MEMS PRESSURE TRANSDUCER WAFER-LEVEL CHIP-SCALE PACKAGE AND METHOD FOR PRODUCING THE SAME

METHODS AND SYSTEMS FOR STACKED MICROELECTROMECHANICAL SYSTEM DEVICES

Stacked-die MEMS resonator

Monolithic Microelectromechanical Systems Based Spatial Light Modulators with Two-dimensional Modulators

PACKAGE STRUCTURE

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A METHOD FOR MANUFACTURING IT

SENSOR PACKAGE WITH HOLLOW STRUCTURE AND METHOD FOR ASSEMBLING SENSOR PACKAGE

STACKED-DIE MEMS RESONATOR

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD

MICRO-ELECTROMECHANICAL PACKAGING STRUCTURE

MEMS resonator system

Bond wave optimization method and device

Method of manufacturing electronic devices and corresponding electronic device

Sensing module and manufacturing method thereof

Bond wave optimization method and device

Stacked-die MEMS resonator

MEMS encapsulation employing lower pressure and higher pressure deposition processes

HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

Hollow package and method for manufacturing same

Enclosed cavity structures

ENCLOSED CAVITY STRUCTURES

Sound port adapter for microphone assembly

Enclosed cavity structures

Stacked-die MEMS resonator

METHOD OF RAPID ENCAPSULATION OF MICROELECTRONIC DEVICES

CMOS ultrasonic transducers and related apparatus and methods

Barriers for Flexible Substrates and Methods of Making the Same

Enclosed cavity structures

Semiconductor package structure

Enclosed cavity structures

Microphone and manufacturing method thereof

Enclosed cavity structures

Semiconductor package structure and method for manufacturing the same

Methods for packaging a microelectromechanical systems device

Manufacturing of integrated circuit resonator

MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone

MEMS package with roughend interface

Method of manufacturing electronic devices and corresponding electronic device

Electronic device and corresponding manufacturing method

Water proofing and water detection schemes for MEMS-based environmental sensing devices

Systems and methods for acoustic hole optimization

Microelectromechanical systems packages and methods for packaging a microelectromechanical systems device

System and method for a mems transducer

Wafer-level fan-out package with enhanced performance

MEMS device

MEMS devices and methods of forming same

MEMS ISOLATION STRUCTURES

Terminal assembly structure of MEMS microphone

Semiconductor module

Packaging structures with improved adhesion and strength

CMOS ultrasonic transducers and related apparatus and methods

Device with terminal-containing sensor

Package structure for micromechanical resonator

CMOS ultrasonic transducers and related apparatus and methods

Electronic system comprising a microelectromechanical system and a box encapsulating this microelectromechanical system

MEMS assembly

CHIP PACKAGE AND CHIP PACKAGING METHOD

Wafer level encapsulation for MEMS device

Composite wafers

Non-magnetic package and method of manufacture

Water proofing and water detection schemes for MEMS-based environmental sensing devices

Test structure and manufacturing method therefor

MEMS devices and methods of forming same

Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof

Optical power attenuator

Semiconductor device and semiconductor device manufacturing method

MEMS package with roughend interface

Low-profile stacked-die MEMS resonator system

CMOS ultrasonic transducers and related apparatus and methods

MEMS device and method for producing same

Multi-chamber multi-device transducer module, apparatus including the transducer module and method of manufacturing the transducer module

Method and apparatus for using universal cavity wafer in wafer level packaging

Semiconductor gas sensor device and manufacturing method thereof

Packaging structures with improved adhesion and strength

MEMS isolation structures

Method for producing a semiconductor module

Ceramic substrate, bonded body, module, and method for manufacturing ceramic substrate

Method and structure of MEMS PLCSP fabrication

Micro-transfer-printed compound sensor device

CMOS ultrasonic transducers and related apparatus and methods

Protection structure for semiconductor device package

Membrane transducer structures and methods of manufacturing same using thin-film encapsulation

Semiconductor devices with cavities and methods for fabricating semiconductor devices with cavities

Protection structure for semiconductor device package

Laser reseal including an additional layer and alloy formation

PACKAGING FOR MEMS TRANSDUCERS

MEMS devices and methods of forming same

Micro-electro-mechanical system and manufacturing method thereof

Stacked-die MEMS resonator system

Self-destructing chip

Method and apparatus for using universal cavity wafer in wafer level packaging

Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation

Wafer level chip scale packaged micro-electro-mechanical-system (MEMS) device and methods of producing thereof

MEMS isolation structures

MEMS DEVICE

Sensor element

Method for improving manufacturability of cavity packages for direct top port MEMS microphone

Pre-molded MEMS device package having conductive column coupled to leadframe and cover

Non-magnetic package and method of manufacture

Semiconductor package with air pressure sensor

Wafer level packaging of MEMS

Use of metal native oxide to control stress gradient and bending moment of a released MEMS structure

Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation

Membrane transducer structures and methods of manufacturing same using thin-film encapsulation

Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

SEMICONDUCTOR GAS SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

MEMS structure, cap substrate and method of fabricating the same

Sensor integration with an outgassing barrier and a stable electrical signal path

DEVICE PACKAGING METHOD AND DEVICE PACKAGE USING THE SAME

LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT

Low cost window production for hermetically sealed optical packages

MEMS devices and methods of forming same

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Microphone package and mounting structure thereof

System and method for a MEMS transducer

Low-profile stacked-die MEMS resonator system

Pre-molded MEMS device package with conductive shell

Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof

Chip with a Micro-Electromechanical Structure and Covering Element, and a Method for the Production of Same

Semiconductor device including accelerometer devices

Integrated circuit package including in-situ formed cavity

SENSOR PACKAGE AND METHOD OF FORMING SAME

Encapsulation structure including a mechanically reinforced cap and with a getter effect

Apparatus and method for reduced strain on MEMS devices

Vertical mount package and wafer level packaging therefor

Chip arrangement and method for manufacturing a chip arrangement

Microphone Module and Method of Manufacturing Thereof

COVER FOR A MEMS MICROPHONE

Electronic device with an interlocking mold package

Microphone package with integrated substrate

SURFACE CHARGE MITIGATION LAYER FOR MEMS SENSORS

Pre-molded MEMS device package having conductive column coupled to leadframe and cover

Packaged device exposed to environmental air and liquids and manufacturing method thereof

Bonded wafer structures

Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die

Sensor package and method of forming same

Semiconductor package with air pressure sensor

Electronic component and method for producing the electronic component

Chip package and method for forming the same

Chip package and method for forming the same

CHIP EMBEDDED PACKAGES AND METHODS FOR FORMING A CHIP EMBEDDED PACKAGE

Energy storage structure, method of manufacturing a support structure for same, and microelectronic assembly and system containing same

PACKAGE STRUCTURE AND PACKAGING METHOD

Photostructured magnetic devices and methods for making same

Vertical mount package and wafer level packaging therefor

Cavity package design

Component and method for producing a component

MEMS oscillator and manufacturing method thereof

MEMS devices and methods of forming same

3D integrated electronic device structure including increased thermal dissipation capabilities

Method for wafer level packaging of electronic devices

STRUCTURED GLASS WAFER FOR PACKAGING A MICROELECTROMECHANICAL-SYSTEM (MEMS) WAFER

MEMS device with integral packaging

Micromechanical component having a volume-elastic medium

Systems and methods for a three-layer chip-scale MEMS device

MEMS isolation structures

Incident radiation detector packaging

MEMS element, and manufacturing method of MEMS element

Low cost window production for hermetically sealed optical packages

Chip package and method for forming the same

Stacked die package for MEMS resonator system

Integrated circuit package with enlarged die paddle

Thin film wafer level package

Method of making an embedded electromagnetic device

SHIELD CASE AND MEMS MICROPHONE HAVING IT

Hermetically sealed housing for electronic components and manufacturing method

Micro-electro-mechanical-system device with particles blocking function and method for making same

Encapsulation device and method, microcapsule incorporating this device

MEMS PACKAGE

Method for packaging micromachined devices

In-situ cavity integrated circuit package

Arrangement comprising a microphone

SENSOR SYSTEM

Wafer level packaging using flip chip mounting

Shield case and MEMS microphone having it

Process for producing fluorocarbon microstructure, fluorocarbon microstructure, and microsystem

Micro-electro-mechanical-system device with particles blocking function and method for making same

Three dimensional integrated passive device and method of fabrication

Thermal conduction by encapsulation

Multi-MEMS Single Package MEMS Device

DEVICE CAVITY ORGANIC PACKAGE STRUCTURES AND METHODS OF MANUFACTURING SAME

Sensor device packaging

Housing for a semiconductor component

MEMS package having formed metal lid

Method for manufacturing a micromechanical component having a volume-elastic medium and micromechanical component

Low cost hermetically sealed package

Micromechanical component having a cap having a closure

Digital Micro-Mirror Device

MEMS device with integral packaging

Aluminum Based Bonding of Semiconductor Wafers

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Module comprising a semiconductor chip comprising a movable element

MEMS sensor with cap electrode

Package stiffener and a packaged device using the same

Three dimensional integrated passive device and method of fabrication

Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates

Flip-chip assembly of protected micromechanical devices

Low cost window production for hermetically sealed optical packages

Micro electro-mechanical system module package

Stacked die package for MEMS resonator system

Method of creating a predefined internal pressure within a cavity of a semiconductor device

SEMICONDUCTOR DEVICE PACKAGE

Z offset MEMS device

Method and zone for sealing between two microstructure substrates

MEMS FLIP-CHIP PACKAGING

MEMS module package using sealing cap having heat releasing capability and manufacturing method thereof

Electrostatic-capacitance-type acceleration sensor

Apparatus for downhole fluids analysis utilizing micro electro mechanical system (MEMS) or other sensors

Chip packages with covers

Moisture-resistant nano-particle material and its applications

Physical quantity sensor and manufacturing method therefor

Semiconductor device and method of manufacturing the same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Hermetically sealed package for optical, electronic, opto-electronic and other devices

Electronic parts packaging structure and method of manufacturing the same

Low cost hermetically sealed package

Method to form an electronic device

MEMS packaging with improved reaction to temperature changes

Wafer packaging and singulation method

Physical quantity sensor and manufacturing method therefor

WAFER LEVEL MICROELECTRONIC PACKAGING WITH DOUBLE ISOLATION

Increasing the adhesion of an adhesive connection in housings

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Micromechanical component and corresponsing production method

Microelectronic assembly having a perimeter around a MEMS device

Method of forming an assembly to house one or more micro components

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Hermetically sealed package for optical, electronic, opto-electronic and other devices

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Wafer packaging and singulation method

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for making a micromechanical device by using a sacrificial substrate

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

MEMS device with integral packaging

Wafer level hermetic sealing method

Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates

Multi-substrate package and method for assembling same

MEMS driver circuit arrangement

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Semiconductor device with sensor and/or actuator surface and method for producing it

Vacuum-cavity MEMS resonator

Micromachine package and method for manufacturing the same

Multiaxis sensing system for detection of airborne molecules and radionuclides

Semiconductor package structure

Hybrid CMOS-MEMS devices adapted for high-temperature operation and method for their manufacture

Method and structure of MEMS PLCSP fabrication

MEMS microphone package structure having an improved carrier and a method of manufacturing same

Microelectromechanical system resonators and related methods and apparatus

MEMS package with MEMS die, magnet, and window substrate fabrication method and structure