B81C1/00023 - CPC Classification Index

ClassID:

83919 ⎘

B81C1/00023 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements

Sub-classes:

B81C1/00031 » {Regular or irregular arrays of nanoscale structures, e.g. etch mask layer } 415
B81C1/00039 » {Anchors} 35
B81C1/00047 » {Cavities} 150
B81C1/00055 » {Grooves} 14
B81C1/00087 » {Holes} 109
B81C1/00095 » {Interconnects} 132
B81C1/00103 » {Structures having a predefined profile, e.g. sloped or rounded grooves} 100
B81C1/00111 » {Tips, pillars, i.e. raised structures } 264
B81C1/00119 » {Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems} 265
B81C1/00126 » {Static structures not provided for in groups to } 62

Recent Application in this class:

20240411057

PROCESS FOR MANUFACTURING A THREE-DIMENSIONAL STRUCTURE IN BENDING

20220063992

Micro-nano incremental mechanical surface treatment method

20200224791

Micro fluid actuator

20160152465

MEMS capacitive pressure sensors

20150008543

MEMS capacitive pressure sensors and fabrication method thereof

20130319138

Microelectromechanical sensor for measuring a force, and corresponding method