GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE

DIELECTRIC STACK FOR MICROELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF FABRICATION THEREOF

METHOD FOR PRODUCING A COMPOSITE CAP ELEMENT, AND COMPOSITE CAP ELEMENT

COVER GLASS WITH OUTER FRAME, SEMICONDUCTOR LIGHT EMITTING DEVICE, AND SEMICONDUCTOR LIGHT RECEIVING DEVICE

HANDHELD ELECTRONIC PRODUCT

MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

PROCESS FOR MANUFACTURING AN OPTICAL MICROELECTROMECHANICAL DEVICE HAVING A TILTABLE STRUCTURE WITH AN ANTIREFLECTIVE SURFACE

INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR

Wearable device

3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FOOTPRINT

Wearable infrared temperature sensing device

Packaged device with die wrapped by a substrate

MEMS package with shock and vibration protection

Hermetic housing comprising a getter, optoelectronic component or MEMS device incorporating such a hermetic housing and associated production method

A MEMS Package

Chip package and manufacturing method thereof

IR emitter with glass lid

Production method for a micromechanical device having inclined optical windows, and micromechanical device having inclined optical windows

Emitter package for a photoacoustic sensor

Optical electronics device

MEMs phased-array for LiDAR applications

Hermetically sealed optically transparent wafer-level packages and methods for making the same

Packaged device with die wrapped by a substrate

Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device

GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE

Transmitting device for a LIDAR scanner having a scanning mirror covered by a cover element

Transmitting device with a scanning mirror covered by a collimating cover element

Encapsulant barrier

Wearable infrared temperature sensing device

Protective wafer including inclined optical windows and device

MEMS mirror arrangement for detecting a large angular range

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

COATED OPTICAL ELEMENT COMPONENT WITH A COATED OPTICAL ELEMENT AND METHOD TO PRODUCE THE SAME

PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING PACKAGED SEMICONDUCTOR DEVICES

Semiconductor device package

Packaging for compact object-scanning modules

Lighting module for motor vehicle projector

Encapsulant barrier

Wearable infrared temperature sensing device

MEMS device with viewer window and manufacturing method thereof

Tilted chip assembly for optical devices

MEMS DEVICE PACKAGE AND METHOD FOR PACKAGING MEMS DEVICE

MEMS package

Optical electronics device

Electro-optic device, electro-optic unit, and electronic apparatus

MICROFABRICATED OPTICAL APPARATUS WITH FLEXIBLE ELECTRICAL CONNECTOR

Microfabricated optical apparatus with grounded metal layer

Multi-device transducer modulus, electronic apparatus including the transducer modulus and method for manufacturing the transducer modulus

Position detection method and optical module

Method for manufacturing a protective wafer including inclined optical windows and device

Semiconductor device package including cover including tilted inner sidewall

Semiconductor structure with cavity spacing monitoring functions

Scanning mirror device and a method for manufacturing it

CMOS BASED MICRO-PHOTONIC SYSTEMS

MICROFABRICATED OPTICAL APPARATUS

Actuator inside of motion control

Semiconductor device package for reducing parasitic light and method of manufacturing the same

Assembly body for micromirror chips, mirror device and production method for a mirror device

Optical electronic device and method of fabrication

Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays

Anodic bonding of dielectric substrates

Wearable infrared temperature sensing device

Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling

Cap, semiconductor device including the cap, and manufacturing method therefor

Method for producing a wafer equipped with transparent plates

MEMS DEVICE AND METHOD FOR PRODUCING AN MEMS DEVICE OPERATING WITH ACOUSTIC WAVES

Packaging MEMS in fluidic environments

Electronic device and electronic apparatus

Method for embedding controlled-cavity MEMS package in integration board

Package implemented with PCB and transparent substrate to contain and protect a MEMS device

Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays

Methods for embedding controlled-cavity MEMS package in integration board

Optical deflector apparatus including optical deflector chip sandwhiched by two substrates

GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES

MEMS anchor and spacer structure

Cover device for a micro-optomechanical component, and manufacturing method for such a cover device

METHOD AND SYSTEM FOR PACKAGING A DISPLAY

Actuator inside of motion control

Micro-optical device packaging system

Packaging device and base member for packaging

Cover for microsystems and method for producing a cover

Optical module

Micro-optical device packaging system

Housing for micro-mechanical and micro-optical components used in mobile applications

Production method for a micromechanical component, and a micromechanical component

ENCAPSULATED SPATIAL LIGHT MODULATOR HAVING LARGE ACTIVE AREA

MICROMECHANICAL SENSOR- OR ACTUATOR COMPONENT AND METHOD FOR THE PRODUCTION OF MICROMECHANICAL SENSOR- OR ACTUATOR COMPONENTS

MEMS BASED OPTICAL COHERENCE TOMOGRAPHY PROBE

Method of producing optical MEMS

HERMETICALLY SEALED PACKAGE WITH WINDOW

Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing

Miniature optically transparent window

Package structure and electronic device using the same

Package-type solid-state imaging apparatus with exhausting means

Method and system for flip chip packaging of micro-mirror devices

Apparatus and method for housing micromechanical systems

ULTRATHIN MODULE FOR SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Micro-Displays and Their Manufacture

Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device

Mirror package and method of manufacturing the mirror package

Method for manufacturing semiconductor device

Optical parts cap and method of manufacturing the same

Method for micro-electromechanical system package

Chip packages with covers

Micro-mirror device package and method for fabricating the same

Bond method and structure using selective application of spin on glass

Micro-device packaging

Optoelectronic package with wire-protection lid

Optical scanner package and method of manufacturing the same

SYSTEM AND METHOD FOR DIRECT-BONDING OF SUBSTRATES

Wafer-level hermetic micro-device packages

Light transmissive cover, device provided with same and methods for manufacturing them

Method and system for packaging a display

Method and device for forming spacer structures for packaging optical reflection devices

Apparatus for micro-electro mechanical system package

Ultrathin module for semiconductor device and method of fabricating the same

Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its production

Wafer-level hermetic micro-device packages

System and method for direct-bonding of substrates

Optical device with a mobile optical element capable of interacting with an optical guide structure

Optical fiber terminator package

Light transmissive cover, device provided with same and methods for manufacturing them

Hermetically sealed micro-device package with window

Infrared sensor package

Method and device using silicon substrate to glass substrate anodic bonding