83922 ⎘
Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements Cavities
SAMPLE WELL FABRICATION TECHNIQUES AND STRUCTURES FOR INTEGRATED SENSOR DEVICES
#2METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#3METHOD FOR ENCLOSING REFERENCE GASES IN MEMS CELLS
#4METHOD FOR ENCLOSING REFERENCE GASES IN MEMS CELLS
#5NEURAL LATTICE DEVICE FOR CHARACTERIZATION OF NEURON BEHAVIOR
#6METHOD FOR MANUFACTURING A STRUCTURE COMPRISING A PLURALITY OF MEMBRANES OVERLOOKING CAVITIES
#7STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONTROL PRESSURE AT HIGH TEMPERATURE
#8Micro-electromechanical system device including a precision proof mass element and methods for forming the same
#9Method for Manufacturing a Microfluidic Device
#10Semiconductor structure and method for forming the same
#11Micro-electromechanical system device including a precision proof mass element and methods for forming the same
#12Method for preparing micro-cavity array surface product with inclined smooth bottom surface based on air molding method
#13SAMPLE WELL FABRICATION TECHNIQUES AND STRUCTURES FOR INTEGRATED SENSOR DEVICES
#14Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature
#15Method for sealing entries in a MEMS element
#16CAVITY SOI SUBSTRATE
#17MICROMACHINED MIRROR ASSEMBLY HAVING REFLECTIVE LAYERS ON BOTH SIDES
#18Segmented pedestal for mounting device on chip
#19Microstructure and method for manufacturing same
#20Silicon substrate having cavity and cavity SOI substrate including the silicon substrate
#21Method with mechanical dicing process for producing MEMS components
#22Process for producing a base of an analysis cell for analyzing a biochemical material, and analysis cell
#23Microelectromechanical system (MEMS) structure and method of formation
#24Optical electronics device
#25Stacked structure and method for manufacturing the same
#26Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature
#27MEMS package comprising multi-depth trenches
#28Methods for packaging a microelectromechanical systems device
#29Use of an uncoupling structure for assembling a component having a casing
#30Pressure sensor assemblies with protective pressure feature of a pressure mitigation element
#31Segmented pedestal for mounting device on chip
#32Multi-depth MEMS package
#33METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES FILLED WITH A SACRIFICIAL MATERIAL
#34Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
#35Semiconductor structure and manufacturing method thereof
#36METHOD FOR MANUFACTURING DUAL-CAVITY STRUCTURE, AND DUAL-CAVITY STRUCTURE
#37Micromachined mirror assembly having reflective layers on both sides
#38Microelectromechanical systems packages and methods for packaging a microelectromechanical systems device
#39Reduced MEMS cavity gap
#40Method for forming multi-depth MEMS package
#41Sample well fabrication techniques and structures for integrated sensor devices
#42MEMS microphone and method of manufacturing the same
#43Process for manufacturing a microelectromechanical device having a suspended buried structure and corresponding microelectromechanical device
#44MEMS microphone, method of manufacturing the same and MEMS microphone package including the same
#45MICROFLUIDIC CELL AND METHOD FOR THE PRODUCTION THEREOF
#46Apparatus having a cavity structure and method for producing same
#47METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE
#48Pressure sensor, in particular a microphone with improved layout
#49Ultrasonic transducer and method for manufacturing the same, display substrate and method for manufacturing the same
#50Microelectromechanical system (MEMS) structure and method of formation
#51Method for forming multi-depth MEMS package
#52MEMS SENSOR AND METHOD FOR MANUFACTURING SAME
#53Hermetically sealed package for mm-wave molecular spectroscopy cell
#54Process for fabricating a micromechanical structure made of silicon carbide including at least one cavity
#55Semiconductor sensor device and method for fabricating the same
#56Nanostraw devices and methods of fabricating and using the same
#57Hermetically sealed molecular spectroscopy cell with buried ground plane
#58Hermetically sealed molecular spectroscopy cell
#59Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film
#60METHOD FOR MANUFACTURING MEMS DEVICES USING MULTIPLE PHOTOACID GENERATORS IN A COMPOSITE PHOTOIMAGEABLE DRY FILM
#61Manufacturing method of MEMS sensor
#62MEMS-device manufacturing method, MEMS device, and MEMS module
#63MEMS DEVICE
#64Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
#65Apparatus having a cavity structure and method for producing same
#66Optical electronics device
#67Micro-electro-mechanical system (MEMS) structures and design structures
#68Micro-electro-mechanical system (MEMS) structures and design structures
#69Method of forming local nano/micro size structures of anodized metal
#70Micro-electro-mechanical system (MEMS) structures and design structures
#71Peeling method of cover member and manufacturing method of liquid ejecting head
#72Temporary mechanical stabilization of semiconductor cavities
#73Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus
#74Method of forming space for use in analysis devices
#75MEMS DEVICE AND MANUFACTURING METHOD THEREOF
#76Silicon on nothing devices and methods of formation thereof
#77Methods of fabricating semiconductor structures including cavities filled with a sacrificial material
#78Optical electronic device and method of fabrication
#79Method for Manufacturing Hollow Structure
#80Micro-electro-mechanical system (MEMS) structures and design structures
#81Micro-electro-mechanical system (MEMS) structures and design structures
#82Micro-Electro-Mechanical System (MEMS) structures and design structures
#83Microstructured substrate
#84Method and structure for creating cavities with extreme aspect ratios
#85Optical electronic device and method of fabrication
#86Micro-electro-mechanical system (MEMS) structures and design structures
#87Silicon on nothing devices and methods of formation thereof
#88Device member including cavity and method of producing the device member including cavity
#89MEMS device with sealed cavity and method for fabricating same
#90Cavity structure using patterned sacrificial layer
#91Method for forming micro-electro-mechanical system (MEMS) beam structure
#92Manufacturing method for a micromechanical component and a corresponding micromechanical component
#93Micropores and methods of making and using thereof
#94Silicon on nothing devices and methods of formation thereof
#95Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the same
#96Capacitive pressure sensor and method of manufacturing the same
#97Thin back glass interconnect
#98Component of a biosensor and process for production
#99System and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same
#100Method for etched cavity devices
#101Compression and cold weld sealing method for an electrical via connection
#102Cavity open process to improve undercut
#103Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the same
#104Method of manufacturing MEMS devices providing air gap control
#105Sacrificial layers made from aerogel for microelectromechanical systems (MEMS) device fabrication processes
#106ELECTROMECHANICAL TRANSDUCER AND METHOD OF FABRICATING THE SAME
#107PROCESS OF FORMING AN AIR GAP IN A MICROELECTROMECHANICAL SYSTEM DEVICE USING A LINER MATERIAL
#108Systems and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same
#109Method for making a cavity in the thickness of a substrate which may form a site for receiving a component
#110Formation Of Nanoporous Materials
#111Micromechanical component having a rear volume
#112Method for encapsulating an MEMS component
#113Method for producing a three-dimensionally controlled surface coating in a cavity
#114Process for manufacturing MEMS devices having buried cavities and MEMS device obtained thereby
#115Methods and devices for immobilization of single particles in a virtual channel in a hydrodynamic trap
#116Micropores and methods of making and using thereof
#117Method for forming buried cavities within a semiconductor body, and semiconductor body thus made
#118Etching cavity structures in silicon under dielectric membrane
#119Method of creating MEMS device cavities by a non-etching process
#120Method for forming non-aligned microcavities of different depths
#121Semiconductor devices grown in spherical cavity arrays and its preparation method
#122Use of field oxidation to simplify chamber fabrication in microfluidic devices
#123Material removing processes in device formation and the devices formed thereby
#124METHOD OF MANUFACTURING A MEMS ELEMENT
#125Process for Producing Air Gaps in Microstructures, Especially of the Air Gap Interconnect Structure Type for Integrated Circuits
#126Process for producing air gaps in microstructures, especially of the air gap interconnect structure type for integrated circuits
#127Method of manufacturing MEMS devices providing air gap control
#128Method for fabricating a sealed cavity microstructure
#129Method of manufacturing MEMS devices providing air gap control
#130Method of forming a device by removing a conductive layer of a wafer
#131Method for producing a semiconductor component and a semiconductor component produced according to the method
#132Method of manufacturing MEMS devices providing air gap control
#133Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this method
#134Method of creating MEMS device cavities by a non-etching process
#135Method for forming buried cavities within a semiconductor body, and semiconductor body thus made
#136Method for treating a structure to obtain an internal space and structure having an internal space
#137Method for producing a micromechanical device and a micromechanical device
#138Method of making microsensor
#139Three dimensional structure formed by using an adhesive silicon wafer process
#140Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel
#141Hermetically sealing using a cold welded tongue and groove structure
#142Method for manufacturing a micromechanical sensor element
#143Method of making cavities in a semiconductor wafer
#144Method for producing a semiconductor component and a semiconductor component produced according to the method
#145Method for producing micromechanical and micro-optic components consisting of glass-type materials
#146Method of forming a device by removing a conductive layer of a wafer
#147Episeal pressure sensor
#148Etching process
#149Etching method
#150Electronic device with thin film structure
#151Method for producing cavities having optically transparent wall
#152Method for forming MEMS cavity structure
#153Pseudo SOI process
#154Combined laser drilling and the plasma etch method for the production of a micromechanical device and a micromechanical device