same
#95Microelectromechanical system device with internal direct electric coupling
#96Cap and substrate electrical connection at wafer level
#97Component which can be produced at wafer level and method of production
#98Radio frequency (RF) microelectromechanical systems (MEMS) devices with gold-doped silicon
#99Electronic part, electronic apparatus, and moving object
#100Hermetic plastic molded MEMS device package and method of fabrication
#101Aluminum nitride (AlN) devices with infrared absorption structural layer
#102Semiconductor Package And Manufacturing Method Thereof
#103MEMS device with constant capacitance
#104Shielded encapsulating structure and manufacturing method thereof
#105Reversible top/bottom MEMS package
#106MEMS package and a method for manufacturing the same
#107Package structure having MEMS element
#108MEMS package structure and manufacturing method thereof
#109Cavity-type semiconductor package and method of packaging same
#110PHYSICAL QUANTITY SENSOR
#111Sensor device
#112Electrical shielding in a MEMS leadframe package
#113TECHNIQUES FOR THE CANCELLATION OF CHIP SCALE PACKAGING PARASITIC LOSSES
#114Packages and methods for packaging
#115Physical quantity sensor, electronic apparatus, and moving object
#116Electronic device, integrated circuit, electronic apparatus, and moving object
#117Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same
#118Chip scale package structure and manufacturing method thereof
#119Semiconductor device and microphone
#120MEMS microphone package with molded interconnect device
#121Cap and substrate electrical connection at wafer level
#122Semiconductor package and manufacturing method thereof
#123Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer
#124Electronic component and method for producing the electronic component
#125Encapsulation of an MEMS component and a method for producing said component
#126Package structure having micro-electro-mechanical system element and method of fabrication the same
#127ELECTROSTATIC DISCHARGE COMPLIANT PATTERNED ADHESIVE TAPE
#128EMI-shielded semiconductor devices and methods of making
#129Cavity-type semiconductor package and method of packaging same
#130Shielded encapsulating structure and manufacturing method thereof
#131Ultraviolet energy shield for non-volatile charge storage memory
#132LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY
#133Method for wafer level packaging of electronic devices
#134Methods for forming a micro electro-mechanical device
#135MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE
#136Sensor module
#137Packages and methods for packaging using a lid having multiple conductive layers
#138MEMS SENSOR PACKAGE
#139Reversible top/bottom MEMS package
#140Surface mount silicon condenser microphone package
#141Environment-resistant module, micropackage and methods of manufacturing same
#142MICROELECTROMECHANICAL SYSTEM (MEMS) CARRIER AND METHOD OF FABRICATING THE SAME
#143Sensor module having an electromagnetically shielded electrical component
#144Electronic component mounting device and method for producing the same
#145Acoustic Transducer Unit
#146Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same
#147Ultraviolet energy shield for non-volatile charge storage memory
#148SEMICONDUCTOR DEVICE AND MICROPHONE
#149Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer
#150Surface mount silicon condenser microphone package
#151Micromechanical system and method for manufacturing a micromechanical system
#152MEMS package and method for the production thereof
#153Fabrication method of package structure having MEMS element
#154Package structure having MEMS element
#155Hermetic MEMS device and method for fabricating hermetic MEMS device and package structure of MEMS device
#156Cap and substrate electrical connection at wafer level
#157Shielding for a micro electro-mechanical device and method therefor
#158Wafer level packaging using flip chip mounting
#159Vertically integrated MEMS acceleration transducer
#160Sensor apparatus and sensor apparatus attachment structure
#161System and method to provide RF shielding for a MEMS microphone package
#162MEMS PACKAGE
#163Lid for micro-electro-mechanical device and method for fabricating the same
#164Acoustic transducer unit
#165Electronic device and method for manufacturing structure for electronic device
#166Wide band and radio frequency waveguide and hybrid integration in a silicon package
#167Sensor module
#168Sensor device and production method therefor
#169SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LID FRAME
#170MEMS microphone package having sound hole in PCB
#171Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component
#172Environment-resistant module, micropackage and methods of manufacturing same
#173MEMS package and method for the production thereof
#174Microelectromechanical system package and the method for manufacturing the same
#175MEMS microphone, production method and method for installing
#176MEMS structure using carbon dioxide and method of fabrication
#177Electrostatic capacity sensor
#178CAP PACKAGE FOR MICRO ELECTRO-MECHANICAL SYSTEM CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE
#179Cap package for micro electro-mechanical system
#180LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE
#181Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same
#182MICRO-ELECTROMECHANICAL SYSTEM PACKAGE
#183MICRO-ELECTROMECHANICAL SYSTEM PACKAGE
#184MICRO ELECTRO-MECHANICAL SYSTEM MODULE PACKAGE CAPABLE OF MINIMIZING INTERFERENCE OF NOISES
#185Microelectromechanical system assembly and method for manufacturing thereof
#186Microelectromechanical microphone packaging system
#187Silicon condenser microphone and manufacturing method
#188Silicon condenser microphone and manufacturing method
#189SEMICONDUCTOR DEVICE
#190Method of fabricating a miniature silicon condenser microphone
#191Packaged microphone with electrically coupled lid
#192Miniature silicon condenser microphone
#193Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
#194Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
#195Sensor module
#196System and method for producing a reduced substrate micro-electro-mechanical systems (MEMS) device
#197Micromechanical cap structure and a corresponding production method
#198Method of manufacturing a microphone
#199Structure for controlling flashover in MEMS devices
#200Semiconductor package device including microelectromechanical system
#201Actively preventing charge induced leakage of semiconductor devices
#202Semiconductor device including a MEMS die and a conductive layer
#203Top port multi-part surface mount silicon condenser microphone
#204Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
#205Methods of manufacture of top port surface mount MEMS microphones
#206Top port surface mount MEMS microphone
#207Methods of manufacture of bottom port surface mount MEMS microphones
#208Methods of manufacture of top port multi-part surface mount MEMS microphones
#209Methods of manufacture of bottom port surface mount MEMS microphones
#210Bottom port surface mount MEMS microphone
#211Bottom port surface mount MEMS microphone
#212Top port surface mount MEMS microphone
#213Top port multi-part surface mount MEMS microphone
#214Methods of manufacture of bottom port multi-part surface mount MEMS microphones
#215Methods of manufacture of top port surface mount MEMS microphones
#216Bottom port multi-part surface mount MEMS microphone