Patents-Review.com
ClassID:

83804 ⎘

B81B7/0074 - CPC Classification

Classification description:

Microstructural systems; Auxiliary parts of microstructural devices or systems; Packages or encapsulation 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board

Recent Application in this class:
#1
20260097955
2026-04-09

MEMS Sensor Module

 #2
20260062286
2026-03-05

MULTI-CHIP SENSOR

 #3
20250376370
2025-12-11

MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT

 #4
20250343086
2025-11-06

SEAL FOR MICROELECTRONIC ASSEMBLY

 #5
20250224729
2025-07-10

MULTISENSOR MEMS INERTIAL SENSOR GUIDANCE FOR AUTOMATIC VEHICLES

 #6
20250174566
2025-05-29

THREE-DIMENSIONAL MICRO-ELECTRO-MECHANICAL, MICROFLUIDIC, AND MICRO-OPTICAL SYSTEMS

 #7
20250109972
2025-04-03

SENSOR PACKAGE AND SENSING MODULE THEREOF

 #8
20250109011
2025-04-03

INTEGRATED SENSOR DEVICE

 #9
20250074765
2025-03-06

HIGH RELIABILITY SENSOR

 #10
20240425364
2024-12-26

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

 #11
20240199411
2024-06-20

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

 #12
20240166497
2024-05-23

MICROELECTROMECHANICAL SYSTEMS (MEMS) RECTIFIER AND STORAGE ELEMENT FOR ENERGY HARVESTING

 #13
20240140783
2024-05-02

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE AND A DEVICE THEREOF

 #14
20230420313
2023-12-28

SEAL FOR MICROELECTRONIC ASSEMBLY

 #15
20230400788
2023-12-14

CHIP ASSEMBLY AND METHOD OF MAKING A CHIP ASSEMBLY

 #16
20230345184
2023-10-26

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE

 #17
20230257258
2023-08-17

SEMICONDUCTOR DEVICE AND SENSOR MODULE

 #18
20230235664
2023-07-27

ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS

 #19
20230192478
2023-06-22

Semiconductor Device and Method of Making a MEMS Semiconductor Package

 #20
20230163103
2023-05-25

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

 #21
20230138355
2023-05-04

Microelectromechanical systems (MEMS) rectifier and storage element for energy harvesting

 #22
20230126598
2023-04-27

Attachment of Stress Sensitive Integrated Circuit Dies

 #23
20230005841
2023-01-05

Semiconductor package device and method for manufacturing the same

 #24
20220415734
2022-12-29

Seal for microelectronic assembly

 #25
20220367339
2022-11-17

Wafer level stacked structures having integrated passive features

 #26
20220364864
2022-11-17

Sensor device and sensor

 #27
20220315413
2022-10-06

Sensing device and method for manufacturing sensing device

 #28
20220219970
2022-07-14

Chip package

 #29
20220033249
2022-02-03

MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT

 #30
20210407910
2021-12-30

Semiconductor package device and method for manufacturing the same

 #31
20210321184
2021-10-14

MEMS microphone with hybrid packaging structure

 #32
20210147218
2021-05-20

Integrated MEMS cavity seal

 #33
20210125918
2021-04-29

Wafer level stacked structures having integrated passive features

 #34
20210047173
2021-02-18

Semiconductor device

 #35
20210032096
2021-02-04

Chip package and manufacturing method thereof

 #36
20210020576
2021-01-21

Three-dimensional micro-electro-mechanical, microfluidic, and micro-optical systems

 #37
20200385260
2020-12-10

Microelectromechanical device with signal routing through a protective cap

 #38
20200361764
2020-11-19

Attachment of stress sensitive integrated circuit dies

 #39
20200140268
2020-05-07

Seal for microelectronic assembly

 #40
20200140267
2020-05-07

Seal for microelectronic assembly

 #41
20190378798
2019-12-12

Seal ring bonding structures

 #42
20190295914
2019-09-26

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

 #43
20190292045
2019-09-26

Integrated micro-electromechanical device of semiconductor material having a diaphragm

 #44
20190276306
2019-09-12

Semiconductor package with multiple compartments

 #45
20190265268
2019-08-29

Inertial measurement units

 #46
20190248648
2019-08-15

Device for supporting a MEMS component

 #47
20190148344
2019-05-16

Multiple plated via arrays of different wire heights on same substrate

 #48
20190062150
2019-02-28

Method of manufacturing an electronic device

 #49
20180327256
2018-11-15

Contact pads for electrical module assembly with multidimensional transducer arrays

 #50
20180301436
2018-10-18

Multiple bond via arrays of different wire heights on a same substrate

 #51
20180273377
2018-09-27

Seal for microelectronic assembly

 #52
20180251369
2018-09-06

Semiconductor package with multiple compartments

 #53
20180170748
2018-06-21

SEMICONDUCTOR DEVICES WITH CAVITIES AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICES WITH CAVITIES

 #54
20180168034
2018-06-14

Wiring-buried glass substrate, and inertial sensor element and inertial sensor using same

 #55
20170320725
2017-11-09

Low stress integrated device packages

 #56
20170313578
2017-11-02

Method and structure of MEMS PLCSP fabrication

 #57
20170297906
2017-10-19

Microelectromechanical device with signal routing through a protective cap

 #58
20170283249
2017-10-05

PIEZOELECTRIC PACKAGE-INTEGRATED SWITCHING DEVICES

 #59
20170263581
2017-09-14

ELECTRONIC DEVICE, PART MOUNTING BOARD, AND ELECTRONIC APPARATUS

 #60
20170248628
2017-08-31

Multiple MEMS device and methods

 #61
20170233247
2017-08-17

Low cost wafer level process for packaging MEMS three dimensional devices

 #62
20170225946
2017-08-10

INTEGRATION OF LAMINATE MEMS IN BBUL CORELESS PACKAGE

 #63
20170210621
2017-07-27

Micromechanical component and method for producing same

 #64
20170205301
2017-07-20

Production method for a detection apparatus and detection apparatuses

 #65
20170203959
2017-07-20

Protection structure for semiconductor device package

 #66
20170197820
2017-07-13

ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT

 #67
20170174507
2017-06-22

Semiconductor devices with cavities and methods for fabricating semiconductor devices with cavities

 #68
20170154875
2017-06-01

Multiple bond via arrays of different wire heights on a same substrate

 #69
20170073222
2017-03-16

ELECTRONIC SYSTEM, AS WELL AS MANUFACTURING METHOD, AND DEVICE FOR MANUFACTURING AN ELECTRONIC SYSTEM

 #70
20170038209
2017-02-09

Microelectronic packages having split gyroscope structures and methods for the fabrication thereof

 #71
20170008760
2017-01-12

MEMS-CMOS-MEMS platform

 #72
20160347609
2016-12-01

MEMS packages and methods of manufacture thereof

 #73
20160297673
2016-10-13

Device with vertically integrated sensors and method of fabrication

 #74
20160229690
2016-08-11

Semiconductor device

 #75
20160221820
2016-08-04

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

 #76
20160176702
2016-06-23

Integrated micro-electromechanical device of semiconductor material having a diaphragm, such as a pressure sensor and an actuator

 #77
20160167958
2016-06-16

Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)

 #78
20160167951
2016-06-16

Low stress compact device packages

 #79
20160145096
2016-05-26

Microelectromechanical device with signal routing through a protective cap

 #80
20160145095
2016-05-26

Isolation structure for MEMS 3D IC integration

 #81
20160137490
2016-05-19

CAVITY PACKAGE DESIGN

 #82
20160107884
2016-04-21

Package with chambers for dies and manufacturing process thereof

 #83
20160090301
2016-03-31

Packages for semiconductor devices and methods for assembling same

 #84
20160046484
2016-02-18

Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bonding

 #85
20160046483
2016-02-18

Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs)

 #86
20160043108
2016-02-11

Semiconductor Structure with Multiple Active Layers in an SOI Wafer

 #87
20160031707
2016-02-04

MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES

 #88
20150375996
2015-12-31

Method of making a system-in-package device, and a system-in-package device

 #89
20150375995
2015-12-31

MEMS fabrication process with two cavities operating at different pressures

 #90
20150353348
2015-12-10

Glass wafer assembly

 #91
20150329352
2015-11-19

Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof

 #92
20150274512
2015-10-01

MEMS device and formation method thereof

 #93
20150251903
2015-09-10

Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof

 #94
20150183637
2015-07-02

Compact electronic package with MEMS IC and related methods

 #95
20150145077
2015-05-28

Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device

 #96
20150115378
2015-04-30

Method for manufacturing a die assembly having a small thickness and die assembly relating thereto

 #97
20150108653
2015-04-23

Sensor device packages and related fabrication methods

 #98
20150076628
2015-03-19

Multi-port device package

 #99
20140230546
2014-08-21

Microelectromechanical device with signal routing through a protective cap

 #100
20140196540
2014-07-17

Two-axis vertical mount package assembly

 #101
20130320803
2013-12-05

Electronic device, electronic apparatus, and method of manufacturing electronic device

 #102
20130256919
2013-10-03

Multifunction sensor as PoP microwave PCB

 #103
20130134604
2013-05-30

Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems

 #104
20130032936
2013-02-07

Package for a MEMS sensor and manufacturing process thereof

 #105
20120279077
2012-11-08

Systems and methods for three-axis sensor chip packages

 #106
20120256307
2012-10-11

Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus

 #107
20120247205
2012-10-04

Sensor module and method for manufacturing a sensor module

 #108
20120235253
2012-09-20

Vertical mount package for MEMS sensors

 #109
20120193731
2012-08-02

Edge-mounted sensor

 #110
20120190153
2012-07-26

Method for connecting substrate and method for manufacturing semiconductor device

 #111
20120126349
2012-05-24

Systems and methods for a three-layer chip-scale MEMS device

 #112
20120080764
2012-04-05

Apparatus and method for microelectromechanical systems device packaging

 #113
20120032286
2012-02-09

Three dimensional folded MEMS technology for multi-axis sensor systems

 #114
20120025332
2012-02-02

Systems and methods for mounting inertial sensors

 #115
20110162452
2011-07-07

Electronic device, electronic module, and methods for manufacturing the same

 #116
20110108935
2011-05-12

Silicon tab edge mount for a wafer level package

 #117
20100252939
2010-10-07

Chip module and method for producing a chip module having plains of extensions for chip and substrate

 #118
20100242600
2010-09-30

Vertically integrated MEMS acceleration transducer

 #119
20100221860
2010-09-02

PRECISION MICRO-ELECTROMECHANICAL SENSOR (MEMS) MOUNTING IN ORGANIC PACKAGING

 #120
20100193939
2010-08-05

Wiring substrate with a wire terminal

 #121
20100155862
2010-06-24

Package for electronic component, manufacturing method thereof and sensing apparatus

 #122
20100078804
2010-04-01

Apparatus with Side Mounted Microchip

 #123
20100078739
2010-04-01

Vertical mount package for MEMS sensors

 #124
20090315129
2009-12-24

INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANES AND ITS METHOD OF PRODUCTION

 #125
20090152653
2009-06-18

Surface mount multi-axis electronics package for micro-electrical mechanical systems(MEMS) devices

 #126
20090148983
2009-06-11

Method of manufacturing flexible semiconductor assemblies

 #127
20090095510
2009-04-16

Electronic device, electronic module, and methods for manufacturing the same

 #128
20070170228
2007-07-26

Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same

 #129
20070102810
2007-05-10

SENSOR BLOCK

 #130
20070101812
2007-05-10

Miniature package for translation of sensor sense axis

 #131
20070045807
2007-03-01

Microelectronic devices and methods for manufacturing microelectronic devices

 #132
20070001282
2007-01-04

Three-dimensional semiconductor module having multi-sided ground block

 #133
20060042382
2006-03-02

Package for MEMS devices

 #134
15448177
2018-04-03

Semiconductor package with multiple compartments

 #135
13969052
2015-10-20

Metal mesh lid MEMS package and method